Compal Electronics reported non-PC revenue reaching 35% of Q1 2026 revenue, targeting a 40% annual increase driven by a server surge in 2Q26. This shift in product mix indicates a strategic pivot towards server manufacturing, which may impact inventory dynamics and margin pressures for suppliers.
Texas Instruments plans to fab 95% of its ICs in-house by 2030, investing $60 billion in seven new fabs. This vertical integration strategy aims to secure supply amidst booming demand from data centers and industrial markets, which saw 90% and 30% YoY revenue growth respectively.
SMIC founder Richard Chang notes that 80% of semiconductor demand lies outside advanced nodes, favoring niche markets. TrendForce reports customers in HV processes and CIS are migrating to Chinese foundries since H2 2025 due to Taiwanese capacity shifts and price hikes. Bullish for SMIC's mature node capacity and pricing as demand for 90nm+ wafers surges.
Samsung is accelerating the construction of the final production line at its Pyeongtaek campus, a major capacity expansion project driven by AI-driven memory demand exceeding expectations. Bearish: Increased supply from capacity expansion may exert downward pressure on prices.
Goertek is investing an additional $20 million in Bac Ninh, Vietnam, to expand its camera production capacity. This move reinforces Vietnam's role in the global supply chain. The capacity expansion suggests increased supply, which is bearish for prices.
Larsen & Toubro (L&T) has launched a new industrial electronics manufacturing business, L&T Electronic Products & Systems (LTEPS), with two initial production lines in Coimbatore. The move aims to deepen L&T's technology portfolio and support India's self-reliance in electronics manufacturing. Neutral: This is a long-term capacity addition in a niche B2B segment with no immediate, direct impact on component pricing or supply.
Air Products will build, own, and operate gas facilities for Samsung's new Pyeongtaek fab, supplying nitrogen, oxygen, argon, and hydrogen starting 2028. This marks Air Products' largest semiconductor investment to date. Bearish: Increased supply capacity for industrial gases.
Samsung Foundry secured an order for optical modules and plans mass production in the second half of 2026, targeting the growing CPO market for AI data centers. This follows TSMC's similar moves and highlights the shift from copper to optical interconnects.
Bosch launched its third-generation SiC chips and announced a massive $5 billion investment to expand production capacity. The company aims to meet rising EV demand using advanced 200mm wafer technology. Bearish: The significant capacity expansion signals potential oversupply pressure on SiC prices in the medium term.
Honeywell plans to expand F124 jet engine manufacturing in Phoenix starting 2027, producing over 400 units over the next 13 years for the US Navy UJTS program. This capacity increase supports the Beechcraft M-346N trainer fleet. The expansion is neutral for spot pricing as it addresses future supply needs.
SK hynix deployed 2,000 Nvidia Blackwell GPUs at its Cheongju campus to power internal AI operations and digital twins. This investment aims to secure sensitive data and optimize production processes. Bullish for SK hynix's AI infrastructure and Nvidia's AI chip demand.
SK hynix broke ground on its P&T7 advanced packaging and test facility in Cheongju, investing 19 trillion won with phased completion through 2028. The facility is dedicated to AI memory, including HBM, and will add 150,000 sqm of cleanroom space. Neutral: This long-term capacity expansion plan addresses future AI demand but has no immediate impact on current supply or pricing.
Samsung Electronics is reportedly increasing GDDR6 production for Tesla starting April 2026, while simultaneously halting mass production plans for its next-generation 1d DRAM due to insufficient yields. This represents a strategic reallocation of capacity within Samsung's memory portfolio, prioritizing a specific, high-demand customer over a next-gen node. Watch: Mixed supply signals; GDDR6 supply for Tesla may tighten, but broader DRAM capacity constraints could ease slightly due to the 1d DRAM delay.
CXMT is allocating 40% of its capacity to LPDDR4X production to address a supply gap created by Samsung's planned phase-out. This shift occurs amid tightening supply and rising memory costs, with the remaining 60% of CXMT's capacity focused on advanced DDR5/LPDDR5. Bullish: This capacity reallocation to a legacy node may tighten supply for advanced nodes and support prices for LPDDR4X amid high demand.
SK hynix broke ground on its first U.S. advanced packaging plant in Indiana, targeting 2H28 production of HBM4E and HBM5 with a $3.87 billion investment. The company is simultaneously expanding domestic capacity in Cheongju and ramping up DRAM production with new EUV tools. Impact: Bearish for spot prices due to increased future supply.
Avnet will close its Poing logistics center by end-2026, affecting 350 jobs, due to prolonged weak demand for electronic components, particularly in automotive and manufacturing. The company cites subdued business expectations and will consolidate EMEA operations into its Bernburg and Tongeren sites. Bearish: Consolidation signals sustained demand weakness in core industrial sectors, potentially easing logistics bottlenecks but reflecting broader market softness.
Samsung Electronics and SK Hynix are accelerating NAND Flash capacity expansion plans, driven by surging AI and data center demand. This marks a shift from years of investment restraint in the memory sector. Bearish: Increased supply from major producers could moderate future price gains.
Intel-backed 3D Glass Solutions (3DGS) has broken ground on India's first advanced 3D packaging facility, targeting 69,600 glass panel substrates annually. The project, backed by Intel Capital and Lockheed Martin, aims to produce glass interposers and 3D heterogeneous integration modules for defense and AI applications.
This capacity expansion signals a shift in the advanced packaging supply chain but may introduce long-term price pressure.
3D Glass Solutions (3DGS) is investing $21 million to build an advanced 3D packaging facility in India, targeting AI and data center sectors with a 2028 commercial launch.
Japan approved a $378m subsidy for Sony to expand its Kumamoto image sensor fab, with a total investment of $1.14bn. The new plant aims for 10k wpm capacity starting May 2029. This capacity expansion signals potential future supply growth.
Whose chips are really inside the hottest new products? We open them up and show you, one part at a time.
iPhone DuoFirst-pass BOM: 37 parts, 12 brands and 16 public MPNs; A20 Pro, C2, N1 and the power/RF chains are located, while the NAND brand stays unconfirmed.See the full teardownAll teardowns| Analog | $0.68 | −5.9% |
|---|---|---|
| Connector | $0.75 | +0.2% |
| CPU | $386.74 | −21.3% |
| DDR4 | $88.40 | −0.2% |
| DDR52026-W13 | $14.89 | −11.2% |
| GPU | $478.20 | +8.2% |
| MCU | $0.68 | −61.7%Unusual |
| MLCC | $0.01 | +54.0%Unusual |
| MOSFET | $0.12 | −82.8%Unusual |
| PMIC2026-W13 | $0.44 | −12.5% |
| SSD/HDD | $288.43 | n/a |