iPhone Duo chips: 37 parts, 12 brands (first-pass BOM)
The iPhone Duo is Apple's first foldable iPhone. This first-pass BOM covers 12 modules, 37 parts and 12 brands: A20 Pro, the C2 5G modem, the N1 Wi-Fi 7 module, PMICs, charging, audio and the RF front end are all located via iFixit's Chip ID. 16 public MPNs are searchable; Apple-internal numbers are labelled separately.
Data updated: · rev 2026-10-30.5 · Method and sources
Scope: A = checkable in iFixit's Chip ID/teardown photos; B = marked likely/possibly by iFixit; public MPNs and Apple-internal numbers are listed separately, and the unconfirmed NAND brand is not guessed.
3D module view
Drag to rotate · scroll to zoom · click a module; the model is a structural illustration, not a scan.
Loading the 3D model…
Drag to rotate · scroll to zoom · click a module; the model is a structural illustration, not a scan. · 37 parts
Key specifications
Only facts checkable in public material or teardowns; public reports and teardown-confirmed values are labelled separately.
Form factorPublic material
Apple's first foldable iPhone
Launch / releasePublic material
2026-09-09 / 2026-10-23
MemoryPublic reports; not yet confirmed by teardown
12GB RAM
BatteryTeardown-confirmed
Dual cell 2,962 + 1,921 = 4,883mAh
Logic boardFirst unstacked iPhone board since iPhone 8
Single-layer main board + separate I/O board
RepairabilityInner display and hinge are the main risks
iFixit provisional 5/10
Repairability and structure
Checkable conclusions from public teardowns and iFixit; not a substitute for a full service manual.
- The inner display and hinge are the main repair risks; iFixit's provisional score is 5/10.
- The outer display comes off intact, lowering replacement cost.
- The USB-C port is modular and can be replaced on its own.
- A single-layer main board plus a separate I/O board keeps the foldable thin.
12-module map
11 modules have located parts; the hinge module is still pending.
First-pass BOM (37 parts)
16 public MPNs; Apple-internal and module numbers are listed separately and never mixed.
| Part / identifier | Type | Brand | Category | Role | Buyable | Grade |
|---|---|---|---|---|---|---|
| A20 ProPackage pending | Platform name | Apple | SoC / application processor | Apple A20 Pro applications processor with stacked memory; board marking APP980 3352652. | Not directly buyable | A |
| APL1117 / 343S00943Package pending | Apple-internal | Apple | Baseband / cellular modem | Apple C2 5G modem for 5G/LTE and eSIM. | Not directly buyable | A |
| 256 GB NANDPackage pending | Module number | 未披露 | NAND flash | On-board 256GB NAND flash; iFixit's chip ID does not name the brand. Community sysdiagnose reports SK hynix QLC on the 1TB model, which cannot be extrapolated to 256GB. | Not directly buyable | A |
| 339M00482Package pending | Module number | Apple / USI | Wi-Fi 7 / Bluetooth 6 module | Wi-Fi 7 + Bluetooth 6 combo module containing the Apple N1 wireless chip. | Not directly buyable | A |
| PN800Package pending | Public MPN | NXP Semiconductors | NFC controller | NXP PN800 NFC controller for near-field communication and secure-element paths. | Searchable | A |
| USI UWB (Apple U2)Package pending | Module number | USI / Apple | UWB module | USI-packaged UWB module containing the Apple U2 ultra-wideband chip. | Not directly buyable | A |
| APL106B / 338S01447Package pending | Apple-internal | Apple | Power management IC | One of the Apple main power-management ICs on the front of the logic board. | Not directly buyable | A |
| APL109H / 343S00993Package pending | Apple-internal | Apple | Power management IC | Apple power-management IC on the back of the logic board. | Not directly buyable | A |
| APL106I / 338S01452Package pending | Apple-internal | Apple | Power management IC (likely) | Apple power-management IC on the daughterboard back, marked likely by iFixit. | Not directly buyable | B |
| STPMIA3APackage pending | Public MPN | STMicroelectronics | Power management IC (possibly) | ST power-management IC marked possibly by iFixit. | Searchable | B |
| LM3638Package pending | Public MPN | Texas Instruments | DC-DC converter (likely) | TI DC-DC converter marked likely by iFixit. | Searchable | B |
| TPS259482APackage pending | Public MPN | Texas Instruments | 8A eFuse / bidirectional power | TI 8A eFuse with bidirectional power delivery. | Searchable | A |
| TPS22915BWCSP-4 (YFP), 0.74 × 0.74 mm | Public MPN | Texas Instruments | 2A load switch | TI 2A, 37mΩ load switch. | Searchable | A |
| 338S01392Package pending | Apple-internal | Apple | DC-DC converter | Apple-internal DC-DC converter. | Not directly buyable | A |
| TLV4031R1YKARDSBGA-4, 0.73 × 0.73 mm | Public MPN | Texas Instruments | Comparator with reference | TI comparator with integrated reference. | Searchable | A |
| MAX11390APackage pending | Public MPN | Analog Devices | ADC | ADI analog-to-digital converter for voltage/current monitoring. | Searchable | A |
| BRCC008GWZ-5WLCSP | Public MPN | Rohm | 1kB serial EEPROM | Rohm 1kB serial EEPROM. | Searchable | A |
| DC-DC（型号未标注）Package pending | Brand only | Richtek | DC-DC converter | Richtek DC-DC converter; iFixit does not list a specific part number. | Not directly buyable | A |
| DC-DC（型号未标注）Package pending | Brand only | onsemi | DC-DC converter | onsemi DC-DC converter; iFixit does not list a specific part number. | Not directly buyable | A |
| CP3201A0Q5Package pending | Public MPN | Texas Instruments | Battery charger | TI battery charger marked CP3201A0Q5; the CP series is often Apple-specific. | Not directly buyable | A |
| CP3201A0P5Package pending | Public MPN | Texas Instruments | Battery charger | TI battery charger on the daughterboard; the CP series is often Apple-specific. | Not directly buyable | A |
| BCM59367A1IUBGPackage pending | Public MPN | Broadcom | Wireless charging receiver controller | Broadcom wireless charging receiver controller. | Searchable | A |
| CBTL1701B0Package pending | Public MPN | NXP Semiconductors | USB Type-C port controller | NXP USB Type-C port controller. | Searchable | A |
| TPS65659A0Package pending | Public MPN | Texas Instruments | Display power supply | TI display power supply for the inner and outer displays. | Searchable | A |
| CP5100A0Package pending | Public MPN | Texas Instruments | LED flash driver | TI LED flash driver; the CP series is often Apple-specific. | Not directly buyable | A |
| 338S01268Package pending | Apple-internal | Apple / Cirrus Logic | Audio codec | Apple/Cirrus Logic audio codec. | Not directly buyable | A |
| 338S01377Package pending | Apple-internal | Apple / Cirrus Logic | Audio amplifier | Apple/Cirrus Logic audio amplifier. | Not directly buyable | A |
| 338S01267Package pending | Apple-internal | Apple / Cirrus Logic | Haptic driver | Apple/Cirrus Logic haptic driver. | Not directly buyable | A |
| APL1088 / 338S01421Package pending | Apple-internal | Apple | RF transceiver | Apple RF transceiver. | Not directly buyable | A |
| APL1087 / 338S01410Package pending | Apple-internal | Apple | 5G mmWave IF transceiver (likely) | Apple 5G mmWave IF transceiver marked likely by iFixit. | Not directly buyable | B |
| 339M00604Package pending | Apple-internal | Apple | 5G mmWave front-end module (likely) | Apple 5G mmWave front-end module marked likely by iFixit. | Not directly buyable | B |
| AFEM-8283Package pending | Public MPN | Broadcom | RF front-end module | Broadcom RF front-end module. | Searchable | A |
| AFEM-8274Package pending | Public MPN | Broadcom | RF front-end module | Broadcom RF front-end module. | Searchable | A |
| SKY58540-21Package pending | Public MPN | Skyworks | RF front-end module | Skyworks RF front-end module. | Searchable | A |
| SKY58562Package pending | Public MPN | Skyworks | RF front-end module (likely) | Skyworks RF front-end module marked likely by iFixit. | Searchable | B |
| QM81026APackage pending | Public MPN | Qorvo | Envelope tracker | Qorvo envelope tracker for RF power amplification. | Searchable | A |
| 加速度计 + 陀螺仪（型号未标注）Package pending | Brand only | Bosch Sensortec | Accelerometer / gyroscope | Bosch Sensortec six-axis sensor; iFixit does not list a specific part number. | Not directly buyable | A |
Modules and functional blocks
Public teardowns label functions, not part numbers; only checkable identifiers enter the table above.
| Module | Functional blocks in public teardowns | Pending items | Status |
|---|---|---|---|
| A20 Pro SoC | Board marking / platform name in the table above | 0 | Parts located |
| C2 modem | Board marking / platform name in the table above | 0 | Parts located |
| NAND flash | On-board NAND flash | 1 | Parts located |
| Wi-Fi / Bluetooth | Wi-Fi / Bluetooth combo chip | 0 | Parts located |
| Power management | Main PMIC; Charging IC; Display PMU; Camera PMU | 0 | Parts located |
| Charging and battery management | Charging IC; Battery connector; Fuel gauge | 0 | Parts located |
| Display and touch | Display PMU; Display IC; Touch path | 0 | Parts located |
| Camera | Camera PMU; Image-sensor interface | 0 | Parts located |
| Audio | Audio codec; Audio IC; Speaker amplifier | 0 | Parts located |
| RF front end | RF transceiver; RF TX/RX; RF power manager; WLAN PA; Wi-Fi downlink PA; Mid/high-band PA; High-band diversity receiver; Composite antenna switch | 0 | Parts located |
| Sensors | Hall sensor; Ambient light sensor; Proximity sensor | 0 | Parts located |
| Hinge and crossing flex | Fold hinge; Cross-display flex; Support structure | 1 | Supplier reported, part number pending |
Sourcing impact framework
This is not a BOM; it is the field checklist to verify once board photos arrive. Without these fields, quotes are not comparable. Priorities are an editorial judgement based on sourcing impact.
- 16 public MPNs are confirmed and searchable at manufacturers or distributors; Apple-internal APL/338S/343S numbers cannot be quoted directly.
- All five P0 modules now have located parts; the NAND brand and the hinge part number remain the gaps.
- Next: add package, substitute and public pricing data, then open the comparison path.
| Module | Priority | Fields to verify | Why it affects sourcing | Current status |
|---|---|---|---|---|
| A20 Pro SoC | P0 | Apple internal part number, package, foundry node | The main SoC drives board layout, thermals and device performance | 1 parts |
| C2 modem | P0 | C2 part number, modem version, band combinations | Determines 5G/eSIM certification and RF-front-end matching | 1 parts |
| NAND flash | P0 | Brand, capacity, NAND generation, package | NAND price swings flow straight into BOM cost | 1 parts |
| Power management | P0 | Main PMIC brand/MPN, rail count, package | Power sequencing and lead time affect assembly | 13 parts |
| RF front end | P0 | PA, switch and filter brands and bands | Many RF parts, hard substitution, long certification | 8 parts |
| Wi-Fi / Bluetooth | P1 | Combo chip brand, Wi-Fi generation, package | Connectivity specs affect certification and antenna design | 3 parts |
| Charging and battery management | P1 | Charging IC, fuel gauge, battery connector | Fast-charge protocol and safety certification | 4 parts |
| Display and touch | P1 | Display PMU/driver IC brand, resolution | Foldable display supply is concentrated; little substitution room | 1 parts |
| Camera | P1 | CAM PMU, sensor model, module maker | Camera modules drive premium and allocation | 1 parts |
| Hinge and crossing flex | P1 | Hinge supplier, cross-display flex layer count | The hinge is central to yield and repair cost | Supplier reported, part number pending |
| Audio | P2 | Codec, audio IC, speaker amplifier | Relatively generic parts with more substitutes | 3 parts |
| Sensors | P2 | Hall, ambient-light and proximity sensor models | Low value but shortages can stall assembly | 1 parts |
Timeline
- Apple announces iPhone Duo
- Retail release
- First public teardowns (iFixit, REWA)
- NuAxi first-pass chip map v1
- v3: identifier scope, method and functional blocks
Method comparison with the Model Y teardown
The same public-teardown reconciliation method; the two pages differ in evidence maturity, not in method.
| Metric | Tesla Model Y | iPhone Duo |
|---|---|---|
| Modules | 23 | 12 |
| Confirmed parts / identifiers | 130 | 2 |
| Purchasable MPNs | 120 | 0 |
| Grade-A evidence | 31 | 2 |
What evidence is still missing
This list sets what the next revision can add; part numbers without evidence are not published.
- High-resolution photos of both board sides (public teardown)Available
- Readable markings under the shieldsPending
- Service manual / schematicsPending
- Line-by-line check of readable laser codesPending
- Supplier cross-checkPending
- Purchasable MPN for every modulePending
Revision history
- 2026-10-30.3Added key specs, 31 functional blocks, timeline, method comparison, evidence checklist and the JSON dataset
- 2026-10-30.2Fixed identifier/MPN semantics, provenance wording, caching and the social card
- 2026-10-30.1First-pass chip map: 12 modules, 2 checkable identifiers
Method and evidence grades
NuAxi does not disassemble devices. This page reconciles iFixit's iPhone Duo Chip ID (2026-10-29) and iFixit teardown (2026-10-24) line by line; Apple-internal numbers, module numbers and public MPNs are kept separate. Per product policy, URLs are not listed individually.
- A = checkable in iFixit's Chip ID / teardown photos
- B = marked likely/possibly by iFixit, pending a second source
Public teardown references: iFixit, REWA, MacRumors and Apple specifications; per product policy, URLs are not listed individually. Teardown method and evidence grades · Download the dataset (JSON)
FAQ
Which chips are inside the iPhone Duo?
The first-pass BOM lists 37 parts: A20 Pro, the C2 5G modem, the N1 Wi-Fi 7 module, Apple PMICs, TI charging/power, Cirrus Logic audio, Broadcom/Skyworks/Qorvo RF front end and more. 16 are public MPNs.
Which part numbers can be purchased?
16 public MPNs are searchable at manufacturers or distributors, including TPS259482A, TPS22915B, BCM59367A1IUBG, AFEM-8283, SKY58540-21, QM81026A, MAX11390A and BRCC008GWZ-5. Apple's APL/338S/343S numbers are internal and cannot be purchased directly.
Who supplies the NAND?
iFixit's Chip ID lists a 256GB NAND without a brand. Reported 256GB NAND suppliers for iPhone 18 Pro are Kioxia, SK hynix and SanDisk, but that cannot be extrapolated to the Duo. Community sysdiagnose reports SK hynix QLC on the 1TB model. The brand stays unconfirmed here.
Who makes the hinge?
Media supply-chain reports point to Amphenol and a Foxconn/Shinagawa joint venture (about 65% share), not confirmed by Apple. The page treats them as grade-B supplier leads; the part number is still pending.
Why are some entries grade B?
iFixit marks some parts as likely/possibly (for example STPMIA3A, LM3638, APL1087). They stay grade B until a second source confirms them.
What is the logic-board design?
A single-layer main board plus a separate I/O board, the first unstacked iPhone logic board since the iPhone 8, used to keep the foldable thin.
What is the battery capacity?
Two cells: 2,962mAh (11.56Wh) and 1,921mAh (7.5Wh), for 4,883mAh total; electrically activated adhesive makes removal easier.
How repairable is it?
iFixit's provisional score is 5/10, the highest it has given a foldable; the inner display and hinge remain the main risks, while the outer display comes off intact and the USB-C port is modular.
Where does the page data come from?
iFixit's iPhone Duo Chip ID (2026-10-29) and iFixit teardown (2026-10-24); NuAxi does not disassemble devices. See “Teardown method and evidence grades” for the full policy.
Why does Model Y have 130 parts while iPhone Duo has 37?
Both pages use the same method but sit at different evidence maturity: Model Y has 130 parts and 120 MPNs, while the first-pass iPhone Duo BOM has 37 parts and 16 public MPNs. The difference is evidence, not method.
Will the page be updated?
Yes. Part numbers will be added when board photos, service documentation or readable markings become available. Current revision: 2026-10-30.5.