Radiant Opto-Electronics, a major backlight module maker, is expanding into new businesses and targeting next-generation optical communications architecture, particularly co-packaged optics (CPO) applications above 6.4T. Chairman and General Manager Yu-Chao Wang said the company plans to provide samples to selected customers in 2027 and could enter mass production as early as 2028. The plan remains at the planning stage; the 2027 sample provision and 2028 mass production are stated plans/targets, not achieved results.
According to its third-quarter 2026 earnings report, Renesas Electronics expects strong demand for AI data centers, industrial applications, and automotive semiconductors to drive its 2026 revenue to JPY1.6668 trillion (US$10.55 billion), up 26.4% year-over-year, with its operating margin rising to 33.2%. These figures are company expectations/targets, not achieved results.
AI data center semiconductorsindustrial semiconductorsautomotive semiconductorsRenesas ElectronicsDigiTimes Asia
Danisense has introduced a high-precision current transducer designed for isolated DC and AC current measurement in PCB-mounted power electronics. The source does not state pricing, availability timing, capacity, or a cause for the announcement.
high-precision current transducerDanisenseElectronic Design
According to a Blocks & Files report published Friday 30 Oct 2026, Samsung almost reported its first-ever ₩200 trillion quarterly revenues in its third 2026 quarter, with revenues of ₩195.3 trillion ($145.5 billion), up 121.8 percent Y/Y, and an operating profit of ₩107.4 trillion ($80 billion), making Samsung Electronics the world's first tech company to exceed ₩100 trillion ($74.5 billion) in quarterly operating profit. The report attributes this to soaring AI demand for HBM, DRAM and NAND enabling high prices for its semiconductor technology. The DS (Device Solutions) semiconductor business accounted for 72 percent of Samsung Electronics' revenues in the quarter, at ₩147 trillion ($109.6 billion), up 15 percent Q/Q; within that, memory at ₩140.7 trillion ($104.8 billion) accounted for 95.7 percent, achieved by ramping up HBM4 sales and meeting demand for server SSDs. Samsung said strong demand momentum for servers led to higher market prices across all applications. Competitor SK hynix reported revenues of ₩104 trillion ($78.9 billion) in its third 2026 quarter, with a ₩39.8 trillion (c$30 billion) profit, less revenue and profit than the directly comparable Samsung DS division. Samsung says investments are planned for new fabs and other infrastructure to meet strong AI and HPC demand, and it intends to further increase HBM, server DRAM, and SSD sales, specifically increasing supply of high-speed server DDR5 product and QLC SSDs. Samsung expects AI infrastructure capital expenditure to reach a historic level in 2027, greater than this year, and states that 'AI-driven demand will far exceed the industry supply in comparison with 2026.' These are reported results and company outlook, not achieved future outcomes.
Advanced Energy Industries announced at the 2026 Open Compute Project (OCP) Global Summit that it has added three units to its M-CRPS power supply range, delivering up to 3600 W of output power and power density exceeding 100 W/in³, targeting AI data centers, enterprise computing, storage, networking and telecommunications systems requiring compact, high-capacity power conversion. The new products comprise the 3600 W CSU3600AT-9-3M0 and two 3200 W models, the CSU3200AT-3-6M0 and CSU3200ADC-3-3M0. The CSU3600AT-9-3M0 is an AC-input power supply designed for 54 V architectures; the CSU3200AT-3-6M0 provides a 12 V output for AI computing and data center applications; both AC-input models are certified to the 80 PLUS Titanium efficiency standard. The CSU3200ADC-3-3M0 is designed for DC-input systems, delivers 3200 W at 12 V, targets low-voltage DC-powered telecommunications equipment using OCP +48 V busbars, and achieves a peak efficiency of 94% according to Advanced Energy. Power density reaches up to 112 W/in³ for 12 V and 54 V architectures; the series highlights thermal performance, reliability, ultra-fast transient response, and cybersecurity and firmware security features. This is a product launch/planned expansion announcement, not a price movement or a confirmed capacity change.
M-CRPS power supplyCSU M-CRPS SeriesAdvanced Energy IndustriesPower Electronics News
Murata plans to invest about JPY 1 trillion (about EUR 5.7 billion) over five years, from fiscal 2026 to fiscal 2030, to expand its global production capacity for multilayer ceramic capacitors (MLCCs), and expects MLCC sales in fiscal 2030 to be at least double those of fiscal 2025. According to Murata's press release, roughly JPY 350 billion is for buildings and JPY 650 billion for production equipment, directed at new production buildings at existing sites in and outside Japan, new equipment, upgrades to existing lines and some land purchases. Murata says the expansion is aimed at growing demand from data centres in the near term, while also building the production base it will need after 2030, when it expects AI to have spread into edge devices, mobility and robotics. The largest project disclosed so far is in Okayama Prefecture: Okayama Murata Manufacturing in Setouchi will become the company's third MLCC production site in Japan, alongside Fukui Murata Manufacturing and Izumo Murata Manufacturing. Murata will put about JPY 150 billion (about EUR 850 million) into two new buildings there — an MLCC production building with construction starting in April 2027 and completion planned for the end of 2028, and a building for MLCC sheets and raw materials due in 2030 — and aims to employ 1,500–2,000 people in Okayama by then. Izumo Murata will also build a new plant for electronic components, including MLCCs, in Yasugi, Shimane Prefecture, though neither the timing nor the investment has been decided. Outside Japan, the plan includes a new production building at Murata Electronics (Thailand) due for completion in 2030 and new equipment and infrastructure in an unused part of an existing building in the Philippines by 2027, with investment amounts for both to be announced later; Murata will also add equipment and capacity yearly at existing plants in Japan, ASEAN and China without disclosing individual plans. Murata has not said how the remaining roughly JPY 850 billion will be split between its sites.
Power Electronics News published a roundup of this week's must-read articles covering Wafer-Level Burn-In Improves WBG Device Reliability, Automotive and Aerospace WBG Device Testing, and Direct Dielectric Cooling for Power Converters. Items include: wafer-level burn-in screens SiC and GaN devices for infant mortality failures before packaging, improving module yields and reliability; direct dielectric cooling brings insulating liquid closer to SiC/GaN devices, shortening thermal paths but complicating insulation design; and WBG device test methodologies covering dynamic characterization, short-circuit ruggedness, thermal cycling, and gate oxide reliability. Other items: Infineon and NVIDIA advance GaN-based intermediate bus converters to improve power density and efficiency in 800 VDC AI data centers; Enphase and Infineon are integrating 900 V GaN bidirectional switches into SST systems designed for AI data center power conversion; Vertical Semiconductor targets $73M in proposed CHIPS funding to advance vertical GaN transistors aimed at improving AI data center power efficiency and density (proposed); Murata developed the world's smallest 008004-inch NTC thermistor, with the NCU01 series maintaining ±1% resistance and B-constant tolerances, initial samples planned for October 2026 and production in 2027; Flex completed the EPC Power acquisition, adding more than 15 GW of deployed power conversion technology and strengthening grid stabilization and backup power capabilities; SemiQ launched 750 V and 1200 V Gen4 SiC MOSFETs. The source is a news roundup and provides no price movement data.
SiC devicesGaN devicesvertical GaN transistorsInfineon, NVIDIA and 8 totalPower Electronics News
TDK Corporation (TSE:6762) has launched the TDK-Lambda EDC series of programmable DC-DC power supplies, developed to support growing demand for DC-grid architectures as the use of renewable energy sources and battery storage increases. The compact, high-power series includes 1.5 kW and 3 kW models with constant-voltage (CV) and constant-current (CC) operation; up to three units can be connected in series and up to ten in parallel for scalable system integration. Features include leader/follower functionality, RS-485 (Modbus RTU) communication with remote monitoring and diagnostics, programmable CV/CC control, automatic ID assignment, and analog programming via 1–5 V and 4–20 mA interfaces, in a compact 270 × 150 × 61 mm enclosure. Main applications include hydrogen generators, high power battery chargers, switchgear for distribution boards in data centers, and solid oxide fuel cell systems. The article also notes that TDK posted total sales of USD 16.6 billion in fiscal 2026 and employed about 107,000 people worldwide.
programmable DC-DC power suppliesTDK Corporation, TDK-Lambda CorporationEE Journal
Reported on October 30, 2026: Wolfspeed has announced a multi-year supply agreement for Wolfspeed silicon carbide devices to support BorgWarner's next-generation 800V silicon carbide-based inverter platform, with Wolfspeed acting as a strategic partner. According to a press release, the agreement is designed to provide BorgWarner with consistent, uninterrupted access to Wolfspeed silicon carbide devices and strengthens the companies' longstanding collaboration for next-generation EV and power conversion applications. BorgWarner is leveraging Wolfspeed's 1200V silicon carbide technology for its 800V inverter platform, and Wolfspeed's Gen 5 silicon carbide technology is designed to support the efficiency, performance and reliability requirements of next-generation automotive power electronics. Wolfspeed also cited its scaled 200 mm manufacturing capabilities. The source does not state deal value or supply volumes.
SemiQ Inc. has announced its fourth-generation QSiC™ silicon carbide (SiC) power devices, including 1200 V and 750 V MOSFETs and bare dies, and the devices are available immediately. Gen4 technology uses an optimized cell topology with a 36% reduction in cell pitch, along with refinements to JFET and P-well implantation, delivering a reported 23% reduction in specific on-resistance compared with previous generations. The 1200 V devices achieve a 21% reduction in drain-source on-resistance (RDS(on)) compared with Gen3, from 14 mΩ to 11 mΩ; total switching energy is reduced by more than 11%, from 1,677 µJ to 1,491 µJ, while retaining the same 5 × 5 mm die size as the previous-generation 1200 V devices. The newly introduced 750 V SiC MOSFET offers an RDS(on) of 9 mΩ and a total switching energy of 871 µJ. The Gen4 MOSFET dies undergo wafer-level gate-oxide burn-in screening at voltages exceeding 1,400 V for the 1200 V devices and 800 V for the 750 V devices, and both device types are avalanche-tested to 800 mJ. The MOSFETs are available in a four-pin TO-247-4L package and as bare dies. SemiQ plans to showcase the Gen4 portfolio at Electronica 2026, scheduled for November 10–13, at Alfatec's booth A6.620. Target applications include electric vehicle charging infrastructure, solar inverters, high-voltage DC/DC and DC/AC converters, switch-mode power supplies, uninterruptible power supplies, induction heating, welding equipment and motor drives. The source does not state the cause beyond the product announcement itself.
SiC MOSFETsbare diesSemiQ Inc.Power Electronics News
Micron announced that about 700 eligible employees in Taiwan will receive five years' worth of salary in bonuses as three bonuses are paid in a single payout; according to Digitimes this covers roughly 17% of the more than 4,300 production-line employees at Micron Taiwan, while the remaining staff will also receive three bonuses in October. The lump-sum payout consists of an annual performance bonus estimated at 7.5 to 12.5 months of salary for the majority of workers, a mass-production bonus of 20% of annual salary, and a one-time $31,000 (NT$1,000,000) appreciation bonus prorated for employees with less than a full year of service. Micron workers across the globe also expect a new quarterly profit bonus paid 50% in cash and 50% in stock, starting January 2027, with the first one paid 100% in cash. The source states this is a direct effect of the AI-driven memory chip boom, which brought Micron, Samsung and SK hynix massive orders from AI hyperscalers and record profits; Samsung workers voted to accept a $340,000 average bonus in May 2026, while SK hynix workers are set to receive $477,000 in bonuses this year, potentially growing to almost $900,000 in 2027. Meanwhile, the Micron Taoyuan union remains in a pay dispute with management: some officials have launched a one-day strike demanding clearer profit-sharing arrangements and bonus terms, nearly 70% of Taoyuan members turned down management's latest offer, and the two sides are tentatively set to meet again on November 6; the Micron Taichung union has already agreed to a 10% employer's pension contribution and a tripling of the day-shift allowance. The article notes that reliance on performance and profit bonuses means these incentives could fall sharply if AI demand declines and the demand cycle normalizes.
According to a Reuters report, the US Federal Communications Commission (FCC) has voted to bar all Chinese labs from testing electronic devices such as smartphones, cameras and computers for use in the US. The prohibitions are slated to take effect in December 2028 and will bar test labs and certification bodies in countries including China that deny reciprocal treatment to US-based test labs. FCC Chairman Brendan Carr said these labs are a critical gateway into American communications infrastructure and that their privileged role gives them access to sensitive and confidential information about electronic products often months before the devices enter the market. In 2025, the FCC banned testing of US electronics by labs owned or controlled by the Chinese government.
On Oct. 29, Samsung Electronics announced third-quarter results: revenue of 195.3 trillion won, up 127% year-on-year, and operating profit of 107.4 trillion won, up 783% year-on-year, with an operating profit margin of 55%, making it the first global technology company to surpass 100 trillion won in quarterly operating profit; company-wide revenue and operating profit hit record highs for the fourth consecutive quarter, up 14% and about 20% from the previous quarter, respectively. The Device Solutions (DS) division, which oversees semiconductors and includes the memory, System LSI and foundry businesses, posted revenue of 147.1 trillion won (75.3% of the company total) and operating profit of 106.5 trillion won (99.2% of the total), with an operating profit margin of 72%; DS revenue rose 344% year-on-year and 15% quarter-on-quarter, while operating profit surged about 1,421% from a year earlier and about 19% from the previous quarter. Within DS, the memory business generated revenue of 140.7 trillion won, accounting for approximately 72% of Samsung Electronics' total revenue. The Device eXperience (DX) division, which handles smartphones and home appliances, posted revenue of 52.1 trillion won (up 8% both quarter-on-quarter and year-on-year) and an operating loss of 800 billion won, similar to the previous quarter, reversing from an operating profit of 3.5 trillion won a year earlier; the source attributes the loss to rising material costs. Samsung Display reported revenue of 8 trillion won (down 1% year-on-year, up 7% quarter-on-quarter) and operating profit of 1.1 trillion won (down about 8% year-on-year, up about 57% quarter-on-quarter). Harman posted revenue of 4.3 trillion won (up 9% year-on-year, down 5% quarter-on-quarter) and operating profit of 600 billion won (up about 50% both year-on-year and quarter-on-quarter).
Samsung Display reported its Q3 2026 results: according to Samsung Electronics' third-quarter earnings conference call on Oct. 29, Samsung Display recorded revenue of 8 trillion won and operating profit of 1.1 trillion won. Revenue declined approximately 1.2% and operating profit fell 8.3% year-on-year, while revenue increased 6.7% and operating profit rose 57.1% from the previous quarter. Shipments of small and medium-sized OLED panels increased following new product launches by major customers; small and medium-sized business revenue and profit both increased from the previous quarter, and the large OLED business improved earnings from the previous quarter through increased sales of premium products and cost reductions. Samsung Display expects panel demand to increase in the fourth quarter, supported by the year-end peak season and new product launches, though external factors such as exchange rate fluctuations could weigh on earnings improvements. The outlook for next year remains uncertain: rising demand for memory used in AI servers is pushing up mobile memory prices, increasing cost pressures on smartphone manufacturers. Samsung Electronics' Mobile eXperience (MX) and Networks businesses posted an operating loss of 600 billion won in the third quarter, their second consecutive quarterly loss; although foldable smartphone sales volumes and revenue increased year-on-year following launches such as the Galaxy Z Fold8, higher memory prices weighed on profitability. Samsung Display plans to increase the proportion of premium products including foldable displays, improve crease visibility and durability in foldable panels, and ramp up operations at its new eighth-generation 8.6 IT OLED production line; in large OLED it will focus on ultra-large TVs and gaming monitors while expanding its customer base into gaming consoles and automotive applications. Capital expenditure this year is expected to reach 3.9 trillion won, up 1.1 trillion won from last year, with cumulative investment through the third quarter totaling 2.4 trillion won. Heo Cheol said market uncertainty is expected to persist in 2027 with demand remaining weak, and the company will pursue productivity improvements and cost reductions to maintain profitability.
small and medium-sized OLED panelslarge OLED panelsfoldable displaysSamsung DisplayThe Elec
Shin Seung-cheol, vice president of Samsung Electronics' System LSI Business under its Device Solutions (DS) division, said during the company's third-quarter earnings conference call on Oct. 29 that the Exynos 2700 has improved AI and gaming performance and that development and mass production are proceeding without disruption, with Samsung expecting to further expand market share by continuously strengthening SoC competitiveness. According to Counterpoint Research, Samsung Electronics held a 9% share of the global smartphone AP market by shipment volume in the second quarter of this year, up 2 percentage points from 7% in the previous quarter and up 3 percentage points from a year earlier; the Exynos 2600, used in the Galaxy S26 series, drove the increase in shipments. The Exynos 2700, which recently entered mass production, has increased production volume 10% compared with the previous generation and has been confirmed for use in the new Pro model of the Galaxy S27 series, scheduled for release next year, in addition to the standard and Plus models for South Korea and Europe. Samsung's System LSI Business has also secured a new custom SoC project by establishing a business partnership with a new customer. The source does not state the cause.
Japanese semiconductor package substrate maker Ibiden plans to invest 1.28 trillion won to expand production capacity for high-performance semiconductor package substrates used in AI servers, aiming to meet growing demand for CPU package substrates. Ibiden's board of directors decided on Oct. 29 to expand capacity for high-performance IC package substrates for CPUs at Building No. 6 of its Gama plant in Gifu Prefecture, Japan; the new equipment will begin operations in phases from fiscal 2029. The company also plans to invest in overseas production facilities, but did not disclose the scale of the planned capacity increase. Ibiden expects CPU substrate demand to increase as AI inference workloads grow and agentic AI becomes more widespread. On Oct. 29, Ibiden also announced first-half fiscal 2026 results for the April-September period: revenue totaled 262.546 billion yen, up 34.3% year-on-year, and operating profit reached 60.116 billion yen, up 84.6% year-on-year. The electronics business, which produces semiconductor package substrates, drove the improvement, with segment revenue up 52% year-on-year to 172.54 billion yen and operating profit up 96.7% to 50.028 billion yen, reflecting stronger-than-expected orders for high-value-added products used in AI servers. Ibiden also raised its full-year fiscal 2026 forecast: revenue outlook increased by 2.7% to 565 billion yen from 550 billion yen, and operating profit forecast lifted by 4.7% to 133 billion yen from 127 billion yen, with expectations of continued solid demand for AI and general-purpose server products and growing demand for switch IC products.
high-performance semiconductor package substrates for CPUsIbidenThe ElecCapacity Change
Ateco, a back-end memory semiconductor equipment manufacturer, submitted an application for a preliminary Kosdaq listing review to the Korea Exchange on Oct. 28, pursuing a listing under the technology-based special listing program with Mirae Asset Securities and IBK Investment & Securities as lead underwriters; the program allows companies with recognized technological capabilities to go public even if they do not meet certain financial requirements including profitability, and the company plans to use listing proceeds to strengthen its product lineup. Ateco manufactures test handlers for automated memory semiconductor testing, with equipment used for HBM, LPCAMM and SOCAMM2; it began supplying SOCAMM2 test handlers in the first half of this year, its customers include Samsung Electronics and Micron, and SOCAMM2 modules tested using its equipment are used in Nvidia's Vera Rubin AI platform. The company faces financial difficulties: as of the end of last year it had negative equity, with total liabilities of approximately 43.1 billion won substantially exceeding total assets of about 27.5 billion won and total equity at negative 15.6 billion won; the shortfall stems from accumulated operating losses, with last year's revenue of approximately 12 billion won and an operating loss of about 10.9 billion won, revenue declining roughly 33% from approximately 18 billion won a year earlier while the operating loss widened about 24-fold from roughly 450 million won.
HBMLPCAMMSOCAMM2 test handlerAteco, Samsung Electronics and 4 totalThe Elec
Delta Electronics approved plans on October 28 to establish a large manufacturing base in Penang, Malaysia, as the power and thermal management company expands overseas production to support customer demand. The site is expected to ramp up to capacity comparable to that of Delta's Thailand operations over five years, with space reserved for process research and development and a potential future R&D center. The stated purpose is to support customer demand. The event is an approved plan and has not yet been implemented.
The US Federal Communications Commission (FCC) has adopted rules that will effectively bar Chinese laboratories from testing electronic devices intended for the US market. The move expands Washington's restrictions on Chinese technology companies and supply chains. The source does not state the cause.
Taiwan's semiconductor rise was built on a powerful division of labor: world-class IC design feeding increasingly advanced foundries, supported by packaging, testing, and an unusually dense electronics manufacturing base. According to the source, AI is forcing Taiwan's semiconductor ecosystem to compete at the system level rather than only at nanometer scale. The article provides no specific prices, companies, products, or dates, and serves as industry background.