Ibiden to Invest 1.28 Trillion Won in CPU Substrate Capacity

What happened

Japanese semiconductor package substrate maker Ibiden plans to invest 1.28 trillion won to expand production capacity for high-performance semiconductor package substrates used in AI servers, aiming to meet growing demand for CPU package substrates. Ibiden's board of directors decided on Oct. 29 to expand capacity for high-performance IC package substrates for CPUs at Building No. 6 of its Gama plant in Gifu Prefecture, Japan; the new equipment will begin operations in phases from fiscal 2029. The company also plans to invest in overseas production facilities, but did not disclose the scale of the planned capacity increase. Ibiden expects CPU substrate demand to increase as AI inference workloads grow and agentic AI becomes more widespread. On Oct. 29, Ibiden also announced first-half fiscal 2026 results for the April-September period: revenue totaled 262.546 billion yen, up 34.3% year-on-year, and operating profit reached 60.116 billion yen, up 84.6% year-on-year. The electronics business, which produces semiconductor package substrates, drove the improvement, with segment revenue up 52% year-on-year to 172.54 billion yen and operating profit up 96.7% to 50.028 billion yen, reflecting stronger-than-expected orders for high-value-added products used in AI servers. Ibiden also raised its full-year fiscal 2026 forecast: revenue outlook increased by 2.7% to 565 billion yen from 550 billion yen, and operating profit forecast lifted by 4.7% to 133 billion yen from 127 billion yen, with expectations of continued solid demand for AI and general-purpose server products and growing demand for switch IC products.

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Source and time

Source: The Elec · 10/29/2026 · View original source