NuAxiSemiconductor trade intelligence
[News] Intel-Backed Firm Breaks Ground on India’s 1st 3D Packaging Plant, Targeting ~70K Glass Substrates Annually
What happened
Intel-backed 3D Glass Solutions (3DGS) has broken ground on India's first advanced 3D packaging facility, targeting 69,600 glass panel substrates annually. The project, backed by Intel Capital and Lockheed Martin, aims to produce glass interposers and 3D heterogeneous integration modules for defense and AI applications. 关注 - This capacity expansion signals a shift in the advanced packaging supply chain but may introduce long-term price pressure.
Impact and signal
Medium impactImpact score: 65/100
Affected components and suppliers
Glass SubstratesGlass Interposers3DHI Modules
capacity_expansionglass_interposerindia_semiconductor_mission
Source and time
Source: TrendForce · 4/20/2026 · View original source
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