NuAxiSemiconductor trade intelligence
3DGS breaks ground on chip packaging unit in India
What happened
3D Glass Solutions (3DGS) is investing $21 million to build an advanced 3D packaging facility in India, targeting AI and data center sectors with a 2028 commercial launch.
Impact and signal
Medium impactImpact score: 60/100
Affected components and suppliers
3DHI modulesAdvanced 3D Packaging
3D Glass Solutions (3DGS)Heterogeneous Integration Packaging Solutions Pvt. Ltd.
capacity_expansionadvanced_packagingindia
Source and time
Source: Evertiq · 4/20/2026 · View original source
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