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[News] Chinese Semiconductor Equipment Manufacturers Draw in New Investment

What happened

iSABers secured 500M RMB for bonding equipment, while TBSTest raised 1.2B RMB for ATE. These investments bolster China's advanced packaging and testing capabilities.

Impact and signal

Medium impactImpact score: 65/100

Affected components and suppliers

Bonding EquipmentATEHybrid Bonding ToolsThermo-compression Bonding Equipment
iSABersTBSTest TechnologyAMECFortera CapitalBAIC CapitalInno Angel Fund
financingcapacity_expansionadvanced_packagingdomestic_equipment

Source and time

Source: TrendForce · 3/29/2026 · View original source

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