NuAxiSemiconductor trade intelligence
Hanmi Semiconductor speeds up HBM tool output and plants US flag as equipment shortage looms
What happened
Hanmi Semiconductor is accelerating the output of bonding equipment for HBM production, warning that demand will outstrip supply starting in 2027, creating a critical bottleneck for AI chip manufacturers like Micron and SK Hynix.
Impact and signal
High impactImpact score: 92/100
Affected components and suppliers
Bonding EquipmentHBM Equipment
shortagecapacityAI-chip
Source and time
Source: DigiTimes Asia · 7/19/2026 · View original source
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