NuAxi

TI AUTOMOTIVE · ENGINEERING GUIDES

From an application question to a specific part

13 guides turn device specifications into checkable selection steps. Establish roles and limits before checking exact OPNs.

BMS and measurement

Separate cell/pack sensing, isolation and communication before comparing channel count, accuracy conditions and migration effort.

Automotive power and supervision

From input envelope to multirail sequencing, verify voltage, current, thermals and the exact OPN.

Automotive power selection: LDO, DC/DC, PMIC and supervisor roles

Select TI automotive power devices by input envelope, load rails, thermal budget and sequencing. Separate converters, controllers, PMICs and supervisors without combining unrelated maximum ratings.

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12V/48V automotive power: operating input, transients and absolute maximum ratings

Use TI LDO, boost and wide-input buck examples to distinguish nominal bus voltage from pin stress. Check cold crank, load dump, reverse connection and thermals without treating survival limits as operating points.

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TPS6594-Q1 / LP8764-Q1: OPN, NVM and power-sequence checklist

A joint engineering/procurement checklist for exact PMIC orderables, default voltages, phases, startup sequence and fault behavior. Same family or package does not establish identical NVM, and suffixes are not a configuration decoder.

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Automotive protection switches: load limits, reverse blocking and energy budgets

Separate TPS1HB16/TPS2HB16 smart high-side switches from the LM7480 external-MOSFET controller, reviewing A/B/F current limits, reverse paths, hot losses, inrush and recovery.

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High-side switch thermal and line-fuse coordination: from thermal feedback to fault clearing

Coordinate hot RON, board-level thermal resistance, transient thermal impedance, dual-channel coupling and harness/fuse time-current uncertainty for TPS1HB16-Q1, TPS2HB16-Q1 and LM7480-Q1, with an explicitly assumed calculation and a reversible bench checklist.

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Vehicle communication and interfaces

Distinguish controller and physical layer, wake and power, and Ethernet versus camera-link boundaries.