NuAxi Stream - Real-Time Semiconductor Intelligence

Tue, Oct 27

23:30Impact score 50
[News] Former Intel CEO Pat Gelsinger Backs Memory Startup Eyeing EUV-Free Z2RAM, Targets Samples Within 4 Years
Former Intel CEO Pat Gelsinger is backing Nagare Labs, a memory startup developing Z2RAM. According to The Register, Nagare Labs recently secured US$5 million in seed funding led by Playground Global, where Gelsinger became a partner last year. The company was founded by Georgia Institute of Technology researchers Suman Datta and Shimeng Yu. Z2RAM uses oxide semiconductors and targets SRAM-like speed and DRAM-like density, designed for direct integration on top of logic chips through 3D hybrid bonding and to use standard back-end-of-line (BEOL) processes, allowing multiple memory layers through a single lithography exposure without requiring EUV. The technology remains at the laboratory prototype stage; the startup is seeking an R&D fabrication partner to scale production beyond university cleanroom facilities and plans to sample working Z2RAM memory tiles within four years (a target, not an achieved result), with commercial shipments targeted within the next decade. Z2RAM targets more than five times the bit density of SRAM in its initial implementation, while its capacity would remain far below HBM-equipped accelerators such as NVIDIA's Rubin (288GB) and AMD's MI455X (432GB). Challenges: there is currently no established industry standard for connecting this type of memory to AI accelerators through 3D hybrid bonding, and oxide semiconductors are susceptible to atomic vacancies, so reliability requires further validation.
Z2RAMNagare LabsTrendForcePartnership/M&A
23:20Impact score 25
Earnings Estimates Moving Higher for Texas Instruments (TXN): Time to Buy?
According to a Zacks Equity Research article published on Tuesday, October 27, 2026, analysts' earnings estimates for Texas Instruments (TXN) have moved considerably higher lately; the source states the cause is analysts' growing optimism on the earnings prospects of this chipmaker. The current-quarter estimate is $2.53 per share, representing a year-over-year change of +99.2%; the Zacks Consensus Estimate has increased 19.59% over the last 30 days, with eight estimates going higher and no negative revisions. For the full year, the earnings estimate of $8.85 per share represents a change of +62.4% from the year-ago number; over the past month, nine estimates moved higher with no negative revisions, helping the consensus estimate increase 5.1%. Thanks to these revisions, Texas Instruments currently carries a Zacks Rank #1 (Strong Buy); the article also notes the stock has been pushed 7.1% higher over the past four weeks. The article suggests investors consider buying, but the stock gain is an observation only; the source does not address specific component prices or supply-demand conditions.
Texas InstrumentsYahoo Finance — TXN
21:30Impact score 0
STMicroelectronics introduces first automotive safety combination sensors for mass-market applications
STMicroelectronics has announced automotive safety combination sensors for mass-market applications, combining multi-axis accelerometers and gyroscopes (angular rate sensors) in a single package for active and passive safety systems covering use-cases such as crash protection, rollover detection, airbag deployment, vehicle stability controls and radar beam stabilization. These are the first mass-market products launched following ST's acquisition of the NXP automotive and industrial MEMS sensors business in early 2026, a move completed to expand its own MEMS sensors capabilities. The four new sensors—NCS1012BAEP, NCS1012CAEP, NCS1012EAEP and NCS10135AEP—are in production now, in 24-pin QFN 6mm x 6mm x 1.90mm packages, ISO 26262 compliant, supporting SafeSPI, with an automotive temperature range of −40°C to +105°C; the integrated angular rate sensors offer full-scale ranges of ±125 dps, ±250 dps or ±350 dps, the low g acceleration sensors have a nominal full-scale range from ±1.50 g to ±34 g, and the medium g acceleration sensors from ±15.5 g to ±150 g. ST guarantees product availability for at least 15 years. Omdia Senior Research Analyst Nora Houlihan said that thanks to ADAS, IMUs are expected to grow at a 17.7% CAGR (2025-30).
automotive safety combination sensorsmulti-axis accelerometersgyroscopes (angular rate sensors)STMicroelectronics, NXPEE Journal
20:00Impact score 20
Investors Heavily Search Texas Instruments Incorporated (TXN): Here is What You Need to Know
Zacks published an investor-attention review of Texas Instruments (TXN) on October 27, 2026. The stock returned +7.1% over the past month versus the Zacks S&P 500 composite's -0.8% change, while the Zacks Semiconductor - General industry lost 5.9% over the same period. The current-quarter consensus EPS estimate is $2.53, a +99.2% change from the year-ago quarter, revised +19.6% over the last 30 days; the current fiscal year consensus of $8.85 implies +62.4% year-over-year, changed +5.1% over the last 30 days; the next fiscal year consensus of $11.03 implies +24.7%, changed +12.1% over the past month. Consensus sales are $6.09 billion for the current quarter (+37.7% year-over-year), with $22.26 billion (+25.9%) and $25.62 billion (+15.1%) for the current and next fiscal years. In the last reported quarter, revenues were $6.06 billion (+27.7% year-over-year), a +2.17% surprise versus the $5.93 billion consensus; EPS was $2.62 versus $1.48 a year ago, a +9.17% surprise. Over the last four quarters, TXN beat consensus EPS three times and revenue estimates three times. Based on earnings estimate revisions, TXN carries a Zacks Rank #1 (Strong Buy); its Zacks Value Style Score is F, indicating it trades at a premium to peers.
Texas InstrumentsYahoo Finance — TXN
19:00Impact score 60
Nvidia is bankrolling AI accelerator supply chain buildout to reserve production capacity
On October 21, during GTC Berlin, Nvidia announced several multi-billion-dollar deals with six major supply chain partners — Ibiden, Unimicron, Samsung Electro-Mechanics, SPIL, Amkor and KYEC — across substrates, advanced packaging, semiconductor testing and optical engines, to expand production capacity and reserve capacity for its AI accelerators; expanded supply is to be available from 2027 through 2028, with commitments and production roadmaps stretching through 2028. For substrates, Nvidia plans to secure 2.5x dedicated substrate capacity over the next three years: it earlier signed a deal to provide a multibillion-dollar capacity reservation advance to support Ibiden's Ono Plant in Japan (targeting 3x the plant's current capacity); the Samsung Electro-Mechanics deal will support facility upgrades and new plants in Busan and Sejong, with Nvidia projected to account for a significant portion of its output by 2028; a capacity reservation agreement with Unimicron supports its substrate expansion in Taiwan, expected to start providing capacity by Q2 2027 and reach full capacity by mid-2028. For co-packaged optics, Nvidia signed with SPIL to expand optical engine production capacity 15x (1,400%) by mid-2027, with plans to double again by the end of 2028. With Amkor, Nvidia targets a more-than-300% increase in interposer wafer capacity by the end of 2028 through advanced packaging expansion in South Korea; Amkor confirmed the deal is worth $1.3 billion, bringing Nvidia's total investment across Amkor's Arizona and South Korea facilities to $3 billion. For testing, on October 13 Nvidia signed a deal to pay KYEC $1.1 billion to reserve testing capacity at KYEC's new $1.4 billion U.S. facility (high-volume production slated to begin in April 2027; Singapore high-volume production expected to begin February 2027), with testing capacity expected to double from calendar 2026 to 2027; KYEC currently handles nearly all of Nvidia's chip testing. Per its August 2026 disclosures, Nvidia had accumulated $279 billion in outstanding supply and manufacturing-capacity commitments by July 2026. All expansion figures are announced plans and targets, not yet realized.
substratesadvanced packaginginterposer wafersNvidia, Ibiden and 7 totalTom's HardwareCapacity Change
08:30Impact score 58
Samsung-Backed Wooptix to Supply Wafer Metrology Equipment in South Korea
Spanish semiconductor metrology equipment maker Wooptix plans to supply its Phemet wafer metrology system to a South Korean semiconductor manufacturer; the customer's identity was not disclosed. Marco Franchi, technical marketing manager at Wooptix, said the company will begin deploying equipment at customer sites next year to validate its suitability for their processes, with the goal of entering mass-production lines within two to three years. Samsung Ventures led an investment in the company last year. Phemet is an automated metrology system that measures the shape of 300-millimeter wafers, including bow and warpage; it captures an image of an entire wafer in less than one second and offers subnanometer height measurement resolution. The system illuminates the wafer with LEDs and calculates its surface profile from phase differences in reflected light, using technology Wooptix calls Wavefront Phase Imaging (WFPI). The company unveiled Phemet in November 2025 and installed its first system at French semiconductor research institute CEA-Leti in May. Wooptix plans to secure logic semiconductor customers in Korea before expanding into memory, because wafer alignment and shape control have become more challenging with gate-all-around (GAA) transistors and backside power delivery network (BSPDN) processes; it subsequently plans to expand into advanced packaging applications including hybrid bonding and is considering miniaturizing the equipment for die-to-wafer (D2W) and die-to-die (D2D) processes. Founded in 2016, Wooptix raised more than 10 million euros in a Series C funding round in February 2025, jointly led by Samsung Ventures and the Spanish Society for Technological Transformation (SETT), with participation from existing investors including Intel Capital and Tokyo Electron (TEL) Venture Capital. Wooptix is headquartered in Tenerife, Spain, where it also operates manufacturing facilities, and maintains offices in Madrid and Grenoble, France; about 60% to 70% of its approximately 80 employees work in R&D, and the company plans to expand its workforce to around 100 by the end of this year or early next year.
wafer metrology equipment300-millimeter wafersWooptix, Samsung Ventures and 8 totalThe Elec
08:29Impact score 45
QRT, KAERI Partner on Semiconductor Radiation Reliability Testing
QRT said on Oct. 26 that it signed a memorandum of understanding (MOU) with the Korea Atomic Energy Research Institute (KAERI) to advance radiation effects testing and radiation reliability technologies for semiconductors and electronic components. Over the next five years, QRT and KAERI will verify the radiation tolerance and reliability of semiconductors and electronic components used in high-radiation environments, including space, aviation and defense applications, and collaborate on technology transfer and commercialization of their joint research results. The partnership covers radiation effects testing, research into testing and evaluation technologies using high-energy particle beams such as protons, neutrons, electrons and gamma rays, joint use of research facilities and equipment including proton accelerators, and joint planning and execution of national R&D projects and industry-academia-research collaboration programs. QRT said the partnership is significant because it combines KAERI's research infrastructure with the company's testing capabilities.
semiconductorselectronic componentsQRT, KAERIThe ElecPartnership/M&A
08:29Impact score 50
Fighter Jet OLEDs to Use More Emissive Layers Than Smartphones
According to industry sources on Oct. 26, South Korea's Ministry of Trade, Industry and Resources (MOTIR) is planning an OLED research and development project for fighter jet cockpits with LG Display and Hanwha Systems. OLED displays for fighter jets are expected to adopt multi-stack tandem structures with more emissive layers than smartphone displays: fighter jets have greater power supply capacity than smartphones, allowing additional emissive layers to improve brightness and lifespan, while adding emissive layers also increases the required driving voltage. Large cockpit displays in South Korea's KF-21 fighter jet and the U.S. F-15 series currently use liquid crystal displays (LCDs). Key development priorities include suppressing lateral current leakage through the charge generation layers (CGLs) between emissive layers, which could make adjacent pixels that should remain off emit faint light and distort colors during nighttime low-brightness operation; improving red-emitting materials whose long-wavelength emissions can be amplified by night vision goggles and interfere with pilots' observation; optical technologies that narrow the direction of light emission, such as microcavities, distributed Bragg reflectors (DBRs) and metalenses, as alternatives to the viewing-angle restriction films LCDs use, which cause light loss, increasing power consumption and heat generation; and overcoming OLED brightness degradation at low temperatures such as around minus 40 degrees Celsius, while withstanding vibration and shock with redundancy. An industry official said that to apply OLED technology to actual military equipment, manufacturers must secure improvements in lifespan through multi-stack tandem structures alongside advances in emissive materials and optical design.
fighter jet cockpit OLED displayssmartphone OLED displaysmilitary LCDsLG Display, Hanwha SystemsThe Elec

Mon, Oct 26

23:30Impact score 0
[News] World’s First Ampere-Level Vertical Gallium Oxide MOSFET Developed
According to a report dated 2026-10-27, Shanghai-based Jiachi Power Technology, located in Shanghai's fourth-generation semiconductor industry cluster, has completed the first phase of wafer fabrication and validation for its vertical gallium oxide MOSFET chips. Through device-structure innovations and in-house process development, the company describes the result as the world's first enhancement-mode vertical gallium oxide MOSFET with on-state current exceeding 1 A and breakdown voltage above 900 V. Measured results showed a threshold voltage of 3.9 V enabling stable enhancement-mode operation, an on-state current of 1.2 A, and a specific on-resistance of 33 mΩ·cm². Designed for a 750 V operating class, the device demonstrated a measured breakdown voltage exceeding 900 V with leakage current below 3 μA, which the source says approaches mature commercial silicon and silicon carbide power devices. Based on the company's review of publicly available research and industry results, this is the first reported vertical gallium oxide MOSFET with on-state current above 1 A. Stable and controllable p-type doping had long been a major challenge, and prior public literature had not documented vertical gallium oxide MOSFETs with on-state currents exceeding 1 A. The technical team said the results validate the feasibility of its original device architecture and in-house self-aligned ion implantation approach, marking an important step from laboratory validation toward commercial engineering. Going forward, the company plans to further optimize device structures, process parameters, and epitaxial material integration, and to advance chip development, sample delivery for customer evaluation, and production-ready process establishment.
vertical gallium oxide MOSFETJiachi Power TechnologyTrendForce
21:00Impact score 10
SEMICON West 2026: After the Toast, the Hard Questions
SEMICON West 2026 was held October 13 to 15 at the Moscone Center in San Francisco. The article states the opening toast marked an industry that has already crossed $1 trillion in annual revenue, almost four years ahead of earlier projections. According to WSTS (World Semiconductor Trade Statistics), first-half 2026 sales were $702 billion, double a year earlier, and its August update points to roughly $1.66 trillion for the full year (a forecast), with memory up about 300% (forecast). SEMI expected more than 35,000 attendees over the three days on a sold-out floor of over 1,500 booths, with an exhibitor count of more than 700 companies and organizations. Topics included AI scaling, heterogeneous integration, advanced manufacturing, supply-chain resilience, advanced packaging and the economics of agentic AI. The next SEMICON West opens in Phoenix in March 2027; PDF Solutions held its 2026 CONNECT Conference on October 15–16 in San Francisco. The full-year sales figure is a WSTS forecast, not an achieved result.
semiconductorsmemorySemiWiki
20:00Impact score 45
Former Intel CEO Pat Gelsinger bets on Nagare Labs to vault the memory wall
Former Intel CEO Pat Gelsinger, who became a partner at investor Playground Global last year, is betting on Nagare Labs, a startup founded by Georgia Institute of Technology professors Suman Datta and Shimeng Yu, which is developing a new memory technology called Z2RAM based on oxide semiconductors. Z2RAM aims to combine SRAM-like speed, density much closer to DRAM, and NAND-like manufacturing, with a promised bit density upwards of 5x that of SRAM in its first incarnation (a 64MB SRAM tile corresponding to 320MB of Z2RAM capacity), designed for integration directly onto compute logic using 3D hybrid bonding. The company has closed its first seed funding round and now has $5 million to further development; the technology is still at the lab-prototype stage, and Nagare is looking for an R&D fab partner, with the goal of sampling working Z2RAM memory tiles within the next four years and production shipments within the next decade. Challenges include the lack of an open standard for 3D bonding integration (Nagare may have to design an interface itself) and reliability concerns with oxide semiconductors (atomic vacancies and single- or few-electron effects shifting transistor threshold voltage).
Z2RAMSRAMDRAMNagare Labs, Intel and 7 totalThe RegisterPartnership/M&A
17:47Impact score 0
University of Illinois at Urbana-Champaign (UIUC) has achieved a record modulation bandwidth of 2.75GHz in a gallium nitride (GaN) blue micro-LED (Abdelghany Abouelnagga et a
The University of Illinois at Urbana-Champaign (UIUC) has achieved a record modulation bandwidth of 2.75GHz in a gallium nitride (GaN) blue micro-LED (Abdelghany Abouelnagga et al). This is a research achievement record; the source does not state the cause, and no price, capacity or supply changes are involved.
gallium nitride (GaN) blue micro-LEDSemiconductor Today
15:02Impact score 30
Vertical DRAM Stacking Expands Thermal Design Space Beyond HBM-on-GPU (imec)
Researchers at imec published "Beyond HBM-on-GPU: Thermal Design Envelope for 3D Volumetric DRAM-on-GPU Integration." The researchers evaluated a 3D memory architecture that rotates DRAM dies vertically above a GPU and places cooling cavities between them, as an alternative to conventional 2.5D HBM and direct-stacked HBM-on-GPU. Package-level thermal simulations examined stack height, memory capacity and organization. This is a research-level evaluation and simulation only; no realized changes to production, pricing or demand are reported.
DRAM HBMGPUimecSemiconductor Engineering
15:01Impact score 25
Self-Heating And Parasitics Challenge Multi-Tier CFET Scaling (TU Munich, IIT Kanpur)
Researchers at the Technical University of Munich and the Indian Institute of Technology Kanpur published a study titled 'Self-Heating and Parasitic Effects in Multi-Tier CFET Design.' The abstract states that the study examines the impact of self-heating effects (SHEs) and middle of line (MOL) and back-end of line (BEOL) induced parasitics on multi-tier CFET design, in which multiple nanosheet devices are vertically stacked. This is a technical research publication; it does not involve any price, capacity, or supply-demand change.
multi-tier CFETnanosheet devicesSemiconductor Engineering
10:57Impact score 30
India roundup: India's tech build-out opens new markets, but foreign suppliers are first in line
This roundup states that India's tech build-out is opening markets unevenly: foreign suppliers get first crack at Tata's fab, Lam is courting local vendors, Jio's IPO will test its 5G pitch, and CleanMax powers AI data centers. The source provides no specific figures, prices or dates and does not state any cause.
5GAI data centersfab capacityTata, Lam and 4 totalDigiTimes Asia
07:54Impact score 25
ACM Research Targets Panel-level Packaging with Horizontal Plating and Specialized Cleaning
According to EE Times Asia, as advanced packaging moves toward larger substrates, panel warpage, residue removal and process uniformity are shaping the development of wet-processing equipment. ACM Research is targeting panel-level packaging with horizontal plating and specialized cleaning equipment. The item is background industry information and involves no price movement, capacity change, or policy development; the source does not state the cause.
panel-level packaging wet-processing equipmentACM ResearchEE Times Asia
06:31Impact score 55
Global Technology Expands Into Automotive Chips With First Hyundai, Kia Supply
Fabless semiconductor company Global Technology said at the second Auto Semicon Korea 2026 (ASK 2026), held at the DoubleTree by Hilton hotel in Pangyo on Oct. 21, that it has begun its first mass production of automotive semiconductors in collaboration with Hyundai Mobis. The product entering mass production is the ID804 smart light-emitting diode (LED) multi-chip module (MCM) for automotive interior ambient lighting; the package integrates three red, green and blue (RGB) LED chips with a control chip and has been selected for use in Hyundai Motor and Kia vehicles. Hyundai Mobis provided the product specifications and validation requirements, while Global Technology designed the chip to meet those standards. CEO Kim Min-sun said the company established itself in the high-barrier automotive semiconductor market thanks to Hyundai Mobis' ASK ecosystem and active cooperation, and will expand its portfolio into power, communications and displays based on the first mass-produced product. The company established an evaluation framework based on AEC-Q100 and AEC-Q102-003 and incorporated ISO 26262 from the initial design stage. Based on the ID804, it is developing an integrated semiconductor handling power supply and signal communications as well as a next-generation CAN communication chip, and is jointly developing automotive display backlight driver chips with Hyundai Mobis; the two companies plan to cooperate in expanding into overseas markets.
automotive interior ambient lighting LED multi-chip modulepower supply and signal communications integrated semiconductor (in development)automotive CAN communication chip (in development)Global Technology, Hyundai Mobis and 4 totalThe Elec
06:30Impact score 60
Intel Begins Equipment Installation at Arizona Fab 62, Targets Late 2028 Operations
Intel confirmed on Oct. 22 local time that construction and equipment installation are underway at Fab 62 on its Ocotillo campus in Arizona, with plans to begin operating the facility by the end of 2028; the fab is expected to use the company's 1.4-nanometer-class Intel 14A process. Naga Chandrasekaran, executive vice president and chief technology and operations officer of Intel Foundry, said Fab 62 will be the sixth high-volume manufacturing facility at the Ocotillo campus. Intel began constructing Fab 52 and Fab 62 in 2021; Fab 52 was completed in 2023 and has been mass-producing chips on the Intel 18A process (combining RibbonFET and PowerVia technologies) since late 2025. Intel's $28 billion plant in New Albany, Ohio, recently installed its first major roof truss; originally scheduled for completion in 2025, it is now expected to be completed in 2030 due to funding difficulties. Intel also plans to be the first in the industry to deploy High NA-EUV lithography equipment in mass production at its Oregon facility, carries out large-scale advanced packaging production in New Mexico, and has begun construction on a new mask manufacturing facility in Santa Clara, California.
Intel 14A processIntel 18A processHigh NA-EUV lithography equipmentIntelThe ElecCapacity Change
06:30Impact score 60
TLB Begins Development of SOCAMM3 Substrates for AI Servers
According to industry sources on Oct. 22, TLB, a memory substrate specialist, has begun developing substrates for SOCAMM3 (Small Outline Compression Attached Memory Module 3), a next-generation low-power memory module standard for AI servers, in collaboration with two major memory manufacturers in South Korea and overseas. TLB recently began discussions with two existing memory customers on SOCAMM3 substrate design and manufacturing processes; the standard has not yet been finalized, and mass production of the substrates is expected in 2028. SOCAMM2 substrates entered mass production early in 2026, and their production volume and revenue more than tripled in the second quarter from the previous quarter; industry estimates put TLB's SOCAMM substrate revenue at around 70 billion won in 2026, with projections of approximately 140 billion won in 2027. SOCAMM3 substrates are expected to require more buildup cycles than SOCAMM2 (five buildup cycles), likely making them more expensive. TrendForce reported in June 2026 that Nvidia had halved the originally planned memory capacity per SOCAMM module for Vera Rubin; the three major memory manufacturers had allocated LPDDR5X supplies equivalent to only about 60% of Nvidia's requirements, and TrendForce expects shortages to persist into 2027. Anticipating rising demand, TLB began investing in buildup equipment at its second Ansan plant and Vietnam facility in the third quarter of 2025, and plans to begin construction of a second factory in November at the Yen Phong Industrial Park in Bac Ninh Province, Vietnam, targeting full-scale operations in the fourth quarter of 2027; once operational, the company's effective production capacity will double from 20,000 square meters to 40,000 square meters per month. SOCAMM substrates are expected to remain in production exclusively at TLB's Ansan headquarters for the time being because of their manufacturing complexity and stringent customer qualification requirements.
SOCAMM3 substrateSOCAMM2 substrateLPDDR5XTLBThe Elec
05:17Impact score 20
Pt-W Alloy Shows Potential For Thinner High-NA EUV Mask Absorbers (Chinese Academy of Sciences et al.)
Researchers at the Chinese Academy of Sciences, Jilin University, the State Key Laboratory of Advanced Manufacturing for Optical Systems, and the University of Chinese Academy of Sciences published a technical paper titled "Evaluating an alternative Pt-W alloy as a low-n EUV mask absorber: Film properties and imaging performance," investigating an alternative Pt-W alloy as a low-n EUV mask absorber and evaluating its film properties and imaging performance. The study indicates the Pt-W alloy shows potential for thinner High-NA EUV mask absorbers. This is a research-stage result; the source does not state any commercialization or production arrangements, nor does it state the cause.
Pt-W alloy EUV mask absorberChinese Academy of Sciences, Jilin University and 4 totalSemiconductor Engineering

Analog	$0.68	−5.9%
Connector	$0.75	+0.2%
CPU	$386.74	−21.3%
DDR4	$88.40	−0.2%
DDR52026-W13	$14.89	−11.2%
GPU	$478.20	+8.2%
MCU	$0.68	−61.7%Unusual
MLCC	$0.01	+54.0%Unusual
MOSFET	$0.12	−82.8%Unusual
PMIC2026-W13	$0.44	−12.5%
SSD/HDD	$288.43	n/a

NuAxi Stream - Real-Time Semiconductor Intelligence

Tue, Oct 27

[News] Former Intel CEO Pat Gelsinger Backs Memory Startup Eyeing EUV-Free Z2RAM, Targets Samples Within 4 Years

Earnings Estimates Moving Higher for Texas Instruments (TXN): Time to Buy?

STMicroelectronics introduces first automotive safety combination sensors for mass-market applications

Investors Heavily Search Texas Instruments Incorporated (TXN): Here is What You Need to Know

Nvidia is bankrolling AI accelerator supply chain buildout to reserve production capacity

Samsung-Backed Wooptix to Supply Wafer Metrology Equipment in South Korea

QRT, KAERI Partner on Semiconductor Radiation Reliability Testing

Fighter Jet OLEDs to Use More Emissive Layers Than Smartphones

Mon, Oct 26

[News] World’s First Ampere-Level Vertical Gallium Oxide MOSFET Developed

SEMICON West 2026: After the Toast, the Hard Questions

Former Intel CEO Pat Gelsinger bets on Nagare Labs to vault the memory wall

University of Illinois at Urbana-Champaign (UIUC) has achieved a record modulation bandwidth of 2.75GHz in a gallium nitride (GaN) blue micro-LED (Abdelghany Abouelnagga et a

Vertical DRAM Stacking Expands Thermal Design Space Beyond HBM-on-GPU (imec)

Self-Heating And Parasitics Challenge Multi-Tier CFET Scaling (TU Munich, IIT Kanpur)

India roundup: India's tech build-out opens new markets, but foreign suppliers are first in line

ACM Research Targets Panel-level Packaging with Horizontal Plating and Specialized Cleaning

Global Technology Expands Into Automotive Chips With First Hyundai, Kia Supply

Intel Begins Equipment Installation at Arizona Fab 62, Targets Late 2028 Operations

TLB Begins Development of SOCAMM3 Substrates for AI Servers

Pt-W Alloy Shows Potential For Thinner High-NA EUV Mask Absorbers (Chinese Academy of Sciences et al.)

Chip Teardown Lab2 opened

Component price indexNPI, vs. prior period

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