TLB Begins Development of SOCAMM3 Substrates for AI Servers

What happened

According to industry sources on Oct. 22, TLB, a memory substrate specialist, has begun developing substrates for SOCAMM3 (Small Outline Compression Attached Memory Module 3), a next-generation low-power memory module standard for AI servers, in collaboration with two major memory manufacturers in South Korea and overseas. TLB recently began discussions with two existing memory customers on SOCAMM3 substrate design and manufacturing processes; the standard has not yet been finalized, and mass production of the substrates is expected in 2028. SOCAMM2 substrates entered mass production early in 2026, and their production volume and revenue more than tripled in the second quarter from the previous quarter; industry estimates put TLB's SOCAMM substrate revenue at around 70 billion won in 2026, with projections of approximately 140 billion won in 2027. SOCAMM3 substrates are expected to require more buildup cycles than SOCAMM2 (five buildup cycles), likely making them more expensive. TrendForce reported in June 2026 that Nvidia had halved the originally planned memory capacity per SOCAMM module for Vera Rubin; the three major memory manufacturers had allocated LPDDR5X supplies equivalent to only about 60% of Nvidia's requirements, and TrendForce expects shortages to persist into 2027. Anticipating rising demand, TLB began investing in buildup equipment at its second Ansan plant and Vietnam facility in the third quarter of 2025, and plans to begin construction of a second factory in November at the Yen Phong Industrial Park in Bac Ninh Province, Vietnam, targeting full-scale operations in the fourth quarter of 2027; once operational, the company's effective production capacity will double from 20,000 square meters to 40,000 square meters per month. SOCAMM substrates are expected to remain in production exclusively at TLB's Ansan headquarters for the time being because of their manufacturing complexity and stringent customer qualification requirements.

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Source and time

Source: The Elec · 10/25/2026 · View original source