Vertical DRAM Stacking Expands Thermal Design Space Beyond HBM-on-GPU (imec)

What happened

Researchers at imec published "Beyond HBM-on-GPU: Thermal Design Envelope for 3D Volumetric DRAM-on-GPU Integration." The researchers evaluated a 3D memory architecture that rotates DRAM dies vertically above a GPU and places cooling cavities between them, as an alternative to conventional 2.5D HBM and direct-stacked HBM-on-GPU. Package-level thermal simulations examined stack height, memory capacity and organization. This is a research-level evaluation and simulation only; no realized changes to production, pricing or demand are reported.

Impact and signal

Affected components and suppliers

Source and time

Source: Semiconductor Engineering · 10/26/2026 · View original source