ASML CEO expects first High-NA EUV products within months, while TSMC delays adoption due to high costs. Intel and SK hynix are aggressively deploying the technology, whereas Samsung adopts a pragmatic approach.
Cirrascale CEO David Driggers highlights that traditional data center planning fails for AI due to power and cooling constraints, specifically noting the shift to liquid cooling for racks exceeding 50kW.
Larsen & Toubro (L&T) has launched a new industrial electronics manufacturing business, L&T Electronic Products & Systems (LTEPS), with two initial production lines in Coimbatore. The move aims to deepen L&T's technology portfolio and support India's self-reliance in electronics manufacturing. Neutral: This is a long-term capacity addition in a niche B2B segment with no immediate, direct impact on component pricing or supply.
Bosch launched its third-generation SiC chips and announced a massive $5 billion investment to expand production capacity. The company aims to meet rising EV demand using advanced 200mm wafer technology. Bearish: The significant capacity expansion signals potential oversupply pressure on SiC prices in the medium term.
SK hynix deployed 2,000 Nvidia Blackwell GPUs at its Cheongju campus to power internal AI operations and digital twins. This investment aims to secure sensitive data and optimize production processes. Bullish for SK hynix's AI infrastructure and Nvidia's AI chip demand.
SK hynix broke ground on its P&T7 advanced packaging and test facility in Cheongju, investing 19 trillion won with phased completion through 2028. The facility is dedicated to AI memory, including HBM, and will add 150,000 sqm of cleanroom space. Neutral: This long-term capacity expansion plan addresses future AI demand but has no immediate impact on current supply or pricing.
SK hynix held a groundbreaking ceremony for its P&T7 advanced packaging facility in Cheongju, with an investment of trillions of KRW. The facility is dedicated to manufacturing AI memory products like HBM, with the WT line scheduled for completion by Oct 2027 and the WLP line by Feb 2028. Neutral: This long-term capacity expansion plan supports future HBM supply but has no immediate impact on current trading dynamics.
Micron Technology has commenced operations at its new assembly, test, marking, and packaging (ATMP) plant in Sanand, India, marking the country's first globally relevant semiconductor manufacturing operation. This expansion is part of Micron's strategy to diversify its supply chain and meet growing demand. Neutral: This long-term capacity addition does not indicate an immediate change in market supply or pricing dynamics.
Chinese memory makers are aggressively expanding capacity, with local equipment vendors AMEC and Naura Technology being key beneficiaries. AMEC leads in 3D NAND etching, while Naura has developed high-aspect-ratio etching tools targeting 300+ layer NAND. Bearish: Increased future supply from China's capacity build-out poses a long-term downside risk to NAND Flash pricing.
Intel-backed 3D Glass Solutions (3DGS) has broken ground on India's first advanced 3D packaging facility, targeting 69,600 glass panel substrates annually. The project, backed by Intel Capital and Lockheed Martin, aims to produce glass interposers and 3D heterogeneous integration modules for defense and AI applications.
This capacity expansion signals a shift in the advanced packaging supply chain but may introduce long-term price pressure.
3D Glass Solutions (3DGS) is investing $21 million to build an advanced 3D packaging facility in India, targeting AI and data center sectors with a 2028 commercial launch.
Intel Foundry reported a year-over-year increase of over 50% in equipment orders, benefiting suppliers E&R Engineering and KINIK Company. The surge is driven by capacity expansion plans and the upcoming 14A node, which is expected to attract major customers like Apple and Nvidia by year-end.
ASE, Samsung, and Amkor are aggressively expanding global packaging and testing capacity, with ASE planning six new fabs and Samsung investing $4B in Vietnam. This expansion is driven by demand from AI, HPC, and data centers. Bearish: The significant, coordinated capacity increase across major OSATs signals a future easing of supply constraints, potentially pressuring pricing power.
Skytech has delivered its 310x310mm panel-level packaging PVD system to ASE Technology Holding, marking a shift in advanced packaging technology towards large-size panels driven by AI and HPC demands. This equipment delivery suggests capacity expansion in panel-level packaging. Bearish: Increased supply capacity may ease current bottlenecks.
TSMC announced expansion of 3nm capacity in Taiwan (H2 2027), Arizona (H2 2027), and Japan (2028), while planning to migrate some 5nm capacity to 3nm. This is driven by strong demand, high margins (>60%), and N3's dominant market position with zero merchant foundry competition. Neutral: Capacity additions are long-dated (2027-2028) and reflect structural demand, not an immediate supply shock.
Elon Musk's Terafab project is aggressively soliciting quotes and expedited delivery times from key semiconductor equipment suppliers, reportedly willing to pay a premium. This signals a new, well-funded source of demand entering the market for fab tools and materials. Bullish: The project's 'light speed' procurement and willingness to pay above market rates could tighten supply and support prices for critical semiconductor manufacturing equipment.
TSMC's initial 2nm (N2) capacity for 2026 is fully booked by major clients including Apple, Nvidia, and AMD, with Apple expected to consume over half of early production. The company is ramping capacity from Fab 20 and Fab 22, targeting 80k-100k wafers/month by end-2026 to meet surging AI/HPC demand.
Intense competition for limited leading-edge capacity signals sustained pricing power and potential supply tightness for advanced chips.
TSMC Chairman C.C. Wei confirmed persistent capacity shortages and stated that 3nm technology contributed ~25% of Q1 2026 revenue. New 3nm capacity will be added in Taiwan, the US, and Japan sequentially from 2027-2028, and the company introduced CoPoS packaging plans. Watch: Long-term capacity expansion may ease constraints, but near-term shortages for advanced nodes and packaging persist, creating mixed signals for pricing.
Turion raised $75 million to expand satellite production capacity from 8 to 40 units annually. The funding aims to enhance high-resolution non-Earth imaging capabilities. Bearish: Increased supply for satellite electronics may alleviate current shortages.
YC Chem plans to invest 13.8 billion won to expand production lines for HBM glue cleaners and strippers, with mass production scheduled for Q4. This expansion addresses rising HBM demand and secured orders from global memory manufacturers. The move signals increased supply capacity for back-end packaging materials, which is likely to stabilize or slightly reduce material prices.
Whose chips are really inside the hottest new products? We open them up and show you, one part at a time.
iPhone DuoFirst-pass chip map: 12 modules, 37 checkable identifiers (31 A / 6 B) and 19 public MPNs (16 externally searchable); A20 Pro, C2, N1 and the power/RF chains are located, while the NAND brand stays unconfirmed.All teardowns| Analog | $0.68 | −5.9% |
|---|---|---|
| Connector | $0.75 | +0.2% |
| CPU | $386.74 | −21.3% |
| DDR4 | $88.40 | −0.2% |
| DDR52026-W13 | $14.89 | −11.2% |
| GPU | $478.20 | +8.2% |
| MCU | $0.68 | −61.7%Unusual |
| MLCC | $0.01 | +54.0%Unusual |
| MOSFET | $0.12 | −82.8%Unusual |
| PMIC2026-W13 | $0.44 | −12.5% |
| SSD/HDD | $288.43 | n/a |