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[News] ASML Expects First High-NA EUV Memory, Logic Products Within Months Amid TSMC’s Cost-Driven Delay

What happened

ASML CEO expects first High-NA EUV products within months, while TSMC delays adoption due to high costs. Intel and SK hynix are aggressively deploying the technology, whereas Samsung adopts a pragmatic approach.

Impact and signal

Medium impactImpact score: 65/100

Affected components and suppliers

High-NA EUV Lithography Equipment

ASML TSMC Intel SK hynix Samsung Electronics

capacity_expansionequipment_demandfuture_tech

Source and time

Source: TrendForce · 5/19/2026 · View original source

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[News] ASML Expects First High-NA EUV Memory, Logic Products Within Months Amid TSMC’s Cost-Driven Delay

What happened

Impact and signal

Affected components and suppliers

Source and time

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