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ASML

NuAxi groups public briefings that mention ASML: product launches, capacity and pricing signals, and supply-chain changes. The page updates continuously.

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Fri, Oct 23

  1. Impact score 10

    China can make advanced chips without EUV, but the bill keeps growing

    An analysis article published 23 October 2026 reports that export controls keep ASML's most advanced EUV lithography machines out of China, so the country's chip industry relies on DUV lithography with multiple patterning to make advanced chips, at the cost of bigger dies, more defects, lower yields, longer manufacturing times and higher bills. Chris Mack, co-founder and CTO of Fractilia, said industry conventional wisdom held that three exposures on a 193 immersion tool cost about the same as one exposure on an EUV tool, and that at four masks EUV became more cost-effective. Teardowns of Huawei's Mate 60 Pro in 2023 found its Kirin 9000S processor made by SMIC using a second-generation 7nm-class process without EUV; analysis of Huawei's Kirin 9030 found SMIC had pushed its DUV-based process closer to 5nm-class density, though it continued to lag TSMC and Samsung leading processes. A June Morgan Stanley report estimated Chinese DRAM maker CXMT was producing only around one-third as many bits per wafer as Western competitors, with the older process node accounting for only about a third of that shortfall, and said access to lithography is a 'hard ceiling' on Chinese memory development. Micron's 1-alpha generation was developed without EUV, showing how far DUV can be stretched; Micron's newer 1-gamma DRAM process uses EUV, which Micron said achieves more than 30% greater bit density per wafer than its preceding 1-beta generation. Morgan Stanley assumes CXMT remains stuck on its 1-alpha process without EUV, yet raises its share of global DRAM bit supply from 14% in 2026 to 16% in 2028 by building more greenfield capacity, and expects China's AI chip self-sufficiency to rise from 42% in 2025 to 70% by 2030. Mack said he would be hard pressed to believe a three-nanometer or two-nanometer node is economically viable without EUV.

    DUV lithographyEUV lithographyDRAMASML, SMIC and 7 totalTom's Hardware

Wed, Oct 21

  1. Impact score 58

    ASML and other critical semiconductor equipment suppliers expedite shipments to Musk's Terafab

    Elon Musk said on October 20, during a live broadcast of SpaceX's Q3 2026 earnings call on X, that ASML and other critical semiconductor equipment suppliers have expedited shipments to the Terafab semiconductor manufacturing facility, a joint megaproject between Tesla and SpaceX, to support his aggressive timeline. He said the company is targeting volume chip production at Terafab's primary facility in Gibbons Creek, Texas, by the third or fourth quarter of 2028, emphasizing that the timeline is highly aspirational and carries 'big error bars'; SpaceX plans to manufacture its first experimental test chip at its research fabrication facility in Austin, Texas, around Q2 2027. Terafab will use traditional extreme ultraviolet (EUV) lithography systems utilizing Intel's 14A manufacturing node; Intel officially joined the Terafab venture in April 2026 to co-develop and refactor silicon fabrication technology. According to unofficial sources, Terafab's first EUV tool was reportedly slated for delivery in mid-2027, and it remains unclear if this is the expedited timeline Musk referred to. Other major suppliers include Applied Materials, Lam Research, and KLA Corporation, as well as Japan's Tokyo Electron; Tesla and SpaceX are also in talks with about 10 South Korean equipment makers, including Hanmi Semiconductor (advanced packaging equipment) and HPSP (high-pressure hydrogen annealing equipment). Musk also outlined AI compute goals: 2.5 to 3 GW of computing capacity active by the end of 2026, a total of 13 GW by the end of 2027, and plans to bring a 440,000-GPU Nvidia 'Vera Rubin' training cluster online by the end of Q2 2027. The event remains a plan/target and volume production has not been achieved.

    EUV lithography systemslogic chipsmemoryASML, Tesla and 11 totalTom's HardwareCapacity Change
  2. Impact score 58

    RT NEWS: #Terafab: #SpaceX's Elon Musk eyes a first test chip "approximately May or June of next year," volume output "at least in the set of possible...

    According to a repost by TrendForce, SpaceX's Elon Musk said regarding the Terafab project that a first test chip is eyed for "approximately May or June of next year," while volume output is "at least in the set of possible outcomes for Q3 or Q4 of 28" — both remain plans/expectations and are not yet realized. Asked about EUV orders, he thanked ASML for faster tool delivery. The source does not state the cause or further background details.

    test chipEUV toolsSpaceX, ASMLTrendForce Official (Market Data)Capacity Change
  3. Impact score 60

    [News] Musk Targets Terafab Chip Volume Production in 3Q28, First SRAM Test Chip by Mid-2027

    According to Reuters, Elon Musk said during a SpaceX conference call that his semiconductor manufacturing venture, Terafab, is targeting volume production in 3Q28, though he acknowledged that either 3Q or 4Q remains possible, describing the timeline as "very aggressive" given that advanced logic chip fabs in the U.S. typically take three years or more to build. Before volume production, Terafab aims to produce its first functional test chip using SRAM circuits around May or June 2027 at its Austin research facility. Equipment supply remains a key challenge, particularly from ASML and U.S. suppliers such as Applied Materials and KLA; asked whether SpaceX had ordered EUV lithography systems from ASML, Musk did not answer directly but thanked ASML and other suppliers for accelerating equipment deliveries. Per Reuters, ASML expects demand to outstrip supply through 2028 despite plans to expand EUV production capacity. According to The Elec, Tesla and SpaceX are in talks with South Korean semiconductor materials, components, and equipment suppliers to establish Terafab's supply chain, with several companies signing NDAs; HPSP and Hanmi Semiconductor remain the only two Korean equipment suppliers publicly linked to Terafab, and Terafab is reportedly seeking prices even lower than those offered by Chinese competitors. On manufacturing partners, TSMC Chairman and CEO C.C. Wei confirmed ongoing discussions but stressed that any fab involving TSMC must be operated by the company, contrasting with Musk's October 7 remarks that his companies would build and operate Terafab, potentially allowing TSMC to sublease space without an operational role; meanwhile, per Reuters citing Bloomberg, Intel CEO Lip-Bu Tan said the company would remain involved in Terafab.

    SRAM test chipadvanced logic chipsEUV lithography systemsTerafab, Tesla and 10 totalTrendForceCapacity Change

Tue, Oct 20

  1. Impact score 40

    Smoothing the Quantum Path: ASML and Xanadu Target Photon Loss

    ASML and Xanadu have announced a collaboration to investigate whether advanced lithography processes can suppress photon loss, one of the most unforgiving engineering constraints in photonic quantum computing. The companies will study advanced lithography processes for Xanadu's photonic quantum hardware, focusing on whether tighter patterning control can suppress loss mechanisms and improve the prospects for fault-tolerant, utility-scale machines. The program specifically connects optical loss with line-edge roughness (LER): lithography defines the lateral boundaries of waveguides and other nanophotonic structures, and nanoscale deviations in real edges perturb the waveguide's refractive-index boundary, coupling guided light into radiation modes or producing back-scattering, resulting in propagation loss. ASML brings expertise in lithographic imaging, process windows, metrology and computational correction; Xanadu contributes device requirements, photonic circuit designs and quantum-level performance data. The source explicitly notes that the collaboration does not mean ASML is building a quantum computer, and the announcement does not specify a production node, tool platform or numerical loss target; it is a research effort to understand which lithography-enabled approaches can produce lower-loss photonic structures, and the immediate outcome is process knowledge, not a finished fault-tolerant machine. Success will also depend on packaging, fiber-to-chip coupling, detector efficiency and source quality, which lithography cannot solve alone.

    photonic quantum hardwarephotonic waveguidesnanophotonic structuresASML, XanaduSemiWikiPartnership/M&A
  2. Impact score 55

    ASML Shipments to China Surge to 23% of System Sales in Q3 2026. 📰 News Source: https://buff.ly/PTDqgtj

    According to information published by TrendForce on October 20, 2026, ASML's shipments to China surged to 23% of its system sales in Q3 2026. The source provides only this shipment share figure; the cause of the increase is not stated, and no additional financial or shipment details are given.

    ASML system salesASMLTrendForce Official (Market Data)

Sat, Oct 17

  1. Impact score 30

    Chinese Startup Unveils First Homegrown EUV Laser Source

    Chinese startup Langdao Silex has demonstrated the development of the first homegrown extreme ultraviolet lithography (EUV) laser source, gradually paving the way for China's complete supply chain independence. The system, named FlintNano LPP-OXXO, reportedly delivers over 15 W of EUV output and uses components that are approximately 90% domestically sourced or developed. It relies on laser-produced plasma (LPP), a technique using high-powered lasers to generate plasma and produce the EUV radiation required for advanced chip manufacturing, similar to the process used by ASML. According to specifications published by Langdao Silex, the FlintNano system employs a 1,000 W driving laser operating at repetition rates between 1 and 20 kHz; its conversion efficiency exceeds 2%, and the company claims the equipment can operate continuously for more than 100 hours. The prototype is reportedly suitable for wafer exposure testing, although further finetuning is still necessary. As background, EUV lithography tools are banned from being sold in China after the United States government pressured the Dutch government to halt sales of these advanced tools; ASML has never shipped a single EUV scanner to China, as the Dutch government, under pressure from the United States, blocked exports in 2019, and no system has been deployed, though ASML continues to ship DUV systems to Chinese customers. More importantly, developing a light source is only one part of building a complete EUV scanner, which also requires extremely precise reflective optics, sophisticated wafer positioning mechanisms, and complex integration across numerous subsystems.

    EUV激光光源Langdao Silex, ASMLTechPowerUp

Fri, Oct 16

  1. Impact score 10

    Chip Industry Week In Review

    This is a weekly review roundup published by Semiconductor Engineering listing headline topics from the week, including: fab expansion accelerating; China advancing memory and EUV; Teradyne's test deal; SEMICON West and OCP highlights; 3D SiP; TSMC and ASML signals; 300mm fab spending; optical and 3D-compute startups raising fresh funding; and quantum hardware advances. The source provides only a topic list without specific figures, dates, prices, capacity-change magnitudes, deal terms or event statuses, and does not state any cause.

    memoryTSMC, ASML and 3 totalSemiconductor Engineering
  2. Impact score 45

    Chinese chip toolmakers buy into hybrid bonding as Huawei looks beyond transistor shrinking

    China's largest chip equipment makers are buying their way into hybrid bonding, an advanced packaging step that global players from Besi to ASML are also chasing. Analysts say the stakes are different for Chinese firms: with US export controls limiting access to the tools needed for leading-edge transistor scaling, stacking and connecting chips more densely has become one of the few routes left to narrow the performance gap, an approach Huawei has framed as its Tau scaling law. The acquisitions are in progress; specific targets, deal values and timelines are not stated in the source.

    hybrid bondingadvanced packagingHuawei, Besi and 3 totalDigiTimes AsiaPartnership/M&A
  3. Impact score 60

    ASML patents point to a hybrid bonder as chip toolmakers crowd into packaging

    Patent filings analyzed by research firm SemiAnalysis suggest that ASML appears to be developing a die-to-wafer (D2W) hybrid bonder, which would be its second move into advanced packaging. The tool would pit ASML against Besi, the current leader, and a growing group of front-end rivals chasing the same market. As context, as shrinking transistors becomes harder and costlier, advanced packaging has become the place chip equipment makers look to for their next leg of growth. The source does not state any timeline or production plan; this is an indication derived from patent filings and does not constitute a released or shipping product.

    die-to-wafer (D2W) hybrid bonderASML, BesiDigiTimes Asia

Thu, Oct 15

  1. Impact score 75

    EU negotiates sanction swap with China to rescue critical ASML supplier

    According to an Oct. 14 Bloomberg report cited by the article published 15 October 2026, the EU is in talks with China to lift restrictions China imposed on Sindlhauser Materials GmbH, a German precision-manufacturing and advanced-coatings firm in ASML's supply chain; in return, the EU would remove restrictions it placed on one unnamed Chinese firm accused of aiding Russia. The swap was discussed during EU Commissioner for Trade and Economic Security Maroš Šefčovič's visit to Beijing; the EU is expected to make the first move, with any delisting on its end requiring unanimous support from member states, and both sides agreed to share more information and give advance warning on future export restrictions. In July 2026, China put Sindlhauser, along with 13 other European companies, on its export-control list in apparent retaliation for the EU's 21st Russia sanctions package, which sanctioned several Chinese firms accused of supplying Moscow with components usable for weapons; Beijing's official reason was the firms' alleged dealings with Taiwan. The restrictions ban Chinese exporters from selling dual-use items to the firm and prohibit foreign companies and individuals from passing on China-origin dual-use items to it, blocking third-party sourcing. Sindlhauser relies almost entirely on Chinese rare earths and critical minerals; the German and Bavarian state governments have helped explore workarounds such as alternative suppliers and recycling existing materials, but the company risks going out of business in the coming months if the sanctions remain.

    Chinese rare earthscritical mineralsdual-use itemsSindlhauser Materials GmbH, ASMLTom's HardwarePolicy/Regulation
  2. Impact score 60

    ASML expects demand to outstrip supply in 2027 and 2028

    ASML says its planned capacity for 2027 and 2028 will not fully meet customer demand, and it is therefore investigating ways to increase capacity for 2028 beyond what it has already announced. ASML already plans to increase its low-NA EUV and DUV immersion capacity by 30% in 2027, compared with 2026 levels; per its Q2 report, it was investigating a further 30% increase in 2028, and ASML now wants to go beyond that 2028 figure. As for the cause, the source states that customers keep raising short- and medium-term demand forecasts, with the main driver being how large and how long-lasting customers expect AI-related investment to be, and some customers have asked about placing orders for 2029 and even 2030. Third-quarter results, published October 15, 2026: total net sales reached a record EUR 11.7 billion, up from EUR 9.3 billion in the previous quarter; Installed Base Management (service and field upgrades) accounted for EUR 3.3 billion, above guidance; gross margin rose to 57.5% from 54.0% in Q2; net income was EUR 5.0 billion, up from EUR 2.9 billion; ASML sold 113 new lithography systems (up from 86) and eight used systems. For Q4, ASML expects total net sales of EUR 14.2–15.2 billion with gross margin around 57%, and full-year sales of EUR 44–45 billion with gross margin around 56%. The capacity expansion remains planned/under investigation, not implemented.

    low-NA EUV lithography capacityDUV immersion lithography capacityASMLEvertiqCapacity Change
  3. Impact score 60

    ASML struggling to keep up with demand for chipmaking equipment as AI spending continues to boom

    ASML published its Q3 2026 earnings on October 14, 2026, saying the unprecedented spending and investment brought about by the AI boom is not slowing down, with customers already lining up to place orders for its advanced chipmaking tools for 2029 and 2030 output; CEO Christophe Fouquet said the company would struggle to meet demand despite plans announced in July to raise capacity by 30% in 2027 and another 30% in 2028. The company also confirmed it will raise prices starting in 2027, with the full effect showing in 2028. The Q3 2026 report detailed a net profit of €4.96 billion on net sales of €11.7 billion; the company projects Q4 sales of €14.2 billion to €15.2 billion ($15.9 billion to $17 billion) and boosted its full-year sales projections from at least €43 billion to €44-45 billion. ASML's shares rose 2% on Wednesday, up almost 70% so far this year, with its €586 billion market valuation making it Europe's largest firm by market cap. Additionally, Terafab will reportedly receive its first EUV chipmaking tool from ASML in mid-2027; CFO Roger Dassen said it is "still kicking the tires on the exact size of that (Terafab) opportunity."

    advanced chipmaking toolsEUV chipmaking toolASMLTom's HardwareCapacity Change
  4. Impact score 58

    Prodrive to Open South Korea Office by Early 2027

    Dutch company Prodrive Technologies said at SEMICON West 2026, held at the Moscone Center in San Francisco on Oct. 13 (the event runs Oct. 13 to 15), that it plans to open an office in South Korea between late 2026 and early 2027 to strengthen support for local customers, including Hanwha Semitech, and expand its presence through sales activities. The company said it is recruiting local employees in preparation for the office opening and expects to open "around the end of this year or early next year," considering Dongtan and Pangyo as potential locations. The Korean office will handle sales and customer support, with a small team being recruited; a representative said there are no plans to establish manufacturing facilities in Korea because Korean customers can be supported from Malaysia, China and Europe. Prodrive is also building a new manufacturing facility in Malaysia, operates production sites in the Netherlands, Boston in the US, and China, has sales offices in Japan and Israel, and employs approximately 2,300 people worldwide. It develops modules and provides system integration services for semiconductor equipment manufacturers; in South Korea, Hanwha Semitech collaborated with Prodrive to develop a hybrid bonder, and earlier this year the second-generation hybrid bonder, SHB2 Nano, was manufactured and assembled at Prodrive's Netherlands facility before being brought to South Korea. Prodrive also supplies linear motors and servo drives for magnetic levitation systems used in ASML's extreme ultraviolet (EUV) lithography equipment.

    precision stagesmotion controllersmotorsProdrive Technologies, Hanwha Semitech and 3 totalThe ElecCapacity Change
  5. Impact score 60

    XIVER adds ASML DUV lithography to its Eindhoven foundry

    On October 15, 2026, Dutch specialty foundry XIVER announced it has acquired an ASML PAS 5500 DUV lithography tool for its Eindhoven foundry, with the tool expected to be operational in 2027. The DUV stepper will complement XIVER’s existing i-line lithography equipment, enabling finer and more precisely aligned structures, including double-sided wafer patterning and sub‑micron 3D micromachining. XIVER says it will be the only mid‑size pure‑play foundry offering in‑house DUV lithography. the source does not state the cause. XIVER was carved out of Philips at the High Tech Campus in Eindhoven and acquired by Dutch investors in early 2025. Since then, it has been expanding its manufacturing capabilities in line with its customers’ roadmaps and expected capacity needs.

    ASML PAS 5500 DUV lithography toolXIVER, ASMLEvertiqCapacity Change
  6. Impact score 0

    ASML hits record €11.7 billion sales as AI chip demand surges

    ASML reported record third-quarter 2026 sales of €11.7 billion ($13.6 billion), up 25% from the previous quarter, as growing demand for AI chips continues to drive semiconductor equipment investment.

    AI chipsASMLeeNews Europe
  7. Impact score 60

    ASML holds back 2029-2030 orders and confirms first price increases as EUV shortage deepens

    On its third-quarter 2026 earnings call held on October 14, ASML said it has shifted from taking orders to allocating them: customers want to place orders as far out as 2029 and 2030, but it will not accept those orders until it has weighed total demand against its own capacity. ASML also confirmed, for the first time, that customers have agreed to pay more for its most critical machines. The source frames this against a deepening EUV shortage.

    EUV lithography toolsASMLDigiTimes AsiaCapacity Change
  8. Impact score 60

    Korean memory makers accept ASML parts price hike, leaving TSMC as the open question

    Memory chipmakers have reportedly become the fastest-growing source of demand for ASML, and the two largest Korean memory makers have reportedly accepted higher replacement-part prices from the Dutch company. ASML is preparing to charge more for its most critical tools. Attention now turns to TSMC, ASML's largest customer, which according to earlier reports was an opponent of the price increases; whether TSMC accepts remains an open question.

    ASML replacement parts for lithography toolsASML most critical toolsASML, TSMCDigiTimes AsiaPrice Movement

Wed, Oct 14

  1. Impact score 60

    ASML’s EUV Expansion Runs Through Zeiss

    ASML's plans to expand EUV production depend partly on Zeiss's ability to increase qualified precision-optics output.

    EUV productionqualified precision-optics outputASML, ZeissEE TimesCapacity Change
  2. Impact score 0

    ASML Shipments to China Surge to 23% of System Sales in Q3 2026

    ASML's Q3 2026 financial results show shipments to China surged to 23% of system sales, up from 14% in the previous quarter, becoming one of its strongest areas. Chinese semiconductor manufacturers are rushing to stockpile more tools. Taiwan remains the largest buyer at 32%, followed by South Korea at 31%. The United States is reportedly pressuring the Dutch government to completely halt tool exports to China. CXMT and YMTC have secured sufficient DUV lithography tools from ASML to support their growth plans for the next three years.

    shipments to Chinasystem salesASML, Chinese semiconductor manufacturers and 4 totalTechPowerUpInventory Shift