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Chip Industry Week In Review

What happened

This is a weekly review roundup published by Semiconductor Engineering listing headline topics from the week, including: fab expansion accelerating; China advancing memory and EUV; Teradyne's test deal; SEMICON West and OCP highlights; 3D SiP; TSMC and ASML signals; 300mm fab spending; optical and 3D-compute startups raising fresh funding; and quantum hardware advances. The source provides only a topic list without specific figures, dates, prices, capacity-change magnitudes, deal terms or event statuses, and does not state any cause.

Impact and signal

Low impactImpact score: 10/100

Affected components and suppliers

memory

TSMC ASMLTeradyne

weekly reviewfab expansionEUV300mm fab spendingSEMICON WestOCP

Source and time

Source: Semiconductor Engineering · 10/16/2026 · View original source

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ASML and other critical semiconductor equipment suppliers expedite shipments to Musk's TerafabTom's Hardware · 10/21/2026
ASML's roadmap for chipmaking lithography tools examined — from DUV to Low-NA, High-NA, Hyper-NA, and beyondTom's Hardware · 5/1/2026
[News] ASML Reportedly Plans 10% Parts Price Hike in South Korea Starting Jan. 2027; Equipment Prices May Also RiseTrendForce · 10/11/2026
ASML looks to increase prices of its Low-NA EUV tools beyond existing productivity-based model — company wants to capture the value of all the advantages its tools offer, not just wafer throughput improvementsTom's Hardware · 7/17/2026
ASML's planned Low-NA EUV machine price hikes reportedly frustrate TSMC — lithography machine maker comes knocking to make bank on TSMC's profitable fabs, potentially costing the Taiwanese chipmaker billionsTom's Hardware · 7/17/2026
ASML becomes Europe's most valuable company ever as analysts bet on higher EUV output — its market cap hit $674 billion this weekTom's Hardware · 6/7/2026

Chip Industry Week In Review

What happened

Impact and signal

Affected components and suppliers

Source and time

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