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Broadcom

NuAxi groups public briefings that mention Broadcom: product launches, capacity and pricing signals, and supply-chain changes. The page updates continuously.

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Latest briefings

Fri, Oct 30

01:31Impact score 76
[News] Intel’s Mixed 3Q26: PC, Israel Fab Weigh on Guidance, but EMIB Brightens as a Couple of Customers Near Announcement
Reported on 2026-10-30, Intel's 3Q26 results were mixed: Data Center and AI (DCAI) revenue surged 78% to $7.3 billion and operating income more than tripled to $3.04 billion; however, according to Reuters, a fatal explosion in October at Intel's Kiryat Gat fab in Israel, which primarily produces data center processors using 10nm technology, is expected to cost roughly $600 million in revenue over two quarters, and sluggish PC demand could persist through 1H27. Reflecting these headwinds, Intel forecast fourth-quarter revenue of $15 billion to $16 billion, missing the $17.07 billion LSEG consensus, with adjusted earnings projected at 25 cents per share versus analysts' 43-cent expectation. CFO David Zinsner said the incident would reduce fourth-quarter revenue by roughly $300 million and shave 200 basis points off gross margin, with a similar revenue hit expected in 1Q27; after a two-week shutdown, Intel aims to begin restoring production at the Israeli facility by the end of this week. In the PC business, 3Q26 sales fell 5% to $8.10 billion, missing analysts' $8.98 billion estimate, and Zinsner expects fourth-quarter PC business revenue to plunge by a percentage in the mid-20s. CEO Lip-Bu Tan said he was disappointed the company could not meet strong customer demand, citing manufacturing supply shortages, an unprecedented memory crunch and resulting PC demand weakness as near-term challenges; he also noted that despite rapidly ramping Intel 3 wafer output, an industry-wide shortage of advanced organic substrates for EMIB packaging continues to limit production scaling. Zinsner also warned the chipmaker is unlikely to generate positive cash flow in 2026; Intel had raised its capital expenditure guidance from $18 billion to $20 billion in July, with a further substantial increase expected in 2027 to support its manufacturing buildout. On the positive side, Zinsner expects industry-wide server CPU unit shipments to grow more than 30% in both 2026 and 2027; Intel Foundry revenue surged 58% to $6.7 billion in 3Q26 including internal sales, with its operating loss narrowing to $1.85 billion from $2.32 billion a year earlier. Tan said a couple of customers will be ready to announce adoption of Intel's EMIB/EMIB-T advanced packaging over the next two quarters, and that in October Intel delivered its industry-standard 0.9 process design kit (PDK) for the 14A process to select customers as planned. TrendForce expects Google to adopt EMIB-T in 2027, while AWS is also testing EMIB technology; industry sources earlier suggested Google's TPU v9 lineup includes three variants: Broadcom-designed WhaleFish (expected to use TSMC's CoWoS-L with mass production slated for 2H27), MediaTek-designed HumuFish (set for 1H28 mass production relying exclusively on Intel's EMIB-T) and TriggerFish (also planned to use EMIB-T, targeted for 2H28 or later).
EMIBEMIB-Tadvanced organic substratesIntel, Google and 5 totalTrendForceDisaster/Disruption

Thu, Oct 29

08:00Impact score 10
[Tech Note] Why does AI still have to wait with tens of thousands of GPUs? How silicon photonics and CPO are building the ‘highways of light’
This is a background technology column published on October 29, 2026 (authored by Professor Younghyun Kim of Hanyang University ERICA), explaining — not reporting — industry developments; it contains no price, capacity or policy event. The article states that AI data center bottlenecks have shifted from GPU compute speed to data movement: copper interconnects suffer signal loss, heat and repeater power overhead at high speeds and longer distances, so networks are shifting to silicon-photonics-based optical interconnects; co-packaged optics (CPO) places optical engines next to the switch ASIC to shorten electrical paths, increase bandwidth density and save power. It cites Meta's evaluation of a CPO switch system presented at ECOC 2025, in which power consumption in the optical interconnect portion was approximately 65% lower than a comparable pluggable architecture, with connection stability confirmed under the specific test conditions; companies such as NVIDIA and Broadcom are accelerating commercialization by introducing network products incorporating CPO technology. The article also describes LPO (removable modules with the DSP eliminated) and NPO (optical engines close to but outside the switch package) as alternative approaches, explains that HBM and CPO reduce GPU data-wait time at the memory and network levels respectively, and notes remaining CPO challenges including laser light supply, fiber connection, heat from ASICs, and yield improvement.
co-packaged optics (CPO)silicon photonics HBMNVIDIA, Broadcom and 3 totalSK Hynix Newsroom
07:20Impact score 30
Seagate's High-Capacity HDDs Gain Broadcom Compatibility Approval
Seagate said on Oct. 28 that its Mozaic drives have become the only shingled magnetic recording (SMR) products included on Broadcom's host bus adapter (HBA) approved vendor list, securing compatibility between its high-capacity hard disk drives and Broadcom components that connect servers and storage devices. Mozaic is Seagate's HDD platform incorporating heat-assisted magnetic recording (HAMR) and SMR technologies: HAMR increases recording density and drive capacity, while SMR records data tracks in overlapping patterns resembling roof shingles. An HBA is a component used in data centers to connect multiple HDDs and identify and manage individual drives. Seagate also announced its fiscal first-quarter 2027 results on Oct. 28: revenue for the quarter ended Oct. 2 rose 61% to $4.233 billion from $2.629 billion a year earlier, and GAAP net income reached $1.761 billion, 3.2 times the $549 million recorded a year earlier. Chairman Dave Mosley said growth in data creation, retention and reuse is expanding storage demand and that long-term visibility into customer demand supports the company's growth outlook.
high-capacity HDDhost bus adapter (HBA)Seagate, BroadcomThe Elec
02:24Impact score 40
Chip Earnings Power Averages Higher as Nasdaq Volatility Cools Midweek
This is a market roundup (paid press release) reporting that major U.S. indices pushed higher midweek on semiconductor and tech earnings: the S&P 500 rose 1.51% over the week's three sessions to close at 7,739.13; the Nasdaq Composite rose 1.98% for the week to 26,468.60; the Dow gained 0.62% for the week to 52,536.29; and the VXN, a measure of Nasdaq volatility, fell 3.51 points for the week to 24.79. The source attributes the gains to semiconductor and tech earnings. On earnings: Texas Instruments reported third-quarter revenue of $6.06 billion, up 28% from the same quarter a year ago, with net income of $2.43 billion, EPS of $2.62, and operating profit up 73% to $2.87 billion, and guided fourth-quarter revenue of $5.80 billion to $6.30 billion with EPS of $2.45 to $2.79. On Broadcom: Bank of America, Blackstone, Citi and Morgan Stanley announced a $63 billion financing structure, executed through a special purpose vehicle to purchase Broadcom XPU AI accelerators and networking solutions to be leased to Anthropic, with deliveries expected starting in calendar 2027 and Broadcom providing residual value support equivalent to the first lien portion of the financing. The article also mentions Meta, IBM and Lockheed Martin developments as additional company news.
semiconductorTexas Instruments Incorporated, Broadcom Inc.Yahoo Finance — TXN

Wed, Oct 28

10:03Impact score 50
Anthropic's surging compute demand fuels ASIC prospects, favoring Broadcom over MediaTek
Anthropic disclosed details of its computing partnerships with Google, Amazon Web Services (AWS), Microsoft, Advanced Micro Devices (AMD) and other providers in its S-1 filing for an initial public offering (IPO), revealing distinct cooperation models and chip technologies across its partner ecosystem. Per the title, Anthropic's surging compute demand fuels ASIC prospects, favoring Broadcom over MediaTek.
ASICBroadcom, MediaTekDigiTimes AsiaPartnership/M&A

Tue, Oct 27

14:33Impact score 55
Anthropic IPO filing exposes massive compute buildout spanning TPUs, GPUs, and dedicated data centers
Anthropic's IPO filing reveals an infrastructure strategy extending far beyond conventional cloud procurement: the Claude developer has locked in hundreds of billions of dollars of compute capacity across Google, Amazon, Microsoft, Broadcom, and a growing roster of GPU infrastructure providers, spanning TPUs, GPUs, and dedicated data centers. This is a capacity commitment arrangement disclosed in the IPO filing; the source does not state the cause.
TPUsGPUsGoogle, Amazon and 4 totalDigiTimes Asia

Thu, Oct 22

23:00Impact score 58
Evertiq Expo Warsaw: Top 10 chip companies took two-thirds of a record market
According to Omdia data presented at Evertiq Expo Warsaw on October 22, 2026, the ten largest semiconductor suppliers grew revenue by more than 30% in 2025 (30.4%, to USD 562.1 billion), almost three times as fast as the rest of the industry, and now account for nearly 68% (67.6%) of a record market worth USD 831 billion that grew 23.3%. Nvidia's revenue rose by USD 52.9 billion to USD 150.3 billion (up 54.3%), its share of total semiconductor revenue rose from about 14.5% to just over 18% (18.1%), its lead over second-placed Samsung Electronics nearly tripled from USD 22.3 billion to USD 64.5 billion, and it accounted for roughly a third of the industry's growth. Samsung grew 14.2% to USD 85.8 billion, its share fell from 11.1% to 10.3%, and its lead over SK hynix shrank from USD 27.8 billion to USD 18.5 billion. SK hynix grew 42.3% to USD 67.2 billion and moved into third place; Micron, the fastest grower in the top ten at 56.3% (up USD 16.4 billion to USD 45.6 billion), climbed from seventh to fifth past Broadcom and Qualcomm; Broadcom grew 28.0% to USD 39.5 billion but stayed sixth; Qualcomm grew 11.6% to USD 38.9 billion yet dropped from fifth to seventh with its share falling from 5.2% to 4.7%; AMD grew 33.4% to USD 32.7 billion and stayed ninth; Apple's USD 34.4 billion is a value Omdia assigns to its in-house semiconductor activity, not external chip sales; Intel was the only top-ten company whose revenue fell, declining 3.7% to USD 48.5 billion and dropping from third to fourth, with its share falling from 7.5% to 5.8%. Between 2023 and 2025 total semiconductor revenue grew about 53%, the top ten grew about 90%, all other suppliers roughly 8% combined, and Nvidia plus the three major memory makers (Samsung, SK hynix, Micron) went from 24% of industry revenue in 2023 to 42% in 2025. According to Omdia, the DRAM market nearly tripled in two years, from just over USD 50 billion in 2023 to more than USD 150 billion in 2025, growing more than 50% in 2025 alone; Lino Jeng, Senior Principal Analyst at Omdia, said AI servers require not only more HBM but also significantly more system memory, particularly DDR5; Ewelina Bednarz of Evertiq explained that as manufacturers shift capacity toward HBM and high-capacity server DRAM, supply of other memory types tightens and prices rise beyond HBM as well, and noted the figures measure revenue, not volume, with price and product mix explaining much of the growth. Omdia's September update shows industry revenue reached USD 752 billion in the first half of 2026, about 90% of the full-year 2025 total; second-quarter revenue alone passed USD 425 billion, up more than 31% from the first quarter; memory made up more than half of the market in the second quarter, and DRAM, NAND and NOR all set quarterly revenue records; excluding memory, revenue rose just over 10% from the previous quarter against a historical second-quarter average of just over 3%. The SIA reported that global semiconductor sales passed USD 1 trillion year to date through August 2026, the first time the industry reached that level, with August sales of USD 159.7 billion, up 144.3% year on year and the 18th consecutive month of growth; SIA expects full-year 2026 sales to exceed USD 1.6 trillion; SIA figures are based on World Semiconductor Trade Statistics data and use a different method from Omdia's, so the two sets of numbers are not directly comparable.
semiconductor marketmemoryDRAMNvidia, Samsung Electronics and 10 totalEvertiq
02:30Impact score 60
[Breaking] Google Reportedly Sticks With Intel EMIB-T Despite 35% Substrate Yields as HumuFish Schedule Tightens
Google reportedly remains committed to Intel's EMIB-T for HumuFish despite poor substrate yields. According to industry sources, EMIB-T substrate yields were around 35% in 3Q26, well short of the 50% target set for year-end; the reported causes are thermal expansion differences between ABF substrates and embedded silicon bridges that make precise alignment difficult during high-temperature processing, and NCF (Non-Conductive Film) applied beneath the bridges' TSVs trapping air bubbles during bonding, potentially weakening adhesion. Despite market rumors of a HumuFish delay and the possibility of a switch to TSMC's CoWoS-L, supply chain checks indicate HumuFish remains '100%' committed to EMIB-T. Intel has adjusted its substrate electroplating process, and suppliers including Ibiden, Unimicron, and Shinko continue working to improve yields. Google's TPU v9 lineup is confirmed to include three variants: Broadcom-designed WhaleFish (expected to adopt TSMC's CoWoS-L, with mass production slated for 2H27), MediaTek-designed HumuFish (set for 1H28 mass production, relying exclusively on Intel's EMIB-T), and TriggerFish (also planned to use EMIB-T, with production targeted for 2H28 or later). Per TechNews citing analyst Ming-Chi Kuo, TriggerFish is positioned as an upgraded TPU v9 with stronger inference capabilities and features three key upgrades over HumuFish: 2–3 times the SRAM capacity, an additional simulation die, and a shift to HBM4E from HumuFish's HBM4. On delays, the tape-out of Google-designed Compute Die A, built on TSMC's N2 process, has been pushed back to late October while other dies remain on schedule, and the delay is expected to push back trial production of the complete package; Commercial Times further notes the MediaTek-involved Google TPU v9 project (HumuFish) could see its tape-out pushed back to January 2027 due to design revisions, potentially delaying shipments until 1Q28. With HumuFish not slated for mass production until 1H28, the supply chain still has time to address EMIB-T's remaining issues, but a tape-out slip to January 2027 could compress that cushion.
Intel EMIB-T substratesABF substratesNCF (Non-Conductive Film)Google, Intel and 8 totalTrendForce

Wed, Oct 21

20:00Impact score 60
Apple brings more iPhone component production to the US
On October 21, 2026, Apple announced an expansion of its American Manufacturing Program: Qnity Electronics, based in Delaware (it joined the programme in March), will produce in the US the advanced films used in the variable aperture of the iPhone 18 Pro's main camera. Apple also signed Pennsylvania-based Perryman Company to supply titanium for the foldable iPhone Duo, with a commitment of up to USD 100 million over three years. According to Apple, nearly 100 components in its newest iPhones now come from American companies, and suppliers in more than a dozen states provide US-made components for the iPhone Duo and iPhone 18 Pro. Among them: Broadcom is expanding and modernising its Fort Collins, Colorado facility under a USD 1.5 billion investment announced in July, with a multi-year agreement covering more than 15 billion US-made chips; Corning's Harrodsburg, Kentucky site will produce all cover glass for the iPhone and Apple Watch sold worldwide by the end of 2026; Coherent supplies VCSEL lasers for Face ID from Sherman, Texas; TSMC's Arizona fab is set to produce more than 100 million chips for Apple in 2026, with construction of the north campus under way; Amkor broke ground on its first high-volume packaging and test facility in Peoria, Arizona in September 2025 and began construction of the building shell this year, with Apple as one of its first customers and the first two phases expected to employ more than 3,500 people. Apple also opened an Advanced Manufacturing Center in Houston in August, where it will start manufacturing the Mac mini this year in the same facility where it builds AI servers. The programme is part of Apple's USD 600 billion, four-year commitment to US manufacturing and innovation.
variable aperture camera filmstitaniumRF componentsApple, Qnity Electronics and 8 totalEvertiqCapacity Change
10:19Impact score 58
Broadcom-TOPPAN JV Opens Singapore FC-BGA Substrate Facility for AI Chip Production
Broadcom-TOPPAN JV AST has opened an FC-BGA substrate facility in Singapore for AI chip production. The 95,000-square-meter plant will produce large-body, high-layer-count substrates for AI computing and networking chips. The source uses 'will produce', indicating the plant's output remains in a planned status; the source does not state the cause.
FC-BGA substrateBroadcom, TOPPAN and 3 totalEE Times AsiaCapacity Change
01:00Impact score 10
The Industry Challenge: AI Is Forcing Semiconductor Innovation Beyond the Chip
Applied Materials held the unveiling of its EPIC Center on October 12, 2026, in Sunnyvale, CA, with President and CEO Gary Dickerson and the founding partners in attendance. The article states that as AI models grow and applications expand, the challenge is no longer simply to make individual chips faster or more efficient, but to build complete computing systems that deliver greater performance, move more data and consume less energy while bringing new technologies to market faster. The event brought together perspectives from SK hynix, TSMC, Micron, Intel, Samsung, Broadcom, NVIDIA and Qualcomm alongside Applied Materials, with the common conclusion that advances in one part of the system increasingly depend on progress in others. AI computing places intense demands on processors, memory, interconnects, advanced packaging and power efficiency; as AI workloads grow, moving data between memory and compute becomes a major constraint on performance and energy consumption, making HBM, closer memory-logic integration and new packaging approaches central to system design. For interconnects, large AI systems distribute workloads across multiple processors, making communication speed, latency and energy use increasingly consequential, and approaches such as advanced chip integration and co-packaged optics require progress in materials, processes, packaging and system architecture together. Thermal management adds further complexity. The article argues that no single company can solve these problems alone, that earlier collaboration can expose constraints sooner and align development priorities, and that Applied Materials' EPIC Center is designed to bring industry partners together to work on materials, processes and equipment relevant to future semiconductor technologies.
processorsmemoryhigh-bandwidth memory (HBM)Applied Materials, SK hynix and 9 totalSemiWiki

Tue, Oct 20

10:32Impact score 60
Commentary: Samsung's US 2nm ramp faces no room for error
According to commentary, Samsung Electronics' 2nm mass-production capability at its Taylor, Texas fab has become critical to its efforts to close the gap with TSMC, while Tesla's AI5 chip delivery schedule and Broadcom's potential 2nm orders hang in the balance. The company's ability to achieve competitive yields and stable output at the US facility will determine whether it can turn major customer orders into a broader foundry comeback. The source does not state the cause, and these statements are commentary rather than realized yield or order outcomes.
2nm processSamsung Electronics, TSMC and 4 totalDigiTimes AsiaCapacity Change

Mon, Oct 19

23:30Impact score 58
[News] Intel Claims Industry’s Only High-Volume 300mm InP Silicon Photonics Capability as CPO Gains Momentum
According to Wccftech, at the 2026 Open Compute Project (OCP) Global Summit, Intel — which is expanding its silicon photonics capabilities as demand for high-bandwidth optical interconnects grows across AI and high-performance computing (HPC) — claimed to be the only high-volume foundry capable of supplying 300mm indium phosphide (InP) silicon photonics at scale to the broader industry; the technology is intended to support next-generation near-package optics (NPO) and co-packaged optics (CPO). The source notes that conventional InP substrates are generally limited to 150mm (6-inch) wafers, with 3-inch and 4-inch formats still widely used, and that InP crystals are brittle, grow slowly, and present defect-control challenges, limiting laser chip output per wafer and slowing capacity expansion; Intel integrates InP-based laser technology into its 300mm silicon photonics manufacturing platform, aiming to improve production efficiency and scalability. Per TrendForce, NVIDIA has begun shipping its Spectrum-X CPO switches to select partners (developed jointly with TSMC using its Compact Universal Photonic Engine (COUPE) technology), Broadcom continues limited shipments of its 51.2 Tb/s Bailly CPO switches, and at OCP 2026 showcased its third-generation Tomahawk 6-Davisson CPO switch with 102.4 Tb/s of switching capacity and 200 Gbps per channel; TSMC plans to begin production of its COUPE-on-substrate solution in 2026, targeting twice the power efficiency and a tenfold reduction in latency compared with board-level pluggable optics. Per ijiwei, Zhongji Innolight has established a dedicated CPO production line and begun small-volume production of 800G CPO optical modules; some customers have placed orders, with shipments potentially beginning in 2027 and broader adoption expected in 2028, and in September 2026 Huawei introduced its NPO-based Ascend 960 supernode for large-scale AI training and inference. TrendForce states that testing remains a key obstacle to CPO mass production: while optical alignment times have fallen to seconds or less, complete testing of a single photonic integrated circuit (PIC) can still take more than 100 seconds, shifting the bottleneck toward testing speed and cost; TrendForce expects 2027 to be a pivotal year for integrating CPO testing systems, with 2028 a critical period for assessing readiness for large-scale production.
300mm InP silicon photonicsInP-based laser technologyco-packaged optics (CPO)Intel, NVIDIA and 6 totalTrendForceCapacity Change
19:28Impact score 10
Broadcom Wi-Fi bug turns sweet 16, still lets strangers hijack your router
Security researcher Quentin Kaiser disclosed two bugs in Broadcom's proprietary Wi-Fi implementation, dubbed "WPSplinter," dating back to at least 2010. The bugs lie in Broadcom's handling of Wi-Fi Protected Setup (WPS): specially crafted WPS messages can corrupt the router's memory, allowing an attacker within Wi-Fi range to run their own code on the device without needing the password. According to Kaiser, Broadcom knew about the vulnerability in 2018 and released a partial fix without public disclosure, subsequently recommending manufacturers switch to the open-source hostapd software. Kaiser demonstrated working exploits against routers supplied by Belgian providers Proximus and Orange — on an ASKEY TCG3000 gateway he ran code and extracted the Wi-Fi password — and also found the flaw in Netgear and Technicolor routers supplied by VOO. He estimates around 850,000 Proximus gateways, 500,000 at VOO and 210,000 at Orange Belgium could be affected, roughly 1.56 million routers in Belgium alone (rough estimates, he admits), with worldwide numbers potentially considerably higher. Routers running older eCos-based chips (BCM3380, BCM3383, BCM33834) may never get a fix — Kaiser calls the flaw a "forever day" — while routers using Linux-based BCM3390, BCM65xx, and BCM68xx chips are also at risk unless manufacturers switch to hostapd. Kaiser first reported the vulnerabilities to Broadcom on July 18 with a second report on July 27 and a 90-day disclosure window; Broadcom responded on July 28 saying a patch was available, then declined to assign a CVE identifier; CERT/CC closed its case on August 4. By October 15, the day before his presentation, Kaiser said none of the affected devices he had identified had received a patch. He has not reported evidence of attacks in the wild. The source does not state any price or supply impact.
Broadcom proprietary Wi-Fi implementationWi-Fi Protected Setup (WPS)Broadcom, ASKEY and 7 totalThe Register
15:56Impact score 30
Six leading opto component makers bet on VCSEL near-packaged optics
TrendForce's latest report '2027 Infrared Sensing and Optical Communication Market Trend' shows that rapidly growing demand for data transmission in expanding data-center networks is increasing interest in vertical-cavity surface-emitting laser (VCSEL)-based near-packaged optics (NPO). This technology is favored for its low power usage, easier maintenance, and a mature supply chain. Six leading opto component makers, including Lumentum, Furukawa Electric, Coherent, Broadcom, ams OSRAM, and HiSilicon, are investing heavily in R&D in this area.
VCSEL (vertical-cavity surface-emitting laser)near-packaged optics (NPO)Lumentum, Furukawa Electric and 6 totalSemiconductor Today
03:47Impact score 60
[News] MediaTek’s Google TPU v9 Shipments May Slip to 1Q28; ASIC Race Heats Up as Taiwan Firms Eye Opportunities
According to Commercial Times, citing institutional investors, Google's TPU v9 project, involving MediaTek, could see its initial tape-out delayed until January 2027 following design revisions, with shipments potentially pushed back to the first quarter of 2028; the November 2026 sampling target remains unchanged, and the production-version tape-out is expected in the second quarter. The report notes that revisions to Google's TPU v9 Core A design, codenamed Humifish... wait, Humufish, have delayed development by approximately three weeks, affecting the Core B and I/O designs handled by MediaTek. According to TrendForce, the chip is expected to adopt Intel's EMIB-T advanced packaging, with substrate yields remaining a key challenge to production scalability and cost competitiveness. Bloomberg, citing sources, reports that ByteDance is nearing an agreement to purchase MediaTek's data center chips, potentially making it MediaTek's second major ASIC customer after Alphabet's Google. Among Taiwanese ASIC design firms: GUC, supported by cloud customers' CPU and ASIC programs, reported record September revenue of NT$7.145 billion, up 97.8% year over year; Alchip posted September revenue of NT$9.979 billion, surging 496% year over year as shipments of 3nm AI accelerators increased. Faraday has obtained Samsung's 2nm process design kit (PDK) to pursue related design opportunities; per Commercial Times, Samsung's 4nm capacity is reportedly fully utilized, prompting some AI ASIC customers to evaluate its 2nm node. Faraday has also completed its design environment setup for Intel's 18A-P and begun offering design services, with plans to pursue more projects in 2027. Commercial Times, citing institutional investors, projects global AI ASIC accelerator shipments to reach 14.1 million units in 2027, up approximately 69% year over year.
Google TPU v9Core A (codenamed Humufish)Core BMediaTek, Google and 11 totalTrendForce

Wed, Oct 14

23:41Impact score 25
Co-Packaged Optics Moves from Promise to Production Planning
At the Ayar Labs CPO Summit, Meta, Broadcom, AMD, and others weighed in on readiness for a 2028 co-packaged optics (CPO) demand surge and the OCI MSA's role. The item is an industry-discussion piece about production planning ahead of 2028; the source does not state any price or supply-demand changes or give specific quantities.
co-packaged opticsAyar Labs, Meta and 4 totalEE Times

Thu, Oct 8

22:00Impact score 0
RT NEWS: #VCSEL demand projected to reach 650 million units by 2031, a 38% CAGR from 2025. Lumentum, Furukawa Electric, Coherent, Broadcom, ams OSRAM ...
VCSEL demand is projected to reach 650 million units by 2031, a 38% CAGR from 2025. Lumentum, Furukawa Electric, Coherent, Broadcom, ams OSRAM and HiSilicon are developing NPO, with several solutions expected in 2027-2028. The source does not state the cause.
VCSELLumentum, Furukawa Electric and 6 totalTrendForce Official (Market Data)

Wed, Oct 7

19:59Impact score 55
Samsung Foundry to Manufacture Anthropic AI ASIC on 2 nm Node
Samsung Foundry may be on the verge of securing a deal to manufacture Anthropic's AI ASIC on its SF2 2 nm node, with an initial volume of around 200,000 chips, designed by Broadcom targeting approximately 4,000 TOPS of INT8 compute and a TDP of 1,300 W per chip, supported by either 192 GB or 288 GB of HBM3E, using I-Cube 2.5D packaging; the chips are currently produced in South Korea and a new facility is planned in Taylor, Texas.
Anthropic AI ASIC on 2 nm nodeSamsung Foundry, BroadcomTechPowerUpPartnership/M&A

Thu, Oct 1

03:00Impact score 10
TSMC OIP Ecosystem Forum 2026: Broadcom’s View of ASICs and Ecosystems
Broadcom highlighted its strategic advantages in the ASIC sector at the TSMC OIP 2026 forum, emphasizing IP and ecosystem integration to solve future engineering challenges.
ASICCustom SiliconBroadcom, TSMCSemiWikiMarket Analysis