ASML patents point to a hybrid bonder as chip toolmakers crowd into packaging

What happened

Patent filings analyzed by research firm SemiAnalysis suggest that ASML appears to be developing a die-to-wafer (D2W) hybrid bonder, which would be its second move into advanced packaging. The tool would pit ASML against Besi, the current leader, and a growing group of front-end rivals chasing the same market. As context, as shrinking transistors becomes harder and costlier, advanced packaging has become the place chip equipment makers look to for their next leg of growth. The source does not state any timeline or production plan; this is an indication derived from patent filings and does not constitute a released or shipping product.

Impact and signal

Affected components and suppliers

Source and time

Source: DigiTimes Asia · 10/15/2026 · View original source