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[News] Semiconductor Packaging and Testing Capacity Race Intensifies as ASE, Samsung and Amkor Announced New Moves

What happened

ASE, Samsung, and Amkor are aggressively expanding global packaging and testing capacity, with ASE planning six new fabs and Samsung investing $4B in Vietnam. This expansion is driven by demand from AI, HPC, and data centers. Bearish: The significant, coordinated capacity increase across major OSATs signals a future easing of supply constraints, potentially pressuring pricing power.

Impact and signal

Medium impactImpact score: 60/100

Affected components and suppliers

Advanced PackagingChip Testing
capacity-expansioncapexoutsourced-assembly-and-test

Source and time

Source: TrendForce · 4/19/2026 · View original source

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