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Amkor

NuAxi groups public briefings that mention Amkor: product launches, capacity and pricing signals, and supply-chain changes. The page updates continuously.

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Tue, Oct 27

  1. Impact score 60

    Nvidia is bankrolling AI accelerator supply chain buildout to reserve production capacity

    On October 21, during GTC Berlin, Nvidia announced several multi-billion-dollar deals with six major supply chain partners — Ibiden, Unimicron, Samsung Electro-Mechanics, SPIL, Amkor and KYEC — across substrates, advanced packaging, semiconductor testing and optical engines, to expand production capacity and reserve capacity for its AI accelerators; expanded supply is to be available from 2027 through 2028, with commitments and production roadmaps stretching through 2028. For substrates, Nvidia plans to secure 2.5x dedicated substrate capacity over the next three years: it earlier signed a deal to provide a multibillion-dollar capacity reservation advance to support Ibiden's Ono Plant in Japan (targeting 3x the plant's current capacity); the Samsung Electro-Mechanics deal will support facility upgrades and new plants in Busan and Sejong, with Nvidia projected to account for a significant portion of its output by 2028; a capacity reservation agreement with Unimicron supports its substrate expansion in Taiwan, expected to start providing capacity by Q2 2027 and reach full capacity by mid-2028. For co-packaged optics, Nvidia signed with SPIL to expand optical engine production capacity 15x (1,400%) by mid-2027, with plans to double again by the end of 2028. With Amkor, Nvidia targets a more-than-300% increase in interposer wafer capacity by the end of 2028 through advanced packaging expansion in South Korea; Amkor confirmed the deal is worth $1.3 billion, bringing Nvidia's total investment across Amkor's Arizona and South Korea facilities to $3 billion. For testing, on October 13 Nvidia signed a deal to pay KYEC $1.1 billion to reserve testing capacity at KYEC's new $1.4 billion U.S. facility (high-volume production slated to begin in April 2027; Singapore high-volume production expected to begin February 2027), with testing capacity expected to double from calendar 2026 to 2027; KYEC currently handles nearly all of Nvidia's chip testing. Per its August 2026 disclosures, Nvidia had accumulated $279 billion in outstanding supply and manufacturing-capacity commitments by July 2026. All expansion figures are announced plans and targets, not yet realized.

    substratesadvanced packaginginterposer wafersNvidia, Ibiden and 7 totalTom's HardwareCapacity Change
  2. Impact score 60

    Amkor turns to customer prepayments as global packaging investment accelerates

    Amkor Technology is using customer prepayments and longer-term commitments to support an expanding manufacturing network across the US, South Korea, and Vietnam. Management said demand for advanced packaging is outpacing the consumer electronics recovery, and those arrangements provide greater visibility for investments that will keep capital spending elevated for several years.

    advanced packagingAmkor TechnologyDigiTimes AsiaCapacity Change
  3. Impact score 0

    Amkor gross margin climbs to 18.3% as computing mix offsets consumer weakness

    Amkor Technology's gross margin climbed to 18.3% in its latest quarter, as the company's shift toward advanced packaging strengthened profitability even when overall sales barely grew. The source states the cause: computing and automotive demand lifted the value of the company's production mix, while smartphone and consumer electronics headwinds kept the revenue recovery uneven.

    advanced packagingcomputingautomotiveAmkor TechnologyDigiTimes Asia

Thu, Oct 22

  1. Impact score 60

    Nvidia Invests in AI Supply Chain to Expand Production Capacity

    On Oct. 21 local time, Nvidia announced that, to meet growing demand for AI infrastructure, it is working with Samsung Electro-Mechanics, Ibiden, Amkor Technology, King Yuan Electronics Co. (KYEC), Siliconware Precision Industries (SPIL) and Unimicron, making advance payments to secure semiconductor packaging substrate, testing and co-packaged optics (CPO) capacity. CEO Jensen Huang said demand is enormous but capacity is constrained. Substrates: Nvidia is expanding agreements with Ibiden, Samsung Electro-Mechanics and Unimicron to increase semiconductor package substrate capacity 2.5-fold over the next three years; Nvidia has reserved several billion dollars worth of capacity at Ibiden with advance payments, aiming to triple capacity at its Ono plant in Japan, with the additional capacity expected to begin full-scale operations in the first quarter of 2028; Samsung Electro-Mechanics will begin supplying next-generation package substrates from its South Korean facilities in 2026, with Nvidia supporting equipment upgrades at its Sejong and Busan plants plus construction of a new factory; Nvidia signed a capacity reservation agreement with Unimicron to expand its KF plant in Taiwan, with capacity beginning to increase in the second quarter of 2027 and expected to reach full utilization by mid-2028. Advanced packaging: Nvidia is working with Amkor to expand capacity in Gwangju, South Korea, planning to increase interposer wafer capacity by more than 300% by the end of 2028. Testing: Nvidia committed $1.1 billion in advance payments to reserve capacity at KYEC; expansion in the United States, Taiwan and Singapore will double total testing capacity in 2027 from the 2026 level, with a new U.S. facility scheduled for mass production in April 2027 and Singapore lines in February 2027. CPO: Nvidia is expanding optical engine capacity for CPO with SPIL in Taiwan, rising 15-fold by mid-2027 and doubling again by the end of 2028. All expansions are planned/expected arrangements, not yet achieved results.

    semiconductor package substratesFC-BGA substratesinterposersNvidia, Samsung Electro-Mechanics and 7 totalThe ElecCapacity Change
  2. Impact score 45

    RT NEWS: #NVIDIA's #GTCBerlin keynote spotlights the supply chain: 17 DSX POD partners incl. Delta, Gigabyte, Pegatron, Wistron, plus 6 capacity suppl...

    According to a NEWS post reposted by TrendForce, NVIDIA's GTC Berlin keynote spotlighted its supply chain, featuring 17 DSX POD partners including Delta, Gigabyte, Pegatron and Wistron, plus 6 capacity suppliers (Unimicron, IBIDEN, SEM, Amkor, KYEC, SPIL). The item is a presentation of the supply-chain partner list; the source does not state any price movement, capacity change or specific cooperation terms.

    DSX PODNVIDIA, Delta and 11 totalTrendForce Official (Market Data)Partnership/M&A
  3. Impact score 60

    (PR) NVIDIA and Supply Chain Partners Expand Capacity to Accelerate AI Infrastructure Buildout

    NVIDIA announced plans with a group of supply chain partners to expand global manufacturing capacity to meet growing demand for its accelerated computing and full-stack AI factory platform. The partners include Amkor Technology, IBIDEN, King Yuan Electronics (KYEC), Samsung Electro-Mechanics, Siliconware Precision Industries (SPIL) and Unimicron Technology Corporation, with expansion of critical manufacturing capabilities across substrates, advanced packaging, testing and optical engines, covering both new and existing suppliers, to strengthen the resiliency and redundancy of NVIDIA's global supply chain. This is an announced expansion plan only; the source does not indicate the capacity changes have been implemented.

    substratesadvanced packagingtestingNVIDIA, Amkor Technology and 7 totalTechPowerUpCapacity Change

Wed, Oct 21

  1. Impact score 60

    Apple brings more iPhone component production to the US

    On October 21, 2026, Apple announced an expansion of its American Manufacturing Program: Qnity Electronics, based in Delaware (it joined the programme in March), will produce in the US the advanced films used in the variable aperture of the iPhone 18 Pro's main camera. Apple also signed Pennsylvania-based Perryman Company to supply titanium for the foldable iPhone Duo, with a commitment of up to USD 100 million over three years. According to Apple, nearly 100 components in its newest iPhones now come from American companies, and suppliers in more than a dozen states provide US-made components for the iPhone Duo and iPhone 18 Pro. Among them: Broadcom is expanding and modernising its Fort Collins, Colorado facility under a USD 1.5 billion investment announced in July, with a multi-year agreement covering more than 15 billion US-made chips; Corning's Harrodsburg, Kentucky site will produce all cover glass for the iPhone and Apple Watch sold worldwide by the end of 2026; Coherent supplies VCSEL lasers for Face ID from Sherman, Texas; TSMC's Arizona fab is set to produce more than 100 million chips for Apple in 2026, with construction of the north campus under way; Amkor broke ground on its first high-volume packaging and test facility in Peoria, Arizona in September 2025 and began construction of the building shell this year, with Apple as one of its first customers and the first two phases expected to employ more than 3,500 people. Apple also opened an Advanced Manufacturing Center in Houston in August, where it will start manufacturing the Mac mini this year in the same facility where it builds AI servers. The programme is part of Apple's USD 600 billion, four-year commitment to US manufacturing and innovation.

    variable aperture camera filmstitaniumRF componentsApple, Qnity Electronics and 8 totalEvertiqCapacity Change

Tue, Oct 20

  1. Impact score 58

    Amkor triples Gwangju investment as AI packaging demand grows

    Amkor Technology is tripling its planned investment in Gwangju to expand advanced packaging capacity for artificial intelligence and high-performance computing. The source does not state the specific investment amount or the resulting figure after the tripling. The project is a semiconductor project under South Korea's southwestern development strategy and is being brought into construction. The stated context for the increased investment is growing AI packaging demand. This is a planned expansion; the source provides no completion timeline or capacity figures.

    advanced packaging capacity for artificial intelligence and high-performance computingAmkor TechnologyDigiTimes AsiaCapacity Change

Fri, Jul 24

  1. Impact score 95

    Chip Industry Week In Review

    TSMC announced a price hike, Intel Foundry revenue rose 31%, and a SiC plant closed, signaling supply constraints and rising costs in the semiconductor sector.

    WaferSiCTSMC, Intel and 5 totalSemiconductor EngineeringPrice Movement

Mon, Jul 6

  1. Impact score 30

    LG Chem begins first mass supply of semiconductor strippers to Amkor

    LG Chem has begun supplying semiconductor strippers to Amkor Technology, marking its first mass market entry. This move reflects rising demand for advanced chip-making chemicals driven by AI and HBM. Bullish for chemical suppliers as advanced packaging demand strengthens.

    Semiconductor ChemicalsLG Chem, Amkor TechnologyDigiTimes AsiaPartnership/M&A

Wed, Jun 17

  1. Impact score 60

    TSMC and Amkor strike 10-year deal to build U.S. semiconductor packaging hub in Arizona

    Taiwan Semiconductor Manufacturing Company (TSMC) and Amkor Technology have signed a 10-year agreement to expand advanced packaging capacity in Arizona. This move aims to bring a more complete chip supply chain onto American soil amid geopolitical pressures. While this addresses supply chain localization, the capacity expansion may increase supply, exerting downward pressure on advanced packaging prices.

    Advanced PackagingTaiwan Semiconductor Manufacturing Company, Amkor TechnologyDigiTimes AsiaPartnership/M&A

Sun, Apr 19

  1. Impact score 60

    [News] Semiconductor Packaging and Testing Capacity Race Intensifies as ASE, Samsung and Amkor Announced New Moves

    ASE, Samsung, and Amkor are aggressively expanding global packaging and testing capacity, with ASE planning six new fabs and Samsung investing $4B in Vietnam. This expansion is driven by demand from AI, HPC, and data centers. Bearish: The significant, coordinated capacity increase across major OSATs signals a future easing of supply constraints, potentially pressuring pricing power.

    Advanced PackagingChip TestingASE Technology Holding, Samsung Electronics and 3 totalTrendForceCapacity Change

Fri, Apr 10

  1. Impact score 55

    [News] Samsung Reportedly Bets on Vietnam with $4B Chip Packaging Push; Amkor Expands Presence

    Samsung plans a $4B multi-phase chip packaging plant in Vietnam's Thai Nguyen province, with an initial $2B commitment. Amkor is accelerating its expansion in Bac Ninh and has requested policy support for LPG supply prioritization. Bearish: Major capacity expansions in advanced packaging, led by Samsung and Amkor in Vietnam, increase long-term supply and could pressure packaging service pricing.

    Advanced PackagingSamsung Electronics, Amkor TechnologyTrendForceCapacity Change

Fri, Mar 6

  1. Impact score 58

    Amkor eyes triple revenue growth in 2.5D and HDFO packaging for 2026

    Amkor plans to increase its 2026 capex budget to $2.5-3 billion, prioritizing expansion of 2.5D and HDFO packaging capacity in South Korea and Taiwan to serve the AI data-center CPU market. This represents a significant supply-side increase for advanced packaging services. Bearish: Major capacity expansion plan signals potential for future oversupply or price pressure in the advanced packaging segment.

    2.5D PackagingHDFO PackagingAmkor TechnologyDigiTimes AsiaCapacity Change

Wed, Feb 25

  1. Impact score 55

    Apple to begin Mac mini production in Houston, expand AI server manufacturing

    Apple announced Mac mini production and AI server manufacturing expansion in Houston, part of its $600B US investment plan. The move is supported by upstream supply chain investments, including GlobalWafers' $4B Texas wafer fab and Amkor's $7B Arizona packaging facility. Watch: This signals a long-term, multi-tiered onshoring push for logic chips and advanced packaging, potentially altering regional supply dynamics but with no immediate price impact.

    Logic ICsAdvanced PackagingSilicon WafersTSMC, Amkor Technology and 5 totalEvertiqCapacity Change