NuAxi Stream - Real-Time Semiconductor Intelligence

Thu, Oct 29

15:11Impact score 50
Mercedes-Benz reopens voluntary severance programme in Germany
Mercedes-Benz will once again offer its voluntary severance programme for indirect functions in Germany, starting in December, as part of stepped-up productivity measures while the carmaker cuts its profitability outlook for the year. According to the group's quarterly report, since June Mercedes-Benz has intensified its global productivity measures with a particular focus on its German sites, building on a reduction in fixed costs of around 25% since 2019. The company has not said how many employees it hopes will take up the new offer. The previous round was already costly: in the first nine months, Mercedes-Benz paid out around EUR 1.1 billion for restructuring, mainly related to the severance programme in Germany. As the outlook for the car business weakens, Mercedes-Benz Cars now expects an adjusted return on sales of 2–3% for 2026, down from 3–5% previously; the group cites a tougher market in China and higher costs for raw materials and product lifecycle measures in the fourth quarter, and Group EBIT is now expected to be at last year's level rather than significantly above. In the third quarter, the car division's adjusted EBIT halved to EUR 560 million and its adjusted return on sales fell to 2.5% from 4.8%; car sales fell 8% to 407,232 vehicles, mainly because of intense competition in China, while outside China sales rose, with growth of 5% in Europe and 6% in the US, and sales of fully electric cars reached a quarterly record, up 61% year on year.
Mercedes-BenzEvertiq
14:13Impact score 55
Seoul Viosys producing white LEDs without rare earths
Seoul Semiconductor and its affiliate Seoul Viosys have begun mass production of WICOP 3, an LED which emits white light without using rare earths. The source does not state a cause beyond the fact that white LEDs have depended on rare earth materials such as yttrium aluminum garnet (YAG) layered onto a blue LED chip, and Seoul Viosys announced it has broken that dependence. WICOP 3 is the third generation of the technology; the two companies had already developed and mass produced ultraviolet, blue, green, red and infrared LEDs. WICOP 3 is the world's first white opto-semiconductor to achieve white light in a micro LED smaller than 100 µm, uses neither rare earths nor package, contains none of the synthetic silicone resins, plastics and lead frames used in conventional LEDs, and costs about half as much to make as a conventional white LED. In its first mass production, a micro LED chip measuring 25 µm by 10 µm produced 0.015 lumens of white light, its chromaticity falls inside the CIE standard white region, and luminous efficacy is already close to 100 lumens per watt (lm/W); the company aims to reach 200 lm/W within two years, while a conventional 1,000 µm by 1,000 µm chip achieves 50 lumens. White LEDs make up roughly $10 billion of the $15 billion global market for packaged LEDs. Previously white chips could not go below 1,000 µm; removing rare earths makes white light possible both in large chips of 1,000 µm and above and in micro LEDs below 100 µm.
white LEDmicro LEDpackaged LEDSeoul Semiconductor, Seoul ViosysElectronics Weekly
13:00Impact score 0
Taihan secures EHV power grid turnkey project in the US
South Korean company Taihan announced that its U.S. subsidiary, T.E.USA, has been awarded an extra-high-voltage (EHV) power grid project in the United States on a turnkey basis. Under the project structure, T.E.USA will oversee the entire project, including local engineering and construction, while Taihan's headquarters will manufacture and supply key materials, including EHV cables and cable accessories. In connection with the project, Taihan has executed a material supply agreement valued at approximately KRW 120 billion (about USD 90 million) with its U.S. subsidiary. The total contract value of the turnkey project, including engineering and construction, as well as the client's identity and other project details, will not be disclosed pursuant to a non-disclosure agreement (NDA) with the client.
EHV cablescable accessoriesTaihan, T.E.USAEvertiq
09:11Impact score 65
Samsung Electronics Announces Third Quarter 2026 Results
On Oct. 29, 2026, Samsung Electronics reported results for the third quarter ended Sept. 30, 2026: consolidated revenue of KRW 195.3 trillion, an all-time quarterly high, up 14% QoQ, and operating profit of KRW 107.4 trillion, making it the world's first tech company to exceed KRW 100 trillion in quarterly operating profit. The DS Division posted revenue of KRW 147.1 trillion and operating profit of KRW 106.5 trillion, with QoQ sales up 15%; the Memory Business set an all-time high for quarterly revenue and operating profit, managing its product mix toward AI products amid capacity constraints, with strong server demand leading to higher market prices across all applications, and significantly scaled up HBM4 sales. The DX Division posted QoQ revenue growth of 8% and an operating loss of KRW 0.8 trillion. MX and Networks posted combined revenue of KRW 37.7 trillion with an operating loss of KRW 0.6 trillion; SDC posted revenue of KRW 8.0 trillion and operating profit of KRW 1.1 trillion; VD/DA posted combined revenue of KRW 13.9 trillion with an operating loss of KRW 0.2 trillion. Q3 capital expenditure was KRW 29 trillion, up KRW 12.2 trillion QoQ and KRW 19.8 trillion YoY; the January-September cumulative total was KRW 56.9 trillion, up KRW 24.7 trillion YoY; full-year 2026 capex is expected at approximately KRW 84.4 trillion (KRW 76.8 trillion for DS, KRW 3.9 trillion for SDC) — an expectation, not an achieved result. The company projects that in Q4 2026 memory demand growth will revolve around new CPU and GPU platform-related products and surging QLC SSD demand, and that in 2027 AI-driven demand will far exceed industry supply compared with 2026; these are forward-looking outlooks.
MemoryHBM4server DRAMSamsung ElectronicsSamsung Semiconductor Newsroom
08:30Impact score 0
Murata Launches World’s Smallest RF / Microwave Coaxial Connectors with a Switch, Cutting PCB Mounting Area by Approximately 40%
According to a product news release from Murata Manufacturing Co., Ltd. dated 10/29/2026, the company has begun mass production of the SWL series MM8330-2600RJ5 and MM8330-2600RK20, the world's smallest RF/microwave coaxial connectors with a switch (based on Murata research as of October 28, 2026). Measuring 1.0 mm × 1.0 mm × 0.55 mm, the connectors reduce PCB mounting area by approximately 40% compared with Murata's previous SWJ series (1.4 mm × 1.2 mm × 0.65 mm); when used with dedicated probes, the PCB footprint including the keep-out area is reduced by approximately 60% versus the SWJ series. The SWL series supports DC to 15 GHz with a nominal impedance of 50 Ω; the MM8330-2600RJ5 is supplied on reels of 5,000 pieces and the MM8330-2600RK20 on reels of 20,000 pieces. The dedicated probes are scheduled to enter mass production in December 2026.
RF / microwave coaxial connectors with a switchMurata Manufacturing Co., Ltd.Murata News
08:00Impact score 10
[Tech Note] Why does AI still have to wait with tens of thousands of GPUs? How silicon photonics and CPO are building the ‘highways of light’
This is a background technology column published on October 29, 2026 (authored by Professor Younghyun Kim of Hanyang University ERICA), explaining — not reporting — industry developments; it contains no price, capacity or policy event. The article states that AI data center bottlenecks have shifted from GPU compute speed to data movement: copper interconnects suffer signal loss, heat and repeater power overhead at high speeds and longer distances, so networks are shifting to silicon-photonics-based optical interconnects; co-packaged optics (CPO) places optical engines next to the switch ASIC to shorten electrical paths, increase bandwidth density and save power. It cites Meta's evaluation of a CPO switch system presented at ECOC 2025, in which power consumption in the optical interconnect portion was approximately 65% lower than a comparable pluggable architecture, with connection stability confirmed under the specific test conditions; companies such as NVIDIA and Broadcom are accelerating commercialization by introducing network products incorporating CPO technology. The article also describes LPO (removable modules with the DSP eliminated) and NPO (optical engines close to but outside the switch package) as alternative approaches, explains that HBM and CPO reduce GPU data-wait time at the memory and network levels respectively, and notes remaining CPO challenges including laser light supply, fiber connection, heat from ASICs, and yield improvement.
co-packaged optics (CPO)silicon photonics HBMNVIDIA, Broadcom and 3 totalSK Hynix Newsroom
08:00Impact score 0
Part 2. zHBM: Next-Generation Memory for the Data Movement Era
In a technical explainer, Samsung states that zHBM, currently under development, is a next-generation AI memory architecture designed around AI inference, reasoning, long-context processing and agentic AI workloads that place greater demands on memory through more generated tokens and larger KV caches. Moving beyond conventional HBM architectures in which memory sits beside the AI chip, zHBM directly stacks memory on the processor. The article says zHBM uses direct 3D integration and a Distributed I/O architecture to create shorter, denser connections intended to deliver high bandwidth with greater energy efficiency; core technologies include Wafer-on-Wafer (WoW) stacking combined with Hybrid Copper Bonding (HCB) for direct copper-to-copper connections at fine pitches, and reduced size and pitch of Through Silicon Vias (TSVs) for higher interconnect density, with shorter interconnects lowering data-transfer energy. The article notes that direct stacking creates new thermal challenges, as heat generated by the processor may need to pass through the memory stack, and that Samsung is exploring stack-height optimization; it emphasizes co-design and co-optimization of memory with the AI chip from early development stages and aims to work with customers and ecosystem partners on zHBM solutions tailored to their AI chips' performance, power, thermal and architectural requirements. The article is informational only, with no specific timeline, capacity or pricing figures and no statement of market supply-demand conditions.
zHBMSamsungSamsung Semiconductor Newsroom
07:51Impact score 20
Research Insight: Kinsus Tech identifies three challenges for larger AI chip packages
Ting-Hao Lin, R&D vice president at Kinsus Interconnect Technology, said at the 2026 TPCA Show that surging demand for AI computing is driving advanced packaging toward larger form factors. To support this trend, substrate materials must deliver low warpage and exceptional dimensional stability while overcoming challenges in thermal expansion mismatches and structural stress. The source states no specific capacity, pricing or expansion plans.
advanced packaging substratesKinsus Interconnect TechnologyDigiTimes Asia
07:43Impact score 35
Taiwan's growth surge nears end; electronics, machinery stay resilient in 2027
According to a consensus among economic research institutions, 2026 will be a breakout year for Taiwan's economic growth, with GDP forecast to expand at a double-digit rate—more than twice China's growth rate. The forecast also states that over the next six months, the electronics and machinery sector is expected to remain resilient, while securities, textiles, chemicals, and petrochemical raw materials could weaken. The source does not state the cause behind these projections.
electronicsmachinerysecuritiesDigiTimes Asia
07:27Impact score 60
[Opinion] Elon Musk Is at It Again
Tesla and SpaceX are building Terafab in Texas, with Musk aiming to establish a facility capable of processing 1 million wafers per month within 10 years. Intel has joined as a technology partner, and TSMC has confirmed discussions on potential cooperation. Procurement officials from Tesla and SpaceX visited Korean suppliers at SEMICON West. Whether Terafab will materialize as planned remains uncertain.
Tesla, SpaceX and 6 totalThe ElecCapacity Change
07:25Impact score 30
HanWool & Jeju Names Kim Baek-san Sole CEO
HanWool & Jeju said Oct. 28 that it is transitioning from a co-CEO management structure to a sole-CEO system. Following the resignation of co-CEO Kim Myung-ho on Oct. 27, Kim Baek-san became the company's sole CEO; Kim Baek-san also serves as chairman of HanWool Materials Science and CEO of HanWool Semiconductor. The company said the restructuring will unify decision-making on major management issues and strengthen operational efficiency and accountability, and that it plans to actively leverage the business capabilities of HanWool Group affiliates to establish a stable operating foundation for its existing businesses and identify new growth drivers. It also plans to strengthen its financial position, carry out ongoing projects without disruption while building a foundation for medium- to long-term growth, and enhance communication with shareholders and the market. The source does not state the cause of Kim Myung-ho's resignation.
HanWool & JejuThe Elec
07:20Impact score 45
Qualcomm to Supply Snapdragon X Chips for Blue Chip Project
Qualcomm said on Oct. 27 local time that it will supply its Snapdragon X platform for the Blue Chip Project. The Blue Chip Project aims to design and assemble computer hardware for various public-sector applications in the US, with the goal of rebuilding domestic computer manufacturing capabilities. Qualcomm will supply its Snapdragon X series, a system-on-chip (SoC) platform for PCs that serves as the core processor for the Blue Chip product lineup; the platform integrates a CPU for general computing tasks, a GPU for graphics rendering and an NPU for AI workloads. Anduril will develop computers, including laptops, based on Snapdragon X chipsets, intended for government, defense, emergency response and other public-sector applications. Anduril has already completed a prototype of the first Blue Chip laptop; components sourced from US and allied-country suppliers account for more than 90% of total component procurement costs. Official orders will begin next year. PCB assembly will take place at Anduril's Arsenal-1 facility in Ohio. The project will proceed in stages: the first phase focuses on sourcing US-made components and expanding domestic manufacturing, the second aims to minimize dependence on foreign suppliers, and the ultimate goal is a domestic supply chain handling everything from raw materials to final product assembly in the US. The source does not state a cause beyond this context.
Snapdragon X platformCPUGPUQualcomm, AndurilThe ElecPartnership/M&A
07:20Impact score 35
SKC Posts 15th Straight Quarterly Loss, Narrows Deficit in Q3
On Oct. 28, SKC reported consolidated third-quarter revenue of 638.9 billion won and an operating loss of 49.6 billion won, narrowing by 5.3 billion won from 54.9 billion won in the same period last year, with revenue up about 26% year over year; it remained in the red for the 15th consecutive quarter (since Q1 2023). The source attributes the losses to a prolonged downturn in the battery market caused by slowing growth in electric vehicle demand. The copper foil business led by subsidiary SK Nexilis was particularly weak, posting third-quarter revenue of 248.2 billion won and an operating loss of 53.3 billion won; SK Nexilis aims to return to profitability in the fourth quarter by expanding supply, primarily from its Malaysian plant. The semiconductor materials business posted revenue of 71.8 billion won and operating profit of 21.8 billion won, supported by sales related to AI data centers, automotive applications, robotics and non-memory semiconductors; the chemicals business recorded its third consecutive quarterly profit with revenue of 317.3 billion won and operating profit of 13.4 billion won. SKC raised 1 trillion won in cash through a rights offering in the first half of this year, allocating 410 billion won to debt repayment, cutting its debt-to-equity ratio to 122% from 233% at the end of last year; the remaining 590 billion won will be invested in glass substrates, a next-generation growth business led by subsidiary Absolics. For non-embedded products under development for mobile communications applications, the company is discussing PoC testing with customers and pursuing new projects with multiple customers; for embedded products it is focusing on reliability testing and improving production yields.
battery materialscopper foilsemiconductor materialsSKC, SK Nexilis and 3 totalThe Elec
07:20Impact score 45
SK Materials Signs Semiconductor Materials MOU With Japan’s Furukawa Electric
SK ecoplant Materials (SK Materials) said on Oct. 28 that it signed a memorandum of understanding (MOU) with Japan's Furukawa Electric Co. to cooperate on semiconductor materials for artificial intelligence (AI) data centers. Furukawa Electric will develop new products for semiconductor and data center applications, while SK Materials will evaluate the new materials and expand their adoption in the South Korean market. The companies plan to establish a working group for regular technical exchanges and business discussions, and will jointly assess potential applications for various materials based on customer demand. The collaboration aims to address increasingly stringent performance and reliability requirements for materials used in packaging, thermal management, insulation and communications infrastructure. The source does not state a cause beyond this cooperation context.
semiconductor materials for AI data centersSK ecoplant Materials (SK Materials), Furukawa Electric Co.The ElecPartnership/M&A
07:19Impact score 45
YMC Partners With China's Leading Molybdenum Producer
South Korean semiconductor materials and components manufacturer YMC announced on Oct. 28 that it signed a framework agreement for strategic cooperation with China's Jinduicheng Molybdenum Co. (JDC), Asia's largest molybdenum producer. The signing ceremony was held at JDC's headquarters in Xi'an, China, attended by YMC Vice President Park Jung-keun, JDC Vice President Wang Zhiyu and other senior officials. JDC, headquartered in Shaanxi Province, China, operates a vertically integrated business spanning ore mining, smelting and advanced materials processing, and is a key subsidiary of Shaanxi Non-ferrous Metals Holding Group, a major Chinese state-owned enterprise. The two companies will establish a cooperative framework covering raw material supply, precision processing and global sales for the semiconductor and display industries: JDC will supply high-quality molybdenum raw materials, YMC will precision-process them into materials and components, and the companies will jointly market the products in South Korea and other global markets. This is a signed framework agreement; the source does not state further details on implementation or outcomes.
molybdenumYMC, Jinduicheng Molybdenum Co. (JDC)The ElecPartnership/M&A
04:00Impact score 60
AXT raises private equity financing of up to $545m in Tongmei
AXT Inc of Fremont, CA, USA — which makes gallium arsenide (GaAs), indium phosphide (InP) and germanium (Ge) substrates and raw materials at plants in China — says that its majority-owned China-based wafer manufacturing subsidiary Beijing Tongmei Xtal Technology Co Ltd has entered into definitive agreements for a private equity financing. Under the agreements, certain institutional investors would make a private equity investment in Tongmei in ordinary shares of a minimum of RMB1,912,350,000 (about US$285m) and up to a maximum of RMB3,668,639,053.25 (about US$545m). The financing is intended to fund further expansion of Tongmei's manufacturing capacity for indium phosphide substrates, expansion of its principal business operations, capital expenditures, and general working capital. Definitive agreements have been signed, but the financing and the capacity expansion have not been implemented or completed.
indium phosphide substratesBeijing Tongmei Xtal Technology Co Ltd, AXT IncSemiconductor TodayCapacity Change
03:44Impact score 30
Amazon, Apple and Microsoft: New mobile computing platforms take off
Microsoft and Nvidia publicly released the Surface Laptop Ultra on October 7, built around the application processor originally referred to as the N1X and now renamed the GB10. The chip was co-developed by NVIDIA (which contributed the Grace Blackwell GPU subsystem) and MediaTek (which supplied the multi-core CPU cluster and reportedly also handled full SoC integration duties); it was originally intended for—and may eventually still show up in—Arm-based Windows PCs, but repeated development hurdles reportedly delayed both SoC and system shipment plans, and lingering functional bugs precluded Windows compatibility (explaining the DGX Spark's Linux OS foundation). The machine comes in two versions sharing the same NPU core: 5120-core GPU with 18-core CPU, and 6144-core GPU with 20-core CPU; system memory ranges from 24 GB to 128 GB of LPDDR5x unified memory; SSD options start at 512 GB (PCIe Gen 4) with 1 TB and 2 TB (PCIe Gen 5) configurations; pricing is $2,599 baseline up to $5,899.99 top-end, with delivery promised 'later this year'; an RTX Spark-based developer platform at $5,999.99 and up is also available for pre-order. In the same period, Amazon launched its latest-generation Alexa-branded (no-longer-Fire) tablets in 8-inch, 11-inch and 12-inch 'Pro' flavors, running 'vanilla' Android with a return to the Google Play Store, priced from $299 up to $679.99 (not including cases or the high-end model's optional pen and keyboard accessories). Apple's week began Monday with a new-generation iPad mini (now with the A20 Pro, a slightly larger 8.5-inch display switched from LCD to OLED, priced from $699 and up; the 2024 entry-level 128 GB Wi-Fi-only model was originally $499 but was bumped to $599 in June of this year), Tuesday brought a 14-inch entry-level MacBook Pro now running the M6 SoC (versus last year's M5) plus a 24-inch iMac making a two-generation jump from the M4 to the M6, and today Apple unveiled its first touchscreen-augmented MacBook Pro laptops in both 14-inch and 16-inch displays with ProLED XDR panels and both M5 Pro and Max SoC options, priced from $2,899 to $14,549.
Nvidia RTX Spark N1X (GB10) application processorApple A20 Pro SoCApple M6 SoCApple, Microsoft and 6 totalEDN
01:00Impact score 0
From Metrology to Autonomy: Why Intel Foundry’s Manufacturing Roadmap Matters
In its SEMICON West 2026 presentations, Intel Foundry, with senior director of business operations and marketing Lori Scott outlining research spanning metrology, defect classification, thermal modeling, automation, and standards, argues that autonomous manufacturing requires trustworthy measurements, connected infrastructure, and clear engineering oversight. Intel Foundry describes its Advanced Chiplet Test services (predictive die classification, intelligent die pairing, optical testing, and yield analytics) as part of a broader measurement strategy; its automatic defect classification research uses an agentic workflow to assist engineers while preserving human approval checkpoints; and it highlights the SATAS industry consortium as one route toward interoperable architectures and automation frameworks. The source explicitly states that the evidence presented remains a roadmap of research and emerging capabilities, rather than proof of factory-wide autonomous performance, and that customers should judge success through demonstrated improvements in yield, scrap, cycle time, reliability, and engineering workload.
connected metrologyAdvanced Chiplet Test servicesphysics-informed thermal modelingIntel FoundrySemiWiki

Wed, Oct 28

21:00Impact score 10
When Nanomagnets Do the Math: France’s New Machine for Impossible Choices
French researchers have demonstrated a hybrid nanoelectronic experimental "Ising machine" designed to solve difficult combinatorial optimization problems more efficiently. The work was conducted by researchers from CEA-Leti and Spintec in Grenoble and the Centre for Nanoscience and Nanotechnology at Université Paris-Saclay, and reported in Nature Communications. The system combines hafnium-oxide resistive random-access memory (ReRAM) with stochastic magnetic tunnel junctions (SMTJs): ReRAM devices store the weighted connections describing how variables influence one another and can perform analog matrix operations where data are stored, while SMTJs represent the binary variables and fluctuate between states driven by thermal noise. The researchers control annealing by adjusting a single read voltage applied to the ReRAM array, so the hardware produces an annealing schedule through the direct interaction of its components. The proof-of-concept machine consistently reached the global optimum in a 24-vertex weighted MAX-CUT benchmark and a 10-vertex, three-color graph-coloring problem, operated at room temperature without an applied magnetic field, and the researchers emphasize that ReRAM, magnetic tunnel junctions and CMOS circuitry are compatible with back-end-of-line fabrication and vertical three-dimensional integration. The article notes this remains a small experimental prototype, not evidence of superiority over leading conventional solvers; updates are currently sequential, external feedback is still used for measurement, and comparative speed and energy benefits have not yet been quantified. The source does not state a cause (this is a technology development report, not a market movement).
hafnium-oxide ReRAMstochastic magnetic tunnel junctions (SMTJs)SemiWiki
17:00Impact score 0
Part 1. The Evolution of AI and AI Chips – and the HBM That Powers Them
Samsung published Part 1 of a series on the evolution of AI and AI chips and the HBM that powers them; the content is technical background. It explains the division of roles among AI chips (GPUs, AI-specific ASICs, CPUs), notes that during decode at smaller batch sizes memory bandwidth can become a key performance constraint, and describes KV cache data storage needs that grow as context lengths and concurrent requests increase. The article recounts that GPUs traditionally used GDDR for high memory bandwidth, but because GDDR devices are placed around the GPU on the board, adding memory requires additional space and routing, and raising per-pin data rates increases challenges of power consumption, heat, and signal integrity. HBM addresses this by combining vertical stacking with a wide I/O interface, connecting multiple stacked DRAM dies through Through Silicon Vias (TSVs), delivering high bandwidth, higher capacity, greater energy efficiency, and high-density packaging in a smaller footprint. It also outlines HBM's generational evolution, including stack counts rising from 8-high to 12-high and 16-high, higher-density DRAM dies, and advanced logic-process base dies. Samsung's zHBM is currently under development and directly stacks memory on top of the compute device via 3D integration to shorten data paths. The content is informational only, with Samsung providing no warranty as to its accuracy or completeness.
HBMGDDRDRAMSamsungSamsung Semiconductor Newsroom

Analog	$0.68	−5.9%
Connector	$0.75	+0.2%
CPU	$386.74	−21.3%
DDR4	$88.40	−0.2%
DDR52026-W13	$14.89	−11.2%
GPU	$478.20	+8.2%
MCU	$0.68	−61.7%Unusual
MLCC	$0.01	+54.0%Unusual
MOSFET	$0.12	−82.8%Unusual
PMIC2026-W13	$0.44	−12.5%
SSD/HDD	$288.43	n/a

NuAxi Stream - Real-Time Semiconductor Intelligence

Thu, Oct 29

Mercedes-Benz reopens voluntary severance programme in Germany

Seoul Viosys producing white LEDs without rare earths

Taihan secures EHV power grid turnkey project in the US

Samsung Electronics Announces Third Quarter 2026 Results

Murata Launches World’s Smallest RF / Microwave Coaxial Connectors with a Switch, Cutting PCB Mounting Area by Approximately 40%

[Tech Note] Why does AI still have to wait with tens of thousands of GPUs? How silicon photonics and CPO are building the ‘highways of light’

Part 2. zHBM: Next-Generation Memory for the Data Movement Era

Research Insight: Kinsus Tech identifies three challenges for larger AI chip packages

Taiwan's growth surge nears end; electronics, machinery stay resilient in 2027

[Opinion] Elon Musk Is at It Again

HanWool & Jeju Names Kim Baek-san Sole CEO

Qualcomm to Supply Snapdragon X Chips for Blue Chip Project

SKC Posts 15th Straight Quarterly Loss, Narrows Deficit in Q3

SK Materials Signs Semiconductor Materials MOU With Japan’s Furukawa Electric

YMC Partners With China's Leading Molybdenum Producer

AXT raises private equity financing of up to $545m in Tongmei

Amazon, Apple and Microsoft: New mobile computing platforms take off

From Metrology to Autonomy: Why Intel Foundry’s Manufacturing Roadmap Matters

Wed, Oct 28

When Nanomagnets Do the Math: France’s New Machine for Impossible Choices

Part 1. The Evolution of AI and AI Chips – and the HBM That Powers Them

Chip Teardown Lab2 opened

Component price indexNPI, vs. prior period

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