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Research Insight: Kinsus Tech identifies three challenges for larger AI chip packages
What happened
Ting-Hao Lin, R&D vice president at Kinsus Interconnect Technology, said at the 2026 TPCA Show that surging demand for AI computing is driving advanced packaging toward larger form factors. To support this trend, substrate materials must deliver low warpage and exceptional dimensional stability while overcoming challenges in thermal expansion mismatches and structural stress. The source states no specific capacity, pricing or expansion plans.
Impact and signal
Low impactImpact score: 20/100
Affected components and suppliers
advanced packaging substrates
Kinsus Interconnect Technology
AI chipsadvanced packagingsubstrate materialswarpagedimensional stabilitythermal expansion mismatch
Source and time
Source: DigiTimes Asia · 10/28/2026 · View original source
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