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Kinsus explores AlN ceramics beyond glass for AI advanced packaging
What happened
According to Kinsus Interconnect Technology R&D vice president Ting-hao Lin at the 2026 TPCA Show, Kinsus is exploring aluminum nitride (AlN) ceramics as a core material for substrates used in large-scale advanced packaging, seeking an alternative to glass. The exploration of a glass alternative is set against ongoing brittleness and reliability challenges of glass. The effort remains at the exploration stage, i.e., planned/research status, not an achieved mass-production or commercialized result.
Impact and signal
Medium impactImpact score: 45/100
Affected components and suppliers
aluminum nitride (AlN) ceramicsglass core materialsubstrates
Kinsus Interconnect Technology
AlN ceramicsadvanced packagingglass substrate alternativeR&D explorationTPCA Show 2026
Source and time
Source: DigiTimes Asia · 10/28/2026 · View original source
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