Electronica 2026: Infineon’s Adam White on 800 VDC, Dresden, and 300-mm Wide Bandgap

What happened

During Electronica 2026, Infineon's Adam White, Division President of Power Systems, described progress moving 800 VDC data-center systems—including solid-state transformers (SSTs) and solid-state circuit breakers (SSCBs)—from lab to customers: Infineon has begun shipping some modules in EasyPACK packages built on its 3.3 kV silicon carbide (SiC) technology, with a strong SST customer pipeline for AI and non-AI infrastructure, and the finished SSCB product from the recent collaboration with Siemens is ready for deployment; however, DC protection solutions remain nascent and the industry still needs alignment on standards and regulations to reach the tipping point for widespread adoption. On capacity, responding to AI-driven power semiconductor demand (the interview notes supply meeting demand has been difficult), Infineon opened the Dresden fab—called one of the world's largest 300-mm shells with a clean room—in July; it is currently largely empty, with teams working around the clock to install equipment and run customer qualifications before ramp. Infineon has also made a €1.1 billion investment in 300-mm GaN at the Villach fab aiming for high-volume manufacturing, with production scheduled to start by the end of 2027 per Infineon, and 300-mm low-voltage GaN expected to follow; the company additionally announced a claimed world first, 300-mm SiC with functional, working devices, though technical obstacles including thin epi, wafer handling and yield remain.

Impact and signal

Affected components and suppliers

Source and time

Source: Power Electronics News · 11/13/2026 · View original source