Infineon Sees AI Data Center Power Chips as Key Growth Driver

What happened

Adam White, president of Infineon's Power Systems division, held a press conference at Infineon Korea's headquarters in Samseong-dong, Seoul, on Nov. 5, outlining the company's “From Grid to Core” power semiconductor strategy and calling AI data center power solutions its most important growth driver. Revenue from AI data center power semiconductors exceeded 700 million euros in fiscal 2025, which ran from October 2024 through September 2025; in February the company set revenue targets of 1.5 billion euros for fiscal 2026 and 2.5 billion euros for fiscal 2027, and in August it raised its fiscal 2026 forecast to more than 1.6 billion euros. White said the company would announce a revised target at its headquarters' earnings presentation on Nov. 10, local time. White expects the power semiconductor market to expand significantly as AI data centers consume more electricity and transition to 800-volt direct current (800VDC) architectures: data centers' share of global electricity generation would rise from the current 3% to 7%–8% by 2030; power consumption per server rack is expected to increase from 100–150 kilowatts today to more than 1 megawatt after 2028, driven by GPUs whose individual power consumption will climb from 1,000 watts to more than 2,000W. The 800VDC architecture is being promoted by Nvidia, which plans to expand adoption alongside shipments of its Kyber racks in 2027. Customers are already shipping mass-produced solid-state circuit breakers, and preparations for mass production of solid-state transformers are accelerating in line with 800V DC adoption; Infineon expects the PSU market to shift from single-phase 8kW units currently in mass production to three-phase 30kW systems; vertical power delivery modules measuring less than 3 millimeters thick are scheduled for release in 2027. Infineon acquired Indian startup C2i Semiconductors in August, gaining digital controllers that support these architectures. Partnerships: with Hyosung Heavy Industries on high-voltage direct current (HVDC) transmission technology; an MOU with LS Electric signed in July to jointly develop SSTs and SSCBs; an MOU with SoluM signed on Nov. 5 to jointly develop server PSUs, BBUs and IBCs; plans announced in August 2025 to jointly develop vertical power delivery (VPD) modules for AI processors with Taiwan's Delta Electronics; a partnership with U.S.-based DG Matrix formed in March 2026 to supply SiC power semiconductors for SSTs; and an MOU with Estonia's Skeleton Technologies signed in September to jointly develop power solutions for AI data centers, including SSTs and high-power sidecar power systems.

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Source and time

Source: The Elec · 11/8/2026 · View original source