Infineon and SOLUM strengthen collaboration on HVDC power solutions for AI data centers

What happened

Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and SOLUM have signed a Memorandum of Understanding (MoU) to strengthen their existing collaboration on high-voltage direct current (HVDC) power solutions for AI data centers. Building on their ongoing technical cooperation, the companies plan to expand their work across three key power applications: intermediate bus converters (IBCs), battery backup units (BBUs) and power supply units (PSUs). They plan to combine Infineon's semiconductor and system expertise with SOLUM's capabilities in server power solutions and power module design and manufacturing, and to explore high-efficiency HVDC solutions together. Infineon will work with SOLUM from the early stages of relevant projects to review suitable technologies and product solutions and will provide reference designs and technical support; its portfolio spans silicon (Si), silicon carbide (SiC) and gallium nitride (GaN) power semiconductors, including CoolMOS™, OptiMOS™, CoolSiC™ and CoolGaN™ devices, plus PSOC™ microcontrollers and sensors. Adam White, Division President Power Systems at Infineon, said Korea is at the forefront of technology innovation and that SOLUM's server power capabilities complement Infineon's semiconductor side; SOLUM CEO Jun Sung-ho said working with Infineon will further strengthen SOLUM's high-voltage, high-efficiency power design capabilities and pursue new business opportunities in next-generation AI data center power markets. The companies will also maintain a regular technical dialogue on next-generation developments, aiming to strengthen their long-term collaboration and accelerate HVDC power system development for AI data centers. Background on Infineon: around 57,000 employees worldwide (end of September 2025) and revenue of about €14.7 billion in fiscal year 2025 (ending 30 September). This remains at the MoU-signing and planning stage; no specific products or projects are confirmed as implemented.

Impact and signal

Affected components and suppliers

Source and time

Source: EE Journal · 11/9/2026 · View original source