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Infineon presents first functional power devices on 300mm SiC wafers
What happened
Infineon Technologies AG of Munich, Germany has processed 300mm silicon carbide (SiC) wafers into functional power devices at its fab in Villach, Austria, becoming the first company to pioneer this innovation in a full-scale semiconductor fab environment. According to the source, the milestone was realized by utilizing existing silicon manufacturing equipment.
Impact and signal
Medium impactImpact score: 30/100
Affected components and suppliers
SiC power devices
Infineon Technologies AG
SiC300mm waferpower devicestechnology milestoneInfineonVillach
Source and time
Source: Semiconductor Today · 11/9/2026 · View original source
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