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electronica: Infineon's Seriously SiC 300-mm Wafer on Display

What happened

Infineon will display its SiC power devices fabricated on 300-mm wafers using a laser-based "saw" technique at electronica 2026. This is a planned trade-show display of a background nature, involving no capacity change, price movement or supply condition; the source does not state the cause or any market impact.

Impact and signal

Medium impactImpact score: 30/100

Affected components and suppliers

SiC power devices

Infineon

SiC300mm waferelectronica 2026laser-based saw techniqueproduct showcase

Source and time

Source: Electronic Design · 11/9/2026 · View original source

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electronica: Infineon's Seriously SiC 300-mm Wafer on Display

What happened

Impact and signal

Affected components and suppliers

Source and time

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