[News] MediaTek Reportedly Taps Intel Packaging Veteran After TSMC Hire, Advances Dual CoWoS–EMIB Strategy

What happened

According to Liberty Times, MediaTek is hiring former Intel executive Navid Shahriari as senior vice president, joining on November 9 and reporting to the company's president and chief operating officer, as it strengthens its data center and AI computing business. He brings 37 years of experience in semiconductor design engineering and advanced packaging; in the new role he will oversee advanced process and yield platforms, design-technology co-optimization, advanced testing and packaging, and quality and reliability, and will deepen collaboration with TSMC and other supply chain partners. Earlier, according to Reuters, MediaTek brought in former TSMC R&D Vice President Douglas Yu as a part-time advisor in May 2026 to support advanced packaging development and roadmap planning. According to ijiwei, MediaTek has reportedly been working with Intel on its Embedded Multi-die Interconnect Bridge (EMIB) technology for certain cloud ASIC projects, including work related to Google's TPU program; Reuters reports the company supports both TSMC's CoWoS and Intel's EMIB technologies, letting customers choose between the two. According to Focus Taiwan, MediaTek began shipping its first AI accelerator ASIC in September 2026 and expects approximately US$2.5 billion in revenue from the product in the fourth quarter; it targets around US$16 billion in AI ASIC revenue and a 20% market share in 2027, with its next-generation accelerator scheduled to enter commercial production in the first quarter of 2028.

Impact and signal

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Source and time

Source: TrendForce · 11/5/2026 · View original source