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TPK targets 2028 TGV mass production with NT$6 billion investment

What happened

TPK Holding has completed a pilot production line for glass-substrate through-glass via (TGV) technology at its Zhongli plant and started joint development and validation of early-stage samples with semiconductor packaging companies. Under its stated plan, the company targets core technology validation by the end of 2027 and mass production in 2028; the title cites an investment of NT$6 billion. This is a planned/expansion event, and mass production has not yet been realized.

Impact and signal

Medium impactImpact score: 60/100

Affected components and suppliers

glass substrate (TGV)

TPK Holding

TGVglass substrateadvanced packagingpilot linemass production 2028

Source and time

Source: DigiTimes Asia · 10/19/2026 · View original source

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TPK targets 2028 TGV mass production with NT$6 billion investment

What happened

Impact and signal

Affected components and suppliers

Source and time

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