NuAxiSemiconductor trade intelligence
BOE's 24-layer glass substrates reach AI chip packaging trials, with mass production still ahead
What happened
At an investor relations event on October 15, Chinese display manufacturer BOE said it had completed the full manufacturing process for glass-core substrates, producing 24-layer samples measuring more than 100 × 100mm. The samples have been delivered to customers and passed multiple reliability tests, with further validation underway; mass production remains ahead and has not yet been achieved.
Impact and signal
Medium impactImpact score: 50/100
Affected components and suppliers
glass-core packaging substrates
glass substrateadvanced packagingAI chip packaging24-layer samplesBOE
Source and time
Source: DigiTimes Asia · 10/15/2026 · View original source
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