NuAxiSemiconductor trade intelligence
Cheng Mei develops materials for advanced packaging glass substrates
What happened
As advanced packaging shifts toward large-size glass substrates, Cheng Mei Materials Technology is developing materials to address warpage, heat resistance, and drilling challenges. Its cutting and grinding tapes have entered customer validation and small-volume testing, while its anti-warpage film and heat-resistant tape remain in development.
Impact and signal
Medium impactImpact score: 55/100
Affected components and suppliers
advanced packaging glass substratescutting and grinding tapesanti-warpage filmheat-resistant tape
Cheng Mei Materials Technology
advanced packagingglass substratematerials developmentcustomer validationsmall-volume testing
Source and time
Source: DigiTimes Asia · 10/26/2026 · View original source
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