VON ARDENNE Addresses Semiconductor Panel-Level Packaging Market with New HiPIMS Deposition Solution

What happened

VON ARDENNE announced that it is expanding its semiconductor deposition portfolio into panel-level packaging (PLP) with a new HiPIMS deposition solution. The solution deposits high-aspect-ratio barrier and seed layers in through-glass via (TGV) holes, enabling dense, highly adherent functional film deposition, and leverages the company's HISS modular horizontal coating platform, scaling HiPIMS from 300mm wafer-level processing to panel-level production for advanced packaging applications including TGVs and redistribution layers (RDL). According to Yole Group, PLP generated more than $300M in revenue in 2025 and is projected to grow by more than 40% CAGR over the next five years; per a March 2026 Yole Report titled 'Panel Level Packaging 2026,' PLP is set for strong acceleration toward 2029-2030, driven by TSMC's entry and adoption of high-end PLP for AI and high-performance computing (HPC) applications. VON ARDENNE executives said HiPIMS can reduce downstream costs and enhance yield. This is a product/portfolio expansion announcement; the source does not state production timing or implementation details.

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Source and time

Source: EE Journal · 10/15/2026 · View original source