Taesung Showcases FC-BGA and Glass Substrate Equipment in Taiwan

What happened

Taesung said on Oct. 21 that it is participating in TPCA Show 2026, which opened in Taipei, Taiwan, on Oct. 20, where it introduced key process equipment technologies for manufacturing FC-BGA substrates and glass substrates, including copper plating equipment for via filling and surface treatment technologies, and for glass substrates, through-glass via (TGV) processing equipment and vertical developing, etching and plating systems. The company said the equipment is used to manufacture larger, higher-layer-count FC-BGA substrates as the markets for AI servers and high-performance semiconductors expand. Taesung recently signed an agreement to supply FC-BGA equipment to a major global semiconductor package substrate manufacturer and received a letter of intent (LOI) from a major South Korean substrate manufacturer to purchase copper plating equipment for SOCAMM module production; it is in the final stages of discussions with domestic and overseas customers on mass-production supply of glass substrate equipment. To meet growing demand, Taesung has established a mass-production system at its new Cheonan factory, which has more than six times the production capacity of its existing Ansan facility. This year's TPCA Show attracted approximately 670 companies worldwide, occupying 1,830 booths.

Impact and signal

Affected components and suppliers

Source and time

Source: The Elec · 10/21/2026 · View original source