TeraView Begins Validation of TGV Inspection Equipment for Glass Substrates

What happened

UK terahertz technology company TeraView has begun a proof-of-concept (PoC) for new equipment designed to non-destructively inspect through-glass vias (TGVs) in glass substrates, targeting detection of defects smaller than 5 micrometers (μm). According to industry sources on Oct. 8, TeraView is developing the glass-substrate inspection equipment at its UK headquarters; the system is intended to identify microscopic cracks in glass substrates immediately after the TGV process, and demonstration tests are currently being conducted using R&D glass substrate samples manufactured by UK universities and research institutes. The new equipment is based on TeraCota technology (EOTPR cannot inspect a TGV structure before copper plating is applied), and TeraView's current goal is to improve detection capability to 5 μm or less; after improving the equipment's readiness, the company plans to supply it in line with the mass-production schedules of major glass-substrate companies in South Korea and overseas. The industry currently expects commercialization of glass substrates around 2030, about two years later than forecasts made last year. Separately, on Oct. 5, TeraView signed a 1.073 billion won contract to supply EOTPR equipment to a large cloud service provider (hyperscaler) that develops AI chips; the equipment is also being supplied to major semiconductor companies and their partners, including NVIDIA and AMD. The source does not state the cause (no cause is involved).

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Source and time

Source: The Elec · 10/8/2026 · View original source