Taesung Enters Japan's Glass Substrate Equipment Market With Supply to Company F

What happened

Taesung said on Oct. 28 that it supplied wet-process equipment for glass substrate manufacturing to Japanese substrate manufacturer Company F; the equipment is used for surface treatment and fine-pattern formation during glass substrate production, and this marks Taesung's first delivery of glass substrate equipment to Japan. Company F is an existing Taesung customer with expertise in high-layer-count printed circuit boards (PCBs) and high-density semiconductor package substrates, and is developing multilayer glass substrates. Citing a nondisclosure agreement (NDA), Taesung did not disclose the customer's full name, contract value or number of equipment units supplied. The company said securing a supply track record with a major global customer before the market takes off is significant. Last year, Taesung supplied through-glass via (TGV) cleaning equipment and etching equipment for glass substrates to major domestic and overseas customers. A Taesung official said the company is continuing discussions with major domestic and overseas customers on supplying glass substrate equipment and expects additional orders for glass substrate equipment to materialize before the end of this year. The source does not state the contract value or other financial details.

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Source and time

Source: The Elec · 10/28/2026 · View original source