NuAxi Stream - Real-Time Semiconductor Intelligence

Mon, Oct 26

06:30Impact score 30
Gigavis Wins 46.9 Billion Won Inspection Equipment Order
Gigavis disclosed on Oct. 23 that it will supply 46.9 billion won worth of substrate inspection equipment to the domestic facility of a South Korean semiconductor substrate manufacturer. The contract represents 89.51% of its revenue of approximately 52.4 billion won in 2025. The contract runs from Oct. 22 through Dec. 31, 2027; Gigavis will receive a 10% advance payment, with revenue recognized through a 70% interim payment and a 20% final payment. The customer was not disclosed. Background: one of Gigavis' major domestic customers is Samsung Electro-Mechanics, which recently announced plans to invest 4.27 trillion won at its Sejong facility to expand production capacity for FC-BGA substrates based on ABF (Ajinomoto Build-up Film). Securities analysts estimate Gigavis' annual revenue at approximately 98.3 billion won in 2026; its order backlog stood at around 182.1 billion won as of September; and disclosed orders accumulated in the second half of 2026 totaled 68.8 billion won, equivalent to approximately 90% of the 76.1 billion won recorded in the first half.
substrate inspection equipmentGigavisThe Elec
06:30Impact score 60
TLB Begins Development of SOCAMM3 Substrates for AI Servers
According to industry sources on Oct. 22, TLB, a memory substrate specialist, has begun developing substrates for SOCAMM3 (Small Outline Compression Attached Memory Module 3), a next-generation low-power memory module standard for AI servers, in collaboration with two major memory manufacturers in South Korea and overseas. TLB recently began discussions with two existing memory customers on SOCAMM3 substrate design and manufacturing processes; the standard has not yet been finalized, and mass production of the substrates is expected in 2028. SOCAMM2 substrates entered mass production early in 2026, and their production volume and revenue more than tripled in the second quarter from the previous quarter; industry estimates put TLB's SOCAMM substrate revenue at around 70 billion won in 2026, with projections of approximately 140 billion won in 2027. SOCAMM3 substrates are expected to require more buildup cycles than SOCAMM2 (five buildup cycles), likely making them more expensive. TrendForce reported in June 2026 that Nvidia had halved the originally planned memory capacity per SOCAMM module for Vera Rubin; the three major memory manufacturers had allocated LPDDR5X supplies equivalent to only about 60% of Nvidia's requirements, and TrendForce expects shortages to persist into 2027. Anticipating rising demand, TLB began investing in buildup equipment at its second Ansan plant and Vietnam facility in the third quarter of 2025, and plans to begin construction of a second factory in November at the Yen Phong Industrial Park in Bac Ninh Province, Vietnam, targeting full-scale operations in the fourth quarter of 2027; once operational, the company's effective production capacity will double from 20,000 square meters to 40,000 square meters per month. SOCAMM substrates are expected to remain in production exclusively at TLB's Ansan headquarters for the time being because of their manufacturing complexity and stringent customer qualification requirements.
SOCAMM3 substrateSOCAMM2 substrateLPDDR5XTLBThe Elec
04:49Impact score 20
Silicon Photonic Modulator Reaches 200 Gb/s PAM4 With Reduced DSP (Science Tokyo, Yokohama, AIST, PETRA)
Researchers from Institute of Science Tokyo, Yokohama National University, AIST, and the Photonics Electronics Technology Research Association (PETRA) published a technical paper titled “Reduced-DSP 200G/λ Low-Voltage Slow-Light Silicon Modulator Enabled by Built-In EO Equalizer.” The abstract excerpt states that multi-Tb/s optical interconnects for artificial intelligence data centers necessitate high-speed, energy-efficient, and compact transceivers, but that conventional silicon Mach-Zehnder modulators have related limitations (the excerpt is truncated with an ellipsis). The research achieved a reduced-DSP 200G/λ low-voltage slow-light silicon modulator with a built-in EO equalizer, reaching 200 Gb/s PAM4. This is a published research paper and technology-advancement background item, not a price movement or supply-demand event; the source does not state any cause or commercialization timeline.
silicon photonic modulatorsilicon Mach-Zehnder modulatorInstitute of Science Tokyo, Yokohama National University and 4 totalSemiconductor Engineering
00:00Impact score 10
AJ Cooper is the Co-Founder and CEO of Itera
This is an interview with AJ Cooper, Co-Founder and CEO of Itera. Itera developed the first-of-its-kind 'fluid' circuit board, which uses liquid metal on glass substrates and electrowetting to rewire itself in real time, redrawing traces to match a new design in under a minute, aiming to compress the traditional PCB prototyping validation cycle (the source says it compresses a months-long process into days). Cooper holds a PhD in electrical engineering; his career included developing semiconductor equipment for GlobalFoundries, infrared night vision processes for FLIR, co-founding luxury smartwatch company Olio, and hardware roles at Uber and Lyft. Itera operates an electronics-as-a-service model with secure U.S.-based testing centers where customers get remote access to their 'Configurable Twin.' The source states that a top 5 global auto OEM and defense neoprimes have reserved Itera's production capacity, and that the company is talking with hyperscalers and chipset manufacturers; it also cites $50 billion spent annually on hardware development and validation. No specific component price movement, capacity cut or production halt is mentioned in the article.
fluid circuit boardIteraSemiWiki

Sun, Oct 25

23:30Impact score 60
[News] SK hynix 3Q Earnings Preview: Record Profit at 78% Operating Margin; HBM4, LTAs, Solidigm in Focus
SK hynix is scheduled to report 3Q26 results on October 28. Per Newsis, market consensus projects 3Q26 consolidated revenue at KRW 98.23 trillion and operating profit at KRW 76.96 trillion, up 301.76% and 576.11% year over year; per Chosun Biz, that implies a 78.4% operating margin, with fourth-quarter operating profit projected to climb further to KRW 87.27 trillion. Brokerage estimates are widely split: SK Securities projects third-quarter operating profit of KRW 79 trillion, while DS Investment & Securities and Meritz Securities forecast KRW 70.1 trillion and KRW 80.1 trillion respectively—a gap of KRW 10 trillion. Per Chosun Biz citing industry sources, amid delays in NVIDIA's Rubin rollout and longer-than-expected performance tuning for mass-produced chips, SK hynix's HBM4 shipments may have fallen short of expectations for a second consecutive quarter in 3Q26; per Money Today citing JPMorgan, HBM4 ASPs are estimated to rise 121% by 2027 compared with 2025 levels. Per DealSite citing Hana Securities, after a 30% jump in DRAM ASPs and a mid-50% surge in NAND ASPs in 2Q26, third-quarter DRAM ASPs are expected to rise another 21% QoQ, potentially lifting the DRAM segment's operating margin to 83%, with NAND ASPs projected to gain 17% sequentially. On LTAs: Samsung reportedly plans to allocate 60–70% of its memory production capacity to long-term contracts; SK hynix disclosed at its July earnings call that it had signed multi-year deals with around 10 customers, including major clients; per Business Post citing KeyBanc, HP and Dell have extended their memory supply agreements with Micron through 2031, while Alphabet is seeking contracts with memory suppliers lasting until 2035. Separately, SK hynix has decided to shelve the IPO of its U.S. subsidiary Solidigm, with no concrete funding plan disclosed; per Hankook Ilbo, potential options range from internal cash and borrowing to joint ventures and customer-backed financing tied to long-term supply agreements.
HBM4DRAMNANDSK hynix, Samsung and 5 totalTrendForcePrice Movement
19:00Impact score 55
AMD CEO Lisa Su proposed bringing back the Ryzen 7 5800X3D, set plan in motion before DDR5 shortages
According to Tom's Hardware, published 25 October 2026, AMD Director of Client Product Management Travis Kirsch told the Japanese publication MyNavi Tech+ that AMD CEO Lisa Su was one of the proponents of bringing back the Ryzen 7 5800X3D processor, which first debuted in April 2022. The relaunch was not a simple re-release: the company had to do extensive re-engineering and update its manufacturing process with TSMC to bring it back. The relaunch of the Ryzen 7 5800X3D coincided with the memory chip shortage, with the world suffering from extremely high DDR5 memory prices (DDR5 finally arrived in the middle of 2026), but Kirsch said 'this was planned before changes in the memory market occurred, not as a countermeasure to DDR5 shortages,' calling it 'the final gift to local users who have used our AM4 for nearly a decade, offering systems that use DDR4 the last change to upgrade their PCs.' Kirsch also said AMD is mostly focused on the premium, high-performance gaming market (AMD closed in on Intel at 48.4% CPU share in the October Steam Survey), while the affordable CPU market is no longer as big as it used to be as laptops have taken over that segment.
Ryzen 7 5800X3D CPUAM4 platformDDR4 memoryAMD, TSMCTom's Hardware
09:29Impact score 55
RT NEWS: #Micron and #Samsung both stack #HBM directly on processors: Micron's #vHBM keeps a base die and targets 2028, while Samsung's zHBM drops the...
Per a repost by TrendForce, Micron and Samsung both plan to stack HBM directly on processors. Micron's vHBM keeps a base die and targets 2028, while Samsung's zHBM drops the 2.5D interposer, with commercialization eyed for about 2029 and as early as 2028. These are stated targets and plans, not achieved commercialization results.
HBMvHBMzHBMMicron, SamsungTrendForce Official (Market Data)
08:44Impact score 50
Namuga expands beyond Samsung with humanoid robot camera modules
South Korean image-sensing module maker Namuga is accelerating its physical AI strategy after securing a supply deal with a global humanoid robot company. The company is preparing for shipments and mass production while targeting revenue of KRW1 trillion (approximately US$754.7 million) by 2030. This target is a goal not yet achieved; the source does not state the cause of any specific supply or price impact.
humanoid robot camera modulesNamugaDigiTimes AsiaPartnership/M&A
00:03Impact score 50
Samsung to use TSMC technology for Nvidia's next-generation memory chips, Seoul newspaper reports. 📰 News Source: https://buff.ly/K9khqpF
According to a report by a Seoul newspaper (retweeted by TrendForce on October 24, 2026), Samsung is to use TSMC technology for Nvidia's next-generation memory chips. This is only a media report; the source does not state the cause and provides no specific terms, timeline, or confirmed implementation status, and it is not stated whether the report has been confirmed by Samsung, TSMC, or Nvidia.
Nvidia next-generation memory chipsSamsung, TSMC and 3 totalTrendForce Official (Market Data)Partnership/M&A

Sat, Oct 24

18:20Impact score 55
RT NEWS: #Micron has studied 4F² #DRAM for 20+ years and still skips it, saying the density edge is near-mythical and capacitor pitch sets bit densit...
According to a repost from TrendForce, Micron has studied 4F² DRAM for 20+ years and still skips it, saying the density edge is near-mythical and capacitor pitch sets bit density. In contrast, CXMT (Oct. 10) and Samsung (CTO, Oct. 14) are pursuing 4F² DRAM, while Micron plans to ramp 1δ in 2H27. The ramp remains a plan as stated, not a completed result.
4F² DRAM1δ DRAMMicron, CXMT and 3 totalTrendForce Official (Market Data)
00:00Impact score 30
Delta Unveils SST-Based DC Power System for AI Data Centers
Delta is showcasing microgrid solutions for AI factories, high-performance computing (HPC) data centers, and smart manufacturing at Energy Taiwan 2026, held October 14 to 16 at Taipei Nangang Exhibition Center, Hall 1, 4F, Booth M0319a. Its prefabricated DC power system based on solid-state transformers (SSTs) uses a containerized architecture integrating SSTs, DC/DC converters, and control equipment, reduces the number of power conversion stages, and achieves SST energy efficiency of up to 98.5%; according to Delta, its implementation can improve grid-to-chip energy efficiency in AI data centers by 4–5%. The system can incorporate high-C-rate batteries to respond to rapid AI workload variations, providing millisecond-level power support, and its modular, prefabricated design can potentially shorten deployment time by up to 50%, with an architecture supporting future capacity expansion as computing demand increases. Delta is also presenting solid oxide fuel cell (SOFC) technology for distributed power generation, with overall system efficiency of up to 85% when heat recovery is included; Delta plans to begin trial production of its SOFC solution by the end of 2026. The exhibition also includes EnergiQ, a digital energy management platform developed by Delta's ESG Consulting Office and built around the ISO 50001 methodology, plus expert presentations involving Taiwan's Industrial Technology Research Institute, Taiwan Institute of Economic Research, and Delta's smart energy and microgrid teams.
solid-state transformers (SSTs)DC/DC converterssolid oxide fuel cell (SOFC) technologyDeltaPower Electronics News

Fri, Oct 23

23:32Impact score 55
Micron's next-generation 3D NAND to double bit density with over 400 layers, offering extreme performance
At an event this week, Micron announced that its next-generation 3D NAND (G11), which it plans to enter mass production in 2H 2027, is set to offer three significant advantages: doubling storage density (approximately twice the bit density of G9, with 3D TLC going from 21 Gb/mm² to 42 Gb/mm²), increasing I/O performance by up to 50% versus the company's current-generation NAND memory (interface speed from 3,600 MT/s to 5,400 MT/s), and reducing data transfer energy consumption per bit by more than 25%. G11 will adopt wafer-on-wafer bonding, manufacturing the NAND array on a new 3D NAND node and the peripheral circuits and I/O on a logic process before bonding them together, and will transition to more than 400 NAND layers; Micron has not disclosed the exact number of active wordline layers or memory decks. Micron executive Scott DeBoer described G11 as the world's most advanced NAND, ramping in the second half of next year. Micron also expects to disclose more G11 technical details in 2027 and, beyond G11, is developing high-mobility materials and denser cell architectures to continue XYZ scaling; specific architectural details, density targets, or production schedules for post-G11 generations have not been disclosed. These are the company's stated plans and expectations; mass production has not yet occurred.
3D NANDG11 3D NANDMicronTom's HardwareCapacity Change
23:21Impact score 58
Solidigm confirms plans to build a fab in the US, abandons IPO plans
In an early Friday announcement dated 23 October 2026, SK hynix said it had decided to abandon plans for a potential initial public offering (IPO) of Solidigm, its U.S.-based enterprise SSD subsidiary, citing unfavorable stock market conditions and semiconductor share price trends. At the same time, SK hynix confirmed it plans to build a new fab for Solidigm in the U.S. to address growing demand for enterprise SSDs. SK hynix stated that although an IPO could have helped finance a new fab in the U.S., its subsidiary's expansion remains a priority; the company has discontinued its review of both pre-IPO financing and an IPO and will continue to evaluate alternative funding mechanisms. The source states that the planned fab's capacity, investment requirements, and construction schedule have not yet been disclosed. Solidigm specializes in high-capacity data center SSDs based on floating gate 3D QLC NAND memory, and its existing manufacturing capacity is barely sufficient to address its projected needs.
enterprise SSD3D QLC NANDSolidigm, SK hynixTom's HardwareCapacity Change
23:16Impact score 30
Most Read – xMCUs, NVHBM base dies, Qualcomm layoffs
This is a roundup of the site's most popular articles from the last week. No. 5: Google and Synaptics have introduced the xMCU – an MCU combining heterogeneous, AI-native compute and acceleration with integrated high-bandwidth custom DRAM scalable to hundreds of megabytes; the Astra SR200 Series targets AI wearables and battery-powered sensing devices, enabling larger AI models and richer multimodal workloads entirely on-device. No. 4: According to the Data Centers Processor Market Monitor, Q3 2026, agentic AI is reviving datacenter CPU demand, with CPU revenues up 35%, ahead of AI ASICs (+23%) and GPUs (+13%); GPU and AI ASIC designers are scaling back their roadmaps, sometimes drastically, in response to the sharp rise in DRAM prices. No. 3: London neocloud startup Nscale has had another setback to its IPO plans as Microsoft pulled out of a deal to be the anchor tenant on Nscale's Loughton, Essex, datacentre; neither party gave any reason for the pull-out, but UK Power Networks has told Nscale it cannot supply enough power for the site until the early to mid 2030s. No. 2: Per the Seoul Economic Daily, Nvidia has asked Samsung, Hynix and Micron to use base dies made on TSMC's 3nm node for its custom HBM called NVHBM; the base die contains the logic layer at the bottom of the HBM stack that handles the memory controller and interface, and the source's report of Nvidia's reason is truncated. No. 1: According to a memo from CEO Cristiano Amon to employees seen by Reuters, Qualcomm is to lay off staff worldwide, with notifications to start next month; the number involved is not known, the company had 52k employees in September 2025, and the memo describes the lay-offs as "a performance-focused reduction after annual reviews".
xMCUNVHBM base dieHBMGoogle, Synaptics and 10 totalElectronics Weekly
23:00Impact score 55
XP Power Expands Medical Power Portfolio with UCH750 Series
XP Power has introduced the UCH750 series of 750W convection-cooled AC-DC power supplies for medical and industrial equipment requiring quiet operation, high efficiency, and reliable performance. The compact, chassis-mount, fanless design reduces acoustic noise and removes a wear-prone mechanical component, making the supplies suitable for noise-sensitive applications including medical imaging, patient monitoring, diagnostic instruments, treatment equipment, and home healthcare devices, as well as hospital equipment, factory automation, semiconductor manufacturing, test-and-measurement systems, and telecommunications infrastructure. The series achieves up to 96% conversion efficiency, and each unit measures 203.2 × 127.0 × 40.0 mm. It supports medical equipment requiring BF (Body Floating) applied-part classification, provides two Means of Patient Protection (2 × MOPP) of isolation between input and output, with a maximum patient leakage current of 100 µA under 264 VAC, 60 Hz conditions. The series reports to IEC 60601-1 and has UL and TÜV safety approvals, with Class I and Class II versions available; IEC 62368-1 safety approvals support IT and industrial integration, and the UCH750 meets EN 55032 Class B limits for conducted and radiated emissions. Five models provide nominal DC outputs of 12 V, 24 V, 36 V, 48 V, and 54 V from a universal 90–264 VAC input, delivering the full 750 W output from a 100 VAC input at ambient temperatures up to +50°C. Additional features include remote on/off control, a 5 VDC/2 A standby output, and built-in protection against overload, short circuit, overvoltage, and overtemperature. The series is available through Avnet Abacus, DigiKey, element14, Farnell, Mouser, RS, TME, authorized regional distributors, and directly from XP Power, with a three-year warranty. This is a product introduction announcement and does not constitute confirmed capacity or price changes.
UCH750 series 750W convection-cooled AC-DC power suppliesXP PowerPower Electronics News
22:00Impact score 15
The Wafer Is the New Battleground: Soitec CPO René Jonker on Building AI from the Substrate Up
In an interview at SEMICON West 2026, Soitec Chief Product Officer René Jonker discussed the company, which was spun out of CEA-Leti in 1992 around the Smart Cut process. Soitec now runs five main technology platforms: RF-SOI (used in RF switches and low-noise amplifiers in practically every 5G phone and Wi-Fi module), FD-SOI (used in automotive radar, IoT microcontrollers and edge devices, often cutting power by 30 to 50 percent without a node shrink), Power-SOI (high-voltage automotive and industrial circuits), POI (acoustic RF filters for 5G and 6G), and Photonics-SOI, developed a decade ago and now the platform carrying the company. Jonker said Photonics-SOI is 'now seen as the new gold'; as AI cluster connectivity pushes traffic from copper to fiber, it is driving Soitec's business 'with a very impressive growth rate' and underpins the co-packaged optics now coming into AI data centers. The article notes that Soitec trades on Euronext Paris and that an investor who put $100 into its stock in January 2026 was holding more than $600 by early October. On competition, Jonker said direct competition comes mostly from GlobalWafers, which 'has or used to have access to our IP,' while technology-level competition includes FD-SOI customers who could choose FinFET at TSMC, and a trade-off between silicon and indium phosphide for optical waveguides. SmartSiC (lowering the cost of SiC power devices for EV inverters) and RF-GaN on insulator (in development for 6G power amplifiers and aerospace) remain in development, and FD-SOI is moving to smaller geometries.
Photonics-SOIRF-SOIFD-SOISoitecSemiWiki
21:30Impact score 10
China can make advanced chips without EUV, but the bill keeps growing
An analysis article published 23 October 2026 reports that export controls keep ASML's most advanced EUV lithography machines out of China, so the country's chip industry relies on DUV lithography with multiple patterning to make advanced chips, at the cost of bigger dies, more defects, lower yields, longer manufacturing times and higher bills. Chris Mack, co-founder and CTO of Fractilia, said industry conventional wisdom held that three exposures on a 193 immersion tool cost about the same as one exposure on an EUV tool, and that at four masks EUV became more cost-effective. Teardowns of Huawei's Mate 60 Pro in 2023 found its Kirin 9000S processor made by SMIC using a second-generation 7nm-class process without EUV; analysis of Huawei's Kirin 9030 found SMIC had pushed its DUV-based process closer to 5nm-class density, though it continued to lag TSMC and Samsung leading processes. A June Morgan Stanley report estimated Chinese DRAM maker CXMT was producing only around one-third as many bits per wafer as Western competitors, with the older process node accounting for only about a third of that shortfall, and said access to lithography is a 'hard ceiling' on Chinese memory development. Micron's 1-alpha generation was developed without EUV, showing how far DUV can be stretched; Micron's newer 1-gamma DRAM process uses EUV, which Micron said achieves more than 30% greater bit density per wafer than its preceding 1-beta generation. Morgan Stanley assumes CXMT remains stuck on its 1-alpha process without EUV, yet raises its share of global DRAM bit supply from 14% in 2026 to 16% in 2028 by building more greenfield capacity, and expects China's AI chip self-sufficiency to rise from 42% in 2025 to 70% by 2030. Mack said he would be hard pressed to believe a three-nanometer or two-nanometer node is economically viable without EUV.
DUV lithographyEUV lithographyDRAMASML, SMIC and 7 totalTom's Hardware
21:00Impact score 55
US to provide up to $389 million in CHIPS awards to 4 firms
The US Department of Commerce announced the signing of four letters of intent to provide up to USD 389 million in federal R&D awards under the CHIPS and Science Act (reported October 23, 2026). Under the final awards, each company will conduct R&D to address critical projects spanning power semiconductor devices, modules and materials essential to the semiconductor supply chain. Helion will receive up to USD 175 million to develop, scale and establish domestic capabilities in high-voltage power semiconductors and advanced energy power modules for high-peak-current pulsed-power applications in fusion power generation. Commonwealth Fusion Systems will receive up to USD 85 million for R&D on semiconductors for radio-frequency plasma heating, power electronics, embedded electronics for fusion diagnostics, and radiation-hardened electronics. Vertical Semiconductor will receive up to USD 73 million to advance its vertical GaN power semiconductors, enabling more efficient and compact power delivery for advanced computing. Sibelco will receive up to USD 56 million to develop next-generation purification and finishing technologies for ultra-high-purity quartz used in crystal growth crucibles and other hardware. This is an announcement of signed letters of intent for R&D funding, a policy development to be watched for any price impact.
power semiconductor devicespower semiconductor modulesvertical GaN power semiconductorsHelion, Commonwealth Fusion Systems and 4 totalEvertiqPolicy/Regulation
21:00Impact score 20
Leveraging the FinFET Structure for Power: Applications and Use Cases
This is a technical overview (background) article discussing the roles of the FinFET structure and vertical GaN in high-power electronics (industrial, EVs, AI data centers); it contains no price or supply-demand movement. Key points: FinFETs are moving from logic to the power path, with foundries such as GlobalFoundries offering FinFET processes; Empower Semiconductor (now part of Analog Devices) developed its FinFast platform around ultra-fast FinFET-based power transistors; Claros (now part of Navitas) announced it will manufacture its integrated voltage regulators (IVRs) on Samsung Foundry's US-based 14-nm FinFET process. According to Empower, its Crescendo IVRs achieve roughly 20x faster transient response than conventional solutions; by paralleling up to 50 IVRs of roughly 60 A each, more than 3,000 A can be supplied to the load, with 2x lower voltage droop, which the company says yields an additional 15% reduction in xPU power for a typical AI workload. In May 2026, Analog Devices said it had entered a definitive agreement to buy Empower Semiconductor for $1.5 billion in cash, and the acquisition closed in July 2026. On vertical GaN: in 2024 Power Integrations acquired Odyssey Semiconductor's assets to develop vertical-conduction GaN FETs with 650 V and 1,200 V blocking voltages; onsemi introduced its proprietary GaN-on-GaN vertical architecture (vGaN), saying it reduces energy loss by almost 50%, manufactured at its fab in Syracuse, NY, acquired from NexGen Power Systems at the end of 2024; in October 2025, MIT spin-out Vertical Semiconductor raised an $11 million seed round led by Playground Global, demonstrated its vertical GaN process for 100 V to 1.2 kV device classes on 8-inch wafers, and hopes to have a fully integrated product out by the end of the year. The source does not state any cause related to price impact or market supply-demand.
FinFET-based power transistors (IVRs)vertical GaN power transistorsintegrated voltage regulators (IVRs)Analog Devices, Empower Semiconductor and 10 totalPower Electronics News
16:25Impact score 60
Semco's 61-week MLCC lead times give suppliers upper hand in AI supply chain
Samsung Electro-Mechanics (Semco) is gaining pricing power because AI server demand has extended multilayer ceramic capacitor (MLCC) lead times beyond a year (61 weeks per the title). The source states the cause as AI server demand. Shortages now span consumer, automotive and industrial products, prompting customers to secure 2027 supplies.
multilayer ceramic capacitor (MLCC)Samsung Electro-Mechanics (Semco)DigiTimes AsiaInventory Shift

Analog	$0.68	−5.9%
Connector	$0.75	+0.2%
CPU	$386.74	−21.3%
DDR4	$88.40	−0.2%
DDR52026-W13	$14.89	−11.2%
GPU	$478.20	+8.2%
MCU	$0.68	−61.7%Unusual
MLCC	$0.01	+54.0%Unusual
MOSFET	$0.12	−82.8%Unusual
PMIC2026-W13	$0.44	−12.5%
SSD/HDD	$288.43	n/a

NuAxi Stream - Real-Time Semiconductor Intelligence

Mon, Oct 26

Gigavis Wins 46.9 Billion Won Inspection Equipment Order

TLB Begins Development of SOCAMM3 Substrates for AI Servers

Silicon Photonic Modulator Reaches 200 Gb/s PAM4 With Reduced DSP (Science Tokyo, Yokohama, AIST, PETRA)

AJ Cooper is the Co-Founder and CEO of Itera

Sun, Oct 25

[News] SK hynix 3Q Earnings Preview: Record Profit at 78% Operating Margin; HBM4, LTAs, Solidigm in Focus

AMD CEO Lisa Su proposed bringing back the Ryzen 7 5800X3D, set plan in motion before DDR5 shortages

RT NEWS: #Micron and #Samsung both stack #HBM directly on processors: Micron's #vHBM keeps a base die and targets 2028, while Samsung's zHBM drops the...

Namuga expands beyond Samsung with humanoid robot camera modules

Samsung to use TSMC technology for Nvidia's next-generation memory chips, Seoul newspaper reports. 📰 News Source: https://buff.ly/K9khqpF

Sat, Oct 24

RT NEWS: #Micron has studied 4F² #DRAM for 20+ years and still skips it, saying the density edge is near-mythical and capacitor pitch sets bit densit...

Delta Unveils SST-Based DC Power System for AI Data Centers

Fri, Oct 23

Micron's next-generation 3D NAND to double bit density with over 400 layers, offering extreme performance

Solidigm confirms plans to build a fab in the US, abandons IPO plans

Most Read – xMCUs, NVHBM base dies, Qualcomm layoffs

XP Power Expands Medical Power Portfolio with UCH750 Series

The Wafer Is the New Battleground: Soitec CPO René Jonker on Building AI from the Substrate Up

China can make advanced chips without EUV, but the bill keeps growing

US to provide up to $389 million in CHIPS awards to 4 firms

Leveraging the FinFET Structure for Power: Applications and Use Cases

Semco's 61-week MLCC lead times give suppliers upper hand in AI supply chain

Chip Teardown Lab2 opened

Component price indexNPI, vs. prior period

Trending components