NuAxiSemiconductor trade intelligence
RT NEWS: #Micron and #Samsung both stack #HBM directly on processors: Micron's #vHBM keeps a base die and targets 2028, while Samsung's zHBM drops the...
What happened
Per a repost by TrendForce, Micron and Samsung both plan to stack HBM directly on processors. Micron's vHBM keeps a base die and targets 2028, while Samsung's zHBM drops the 2.5D interposer, with commercialization eyed for about 2029 and as early as 2028. These are stated targets and plans, not achieved commercialization results.
Impact and signal
Medium impactImpact score: 55/100
Affected components and suppliers
Source and time
Source: TrendForce Official (Market Data) · 10/24/2026 · View original source
Open the NuAxi live feed →
Real-time pricing, supply signals and AI analysis for semiconductor traders