Samsung Taps TSMC for NVHBM Base Die Production

What happened

Samsung is reportedly collaborating with TSMC, the world's largest chip maker, to secure a base die supply for NVIDIA's newly announced NVHBM memory standard; this is a reported (rumored) arrangement and not confirmed as implemented. NVIDIA claims that, compared to standard HBM4E, NVHBM integrates the controller into the 3D HBM stack and delivers up to 30% more memory bandwidth, 15% lower HBM power consumption, and up to 25% more usable compute die area on the processing unit. According to the report, there are strict requirements that must be fulfilled before NVHBM mass production, one of which is that NVIDIA's NVHBM base die must be manufactured on TSMC's 3 nm node; even though Samsung has its own 3 nm production lines, NVIDIA's IP is reportedly optimized for TSMC's nodes, forcing Samsung to collaborate with TSMC and become its customer despite its own production capabilities. This arrangement applies only to the base die; for memory, Samsung will continue using its sixth-generation 10 nm processes, typical for HBM manufacturing, meaning only part of the production will be handled by TSMC.

Impact and signal

Affected components and suppliers

Source and time

Source: TechPowerUp · 10/19/2026 · View original source