Advanced logic processes are becoming increasingly important to the HBM supply chain as demand for customized HBM (cHBM) grows. Starting with the HBM4...

What happened

TrendForce indicates that advanced logic processes are becoming increasingly important to the HBM supply chain as demand for customized HBM (cHBM) grows; starting with the HBM4e generation, all HBM base dies are expected to adopt advanced logic processes, with cHBM base dies potentially using 4nm or more advanced nodes. NVIDIA's NVHBM is expected to be adopted in HBM4e and subsequent generations to support next-generation AI chips scheduled to enter volume production from 2028 onward, and NVHBM base dies are expected to rely primarily on TSMC's advanced processes. As base dies become more valuable, collaboration between HBM suppliers and foundries is expected to deepen, extending HBM competition beyond core dies to encompass access to advanced logic capacity. Separately, Semiconductor Insider exclusively reported on Oct 18 that Samsung Electronics is to develop 'Next-Generation HBM' with TSMC; the tweet was posted on Oct 20, 2026.

Impact and signal

Affected components and suppliers

Source and time

Source: TrendForce Official (Market Data) · 10/19/2026 · View original source