Nvidia's custom HBM pulls Samsung onto TSMC's 3nm process, report says

What happened

According to a report by the Seoul Economic Daily on October 18, citing industry sources, Samsung Electronics has agreed after an internal review to use TSMC's 3nm process for the base die of NVHBM, Nvidia's next-generation custom HBM. The newspaper said it would be the first time the two companies have worked together at the HBM manufacturing stage. The report states that Nvidia's custom memory design is shifting control of how HBM is built from memory makers to its largest customer, steering part of that work to TSMC. This is a media report citing industry sources; actual implementation remains to be confirmed.

Impact and signal

Affected components and suppliers

Source and time

Source: DigiTimes Asia · 10/18/2026 · View original source