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Samsung's Nvidia HBM bid raises four strategic concerns
What happened
Samsung Electronics is reportedly planning to turn to TSMC's 3nm process to produce base dies for Nvidia's custom high-bandwidth memory (NVHBM), abandoning its long-standing turnkey integration model in order to win a place in Nvidia's supply chain. According to the report, the move could meet customer requirements, but it is raising concerns in South Korea over Samsung Foundry's competitiveness, HBM design control, and the long-term benefits of internal collaboration. The source does not state whether the plan has been finalized.
Impact and signal
Medium impactImpact score: 55/100
Affected components and suppliers
high-bandwidth memory (NVHBM) base die
SamsungTSMCNvidiaNVHBMbase die3nm
Source and time
Source: DigiTimes Asia · 10/21/2026 · View original source
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