NuAxi Stream - Real-Time Semiconductor Intelligence

Wed, May 27

07:20Impact score 15
Infineon Launches EU Flagship Project Moore4Power
Infineon leads a €91 million R&D project involving 62 partners to develop next-generation power electronics using 'More than Moore' integration of Si, SiC, and GaN. The initiative targets wind energy, e-mobility, and railway sectors with a focus on efficiency and digital product passports. Watch: This is a long-term technology roadmap with no immediate supply chain impact.
Power electronicsSilicon Carbide (SiC)Gallium Nitride (GaN)Infineon Technologies AGPower Electronics NewsTechnical

Tue, May 26

19:00Impact score 15
Infineon Expands CoolGaN BDS Family
Infineon Technologies introduced two new CoolGaN BDS 40 V G3 bidirectional switches, IGK048B041S and IGK120B041S, targeting compact consumer electronics. These devices reduce PCB footprint by up to 82% and offer lower gate charge compared to silicon alternatives. The launch supports Infineon's strategy of advancing 300mm GaN manufacturing capacity.
GaN DevicesGallium NitridePower SwitchesInfineon TechnologiesPower Electronics NewsProduct Launch
18:09Impact score 10
Infineon presenting at PCIM Europe 2026
Infineon will showcase its semiconductor portfolio for power infrastructure, AI data centers, robotics, and electromobility at PCIM Europe 2026 in Nuremberg from May 9-11, 2026. The event focuses on power electronics and renewable energy. Neutral: This is a standard industry exhibition and does not indicate immediate supply constraints or price changes.
Power SemiconductorsIGBTSiCInfineon Technologies AGSemiconductor TodayProduct Launch
13:27Impact score 45
US Chips Act money for quantum
The U.S. Chips Act allocated over $1.5 billion in R&D funding to quantum computing companies, including IBM and Globalfoundries. IBM and the Department of Commerce plan to establish a 300mm quantum wafer foundry, Anderon, in New York.
Quantum ChipSuperconducting QubitPhotonic QubitIBM, Globalfoundries and 8 totalElectronics WeeklyPartnership/M&A
04:52Impact score 10
Toshiba Starts Sampling 1200V SiC MOSFET in QDPAK Package
Toshiba has begun shipping test samples of the TW007D120E 1200V SiC MOSFET, featuring a 58% reduction in on-resistance compared to existing products. The device targets AI data centers and renewable energy applications with improved thermal performance. Watch: Mass production is planned for fiscal year 2026.
SiC MOSFETToshibaPower Electronics NewsProduct Launch

Mon, May 25

22:00Impact score 25
Stackpole Introduces Low-VCR High-Voltage Chip Resistors
Stackpole Electronics launched the RVCU series of high-voltage chip resistors featuring a low voltage coefficient of resistance (VCR) of 25-50 ppm and 0.5% tolerance. This new product targets precision applications requiring stability but does not indicate immediate supply constraints or price changes.
High-voltage chip resistorsStackpole ElectronicsPower Electronics NewsProduct Launch
19:07Impact score 10
Stackpole Introduces High‑Voltage Low VCR Chip Resistors
Stackpole Electronics launched high-voltage chip resistors with low voltage coefficient for automotive applications. This product release targets specific high-reliability needs but does not immediately impact spot prices or supply chain availability.
Chip ResistorsStackpole ElectronicsPassive Components EUProduct Launch
14:08Impact score 10
Huawei looks to 1.4nm by 2031
Huawei targets 1.4nm equivalent density by 2031 using 'Logic Folding' technology, aiming to close the gap with TSMC without EUV. This long-term R&D roadmap focuses on circuit architecture optimization rather than immediate supply chain shifts.
HuaweiElectronics WeeklyTechnical
13:03Impact score 90
Nvidia's Vera CPU push lifts LPDDR outlook for Samsung, SK Hynix
Nvidia's standalone Vera CPU launch is driving new demand for low-power DRAM, specifically benefiting Samsung Electronics and SK Hynix amidst an already constrained supply chain.
LPDDRLow-power DRAMSamsung Electronics, SK HynixDigiTimes AsiaShortage Alert

Sat, May 23

20:54Impact score 25
Jensen Huang lands in Taiwan, calls Vera Rubin biggest product ramp in computer history
Nvidia CEO Jensen Huang stated that the Vera Rubin AI server platform will be the most successful generation in Nvidia's history and the largest product rollout in Taiwan's electronics industry.
AI ServerVera RubinNvidiaDigiTimes AsiaProduct Launch
19:40Impact score 20
Huawei develops 122TB SSD with new packaging tech to sidestep US sanctions on 3D NAND chips — Chinese firm develops proprietary tech to cram more NAND dies in a smaller footprint
Huawei launched 61.44TB and 122.88TB SSDs using Die-on-Board (DoB) packaging to bypass US sanctions on high-layer 3D NAND. This workaround allows the company to use YMTC's Xtacking 4.0 dies more densely on the PCB. Neutral: While this mitigates sanctions impact on capacity, thermal and signal integrity challenges remain.
SSDNAND Flash3D NANDHuawei, Samsung Electronics and 4 totalTom's HardwareProduct Launch
11:36Impact score 60
Taiwan power chip maker Panjit targets AI and robotics for next growth phase
Panjit International is accelerating its expansion into AI and automotive electronics sectors. The company aims to enter a new growth cycle after four decades in the discrete device market. This strategic shift warrants attention regarding future capacity adjustments.
Power SemiconductorsDiscrete DevicesPanjit InternationalDigiTimes AsiaCapacity Change

Fri, May 22

22:32Impact score 10
CSA Catapult joins project SONATA for aircraft taxiing system
CSA Catapult is developing custom SiC power modules for the SONATA electric taxiing system, targeting a power density of 15 kW/kg.
SiC Power ModulesSilicon CarbideCSA Catapult, AirbusElectronics WeeklyTechnical
22:01Impact score 10
⚡ SiC/GaN Redraw the Global Energy Map AI data centers have hit a power density ceiling. SiC and GaN are entering large-scale deployment across data ...
SiC and GaN are entering large-scale deployment in AI data centers and 800V EV architectures. Major players like Infineon and TI are repositioning their supply chain strategies. This trend indicates a structural shift in power electronics but lacks specific price or shortage data.
SiCGaNVIS, Innoscience and 6 totalTrendForce Official (Market Data)Market Analysis

Thu, May 21

16:59Impact score 75
Procurement shifts strategic amid demand spikes and constraints
Falcon Electronics President Aaron Dufoe highlights a war-driven surge in demand and tightening export controls reshaping the aerospace and defense supply chain. Geopolitical instability and military readiness are driving spikes for critical components and legacy parts, forcing a shift from transactional to strategic procurement. Bullish: This environment intensifies supply constraints and shortages, making proactive lifecycle management and alternate sourcing essential for maintaining production continuity.
Aerospace & Defense ElectronicsLegacy PartsCritical Electronic ComponentsFalcon ElectronicsElectronics SourcingShortage Alert

Wed, May 20

19:00Impact score 10
AI is transforming 2nm packaging advances through global collaboration
Rapidus is building an AI Foundry platform focused on 2nm and next-generation packaging technologies. The company aims to accelerate design-manufacturing co-optimization through global collaboration with governments, academia, and suppliers. Watch Rapidus' strategic progress as it currently has no direct impact on spot market supply.
2nmChipletRapidusElectronics WeeklyMarket Analysis
15:30Impact score 65
Doosan Corporation to establish CCL production base in Thailand
Doosan Corporation plans to invest approximately $120 million in a new CCL production base in Thailand, targeting mass production in the second half of 2028, to meet the rising demand from AI data centers.
CCLCopper Clad LaminateDoosan CorporationEvertiqCapacity Change
15:18Impact score 3
SEMI FlexTech calls for proposals on flexible hybrid electronics
SEMI FlexTech launched an RFP worth $250,000-$500,000 to advance Flexible Hybrid Electronics (FHE), funded by the Army Research Laboratory (ARL). The initiative focuses on next-generation materials and additive processing. Neutral impact: This is a long-term R&D milestone with no immediate effect on current supply or pricing.
Flexible Hybrid ElectronicsAdditive Processing MaterialsSEMI FlexTech, Army Research LaboratoryeeNews EuropeTechnical
03:38Impact score 65
[News] ASML Expects First High-NA EUV Memory, Logic Products Within Months Amid TSMC’s Cost-Driven Delay
ASML CEO expects first High-NA EUV products within months, while TSMC delays adoption due to high costs. Intel and SK hynix are aggressively deploying the technology, whereas Samsung adopts a pragmatic approach.
High-NA EUV Lithography EquipmentASML, TSMC and 5 totalTrendForceCapacity Change

Mon, May 18

17:14Impact score 20
Microchip miniature crystal oscillator for power‑constrained designs
Microchip Technology has launched the EX-423 Evacuated Miniature Crystal Oscillator (EMXO) for power-constrained applications. The device features ultra-low phase noise and operates at 10-20MHz with a rugged 13mm x 13mm package. It is now available for purchase.
Crystal OscillatorEMXOMicrochip TechnologyElectronics WeeklyProduct Launch

Analog	$0.68	−5.9%
Connector	$0.75	+0.2%
CPU	$386.74	−21.3%
DDR4	$88.40	−0.2%
DDR52026-W13	$14.89	−11.2%
GPU	$478.20	+8.2%
MCU	$0.68	−61.7%Unusual
MLCC	$0.01	+54.0%Unusual
MOSFET	$0.12	−82.8%Unusual
PMIC2026-W13	$0.44	−12.5%
SSD/HDD	$288.43	n/a

NuAxi Stream - Real-Time Semiconductor Intelligence

Wed, May 27

Infineon Launches EU Flagship Project Moore4Power

Tue, May 26

Infineon Expands CoolGaN BDS Family

Infineon presenting at PCIM Europe 2026

US Chips Act money for quantum

Toshiba Starts Sampling 1200V SiC MOSFET in QDPAK Package

Mon, May 25

Stackpole Introduces Low-VCR High-Voltage Chip Resistors

Stackpole Introduces High‑Voltage Low VCR Chip Resistors

Huawei looks to 1.4nm by 2031

Nvidia's Vera CPU push lifts LPDDR outlook for Samsung, SK Hynix

Sat, May 23

Jensen Huang lands in Taiwan, calls Vera Rubin biggest product ramp in computer history

Huawei develops 122TB SSD with new packaging tech to sidestep US sanctions on 3D NAND chips — Chinese firm develops proprietary tech to cram more NAND dies in a smaller footprint

Taiwan power chip maker Panjit targets AI and robotics for next growth phase

Fri, May 22

CSA Catapult joins project SONATA for aircraft taxiing system

⚡ SiC/GaN Redraw the Global Energy Map AI data centers have hit a power density ceiling. SiC and GaN are entering large-scale deployment across data ...

Thu, May 21

Procurement shifts strategic amid demand spikes and constraints

Wed, May 20

AI is transforming 2nm packaging advances through global collaboration

Doosan Corporation to establish CCL production base in Thailand

SEMI FlexTech calls for proposals on flexible hybrid electronics

[News] ASML Expects First High-NA EUV Memory, Logic Products Within Months Amid TSMC’s Cost-Driven Delay

Mon, May 18

Microchip miniature crystal oscillator for power‑constrained designs

Chip Teardown Lab2 opened

Component price indexNPI, vs. prior period

Trending components