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Huawei develops 122TB SSD with new packaging tech to sidestep US sanctions on 3D NAND chips — Chinese firm develops proprietary tech to cram more NAND dies in a smaller footprint

What happened

Huawei launched 61.44TB and 122.88TB SSDs using Die-on-Board (DoB) packaging to bypass US sanctions on high-layer 3D NAND. This workaround allows the company to use YMTC's Xtacking 4.0 dies more densely on the PCB. Neutral: While this mitigates sanctions impact on capacity, thermal and signal integrity challenges remain.

Impact and signal

Low impactImpact score: 20/100

Affected components and suppliers

SSDNAND Flash3D NANDDie-on-Board (DoB)

Huawei Samsung Electronics SK hynix YMTC (Yangtze Memory Technologies)

sanctionspackagingworkarounddensity

Source and time

Source: Tom's Hardware · 5/23/2026 · View original source

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Huawei develops 122TB SSD with new packaging tech to sidestep US sanctions on 3D NAND chips — Chinese firm develops proprietary tech to cram more NAND dies in a smaller footprint

What happened

Impact and signal

Affected components and suppliers

Source and time

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