Seagate and Toshiba are reportedly competing to acquire TDK's HDD magnetic head business, a multi-billion dollar deal that would consolidate the industry's only independent supplier. This acquisition threatens to disrupt Toshiba's sole supply source and alter the competitive balance of the HDD market. Traders should watch for the outcome as it impacts pricing power and supply security.
HDD Magnetic HeadsSeagate Technology, Toshiba and 3 totalTom's HardwarePartnership/M&A
TDK expands the MLJ1608-G series multilayer inductors for automotive power-over-coax (PoC) circuits, with mass production starting in October 2026; the component provides 1.7 to 2 times higher impedance than conventional parts in the 100–700 MHz range, achieves high impedance up to 2 GHz, and has a 1608 footprint.
Zapata Quantum (OTCQB: ZPTA) announced it has joined the IBM Quantum Network, with plans to use IBM's quantum computers together with Zapata's expertise in use-case discovery and application development, aiming to help close the quantum application gap by translating advances in quantum computing into mission-critical applications and real-world impact. The company said the move builds on a history of joint IBM and Zapata research, including a landmark study published in Nature Biotechnology that produced experimentally validated candidates targeting KRAS and was selected as one of the journal's Top 10 Articles of 2025, as well as co-authored research published in npj Quantum Information that advanced the understanding of variational quantum factoring on a superconducting processor. Zapata said insights from membership will inform Quantum Pilot, its hardware-agnostic platform. The article quotes Zapata CEO Sumit Kapur and VP Strategy and Co-Founder Jonny Olson, who cited IBM's rapid progress toward fault-tolerant quantum computing and said superconducting qubits remain one of the most capable paths to advantage because their hardware is fast. The source does not state any cause beyond these stated motivations.
Littelfuse has introduced the AK-FL Series FlatSuppressX™ transient voltage suppression (TVS) diodes for aviation and eVTOL high-voltage DC power systems. The devices offer 6 kA, 8 kA, and 10 kA surge-current ratings for an 8/20 μs waveform, feature a flat clamping voltage characteristic, are 100% screened per MIL-STD-750, meet RTCA DO-160 environmental qualification, are halogen‑free, RoHS‑compliant, Pb‑free axial‑leaded parts, and are supplied in bulk packaging of 56 devices per box.
SK hynix faces HBM hybrid bonding challenges, delaying sample production behind Samsung. This threatens its market leadership and risks losing high-capacity customers. Bearish for SK hynix supply chain competitiveness.
Samsung Foundry may be on the verge of securing a deal to manufacture Anthropic's AI ASIC on its SF2 2 nm node, with an initial volume of around 200,000 chips, designed by Broadcom targeting approximately 4,000 TOPS of INT8 compute and a TDP of 1,300 W per chip, supported by either 192 GB or 288 GB of HBM3E, using I-Cube 2.5D packaging; the chips are currently produced in South Korea and a new facility is planned in Taylor, Texas.
Anthropic AI ASIC on 2 nm nodeSamsung Foundry, BroadcomTechPowerUpPartnership/M&A
On Oct. 7, the Korea Power Semiconductor Industry Association signed a memorandum of understanding (MOU) with the Korea Institute of Energy Technology (KENTECH), Korea Conformity Laboratories (KCL), the Power Semiconductor Shared University, and Busan Techno Park to build an industrial ecosystem and promote technology cooperation in power semiconductors and next-generation grids. The agreement will remain in effect for one year from the signing date and may be extended for one year at a time upon mutual agreement.
Jack Huynh, senior vice president and general manager of AMD's Computing and Graphics Group, told Korean media on Oct. 7 at Seoul Dragon City in Yongsan that AMD will launch a next-generation APU supporting FidelityFX Super Resolution 4 (FSR 4) by the end of this year, addressing expansion in two directions: expanding support to existing APUs and launching new products. FSR 4, an ML-based AI graphics enhancement technology unveiled at CES 2025 and built for AMD's RDNA 4 graphics architecture, was previously officially supported only on the latest RDNA 4-based Radeon RX 9000 Series graphics cards; existing APUs including the Ryzen Z2 Extreme and Ryzen AI Halo could not officially run FSR 4 because they lacked the performance for the required AI processing. Huynh said AMD has developed a dedicated version of FSR 4 optimized for APU environments, and support for existing APUs will come via a lightweight version of FSR 4. His comments are interpreted to mean AMD will launch a new APU this year with an integrated GPU based on the RDNA 4 architecture. The launch remains a stated plan as of the source.
On October 7, Boss Semiconductor said it will work with Japan's Mirise Technologies to develop chiplet interconnect technology for automotive applications. Boss Semiconductor will support Mirise Technologies' automotive research and development (R&D) project, providing expertise in automotive system-on-chip (SoC) and chiplet design. The companies did not disclose the duration or scale of the collaboration. Mirise Technologies is researching chiplet interconnect technology for automotive applications; chiplets divide functions traditionally integrated into a single semiconductor among multiple smaller chips connected into one system, an approach that can improve yield and cost efficiency while expanding performance and functionality. As background, chiplets have traditionally been used mainly in large, high-performance server chips such as GPUs, and more recently the technology has been adopted in automotive applications as vehicles incorporate functions requiring high-performance computing, including autonomous driving and advanced driver assistance systems (ADAS).
This is a technology overview article on engineered (synthetic) diamond for data center power electronics. The AFCOM State of the Data Center report indicates average rack density has reached 27 kW per rack, making thermal bottlenecks the main limiting factor, while operators migrate to 800 V DC bus architectures. Diamond's thermal conductivity is ~2,200-2,400 W/m·K (up to 3,300 W/m·K for isotopically enriched samples), with a 5.5 eV bandgap and theoretical breakdown field of about 5–10 MV/cm; laboratory Schottky diodes have reached close to 8 MV/cm. Coherent Corp. introduced next-generation bondable diamond thermal management solutions, allowing direct fusion, hybrid, or metallic bonding to silicon, silicon carbide, and gallium nitride, reducing interface thermal resistance by as much as 99 percent for die sizes up to 100 mm². In June 2026, Element Six (part of the De Beers Group) and Tokyo-based precision components maker Orbray announced a reproducible process for 3-inch wafer-scale single-crystal diamond, with 4-inch substrates in development; Element Six is also preparing 2-inch wafers for thermal-bonding volume production at its CVD facility in Gresham, Oregon. Diamond Foundry opened a commercial production facility in Trujillo, Spain, in 2025 and is slowly ramping up production. Japan's Ookuma Diamond Device has built what it calls the world's first diamond semiconductor factory in Ōkuma, Fukushima, and is planning to mass-produce diamond-based semiconductor and power devices for nuclear decommissioning. Power Diamond Systems gave the first public verification of packaged diamond semiconductor performance at SEMICON Japan 2025, showing diamond-based power MOSFETs, and hopes to bring the technology to market in the 2030s. Diamond Quanta reported electron mobility greater than 555 cm²/V·s in polycrystalline diamond. The article states that diamond's function today is best viewed as a thermal enabler placed over proven GaN and SiC switches, not a drop-in replacement device.
engineered (synthetic) diamondGaN-on-diamonddiamond-bonded SiCCoherent Corp., Element Six and 7 totalPower Electronics News
Related manufacturers
Coherent Corp., Element Six, Orbray, Diamond Foundry, Ookuma Diamond Device, Power Diamond Systems, Diamond Quanta
Reported on October 07, 2026, Navitas Semiconductor has completed its acquisition of Claros, a developer of integrated voltage regulators (IVR) for AI data centres. The deal adds the last stage of power conversion, closest to the processor, to Navitas' GaN and SiC portfolio. Claros' technology integrates power transistors, digital control, inductors and capacitors into a single IVR technology stack and is used in two product families, a packaged and an embedded IVR, designed for vertical and embedded power delivery architectures where power conversion takes place close to the processor; according to Navitas, this gives higher efficiency, faster transient response and greater power density. Combined with its gallium nitride and high-voltage silicon carbide technologies for 800 V DC architectures, Navitas says it can now cover the entire power chain from the grid to the processor. Navitas expects the acquisition to add at least USD 3.5 billion to its serviceable addressable market by 2030, bringing the total to more than USD 8 billion, including USD 3.5 billion for GaN and SiC and around USD 1 billion from new JFET technology (a forecast, not an achieved result).
integrated voltage regulators (IVR)GaNSiCNavitas Semiconductor, ClarosEvertiqPartnership/M&A
The labor union at Micron Technology's Taoyuan operations in Taiwan has won the right to strike and set up picket lines. Ballots were counted on the night of October 6, after six days of voting. The title states the strike vote won with 99% support. The source does not state the cause of the dispute.
Navitas Semiconductor completed the acquisition of Claros Inc to expand its AI infrastructure power delivery portfolio. Claros specializes in integrated voltage regulator (IVR) technology for next-generation AI data centers. Watch: This merger strengthens Navitas' position in the AI power management market, potentially influencing future supply dynamics.
GaN Power ICPower Management ICNavitas Semiconductor, Claros IncSemiconductor TodayPartnership/M&A
Infineon Technologies has completed its acquisition of Bengaluru-based C2i Semiconductors, adding digital power control technology aimed at AI data centers and high-performance computing systems. The deal brings C2i's engineering team into Infineon's Power Systems division and expands the chipmaker's R&D presence in India.
digital power control technologyInfineon Technologies, C2i SemiconductorseeNews EuropePartnership/M&A
Global foundry 2.0 market revenue reached a record $96.6 billion in 2Q 2026, up 25% year-on-year. This growth is primarily driven by sustained demand for AI GPUs. The data indicates a bullish market outlook with strong demand pressure.
Marvell and Siemens EDA presented a new verification methodology for 3D IC CoWoS systems at the TSMC OIP Forum, addressing reliability and ESD challenges in complex assemblies.
Microchip and Navitas Semiconductor have launched an 800V DC-to-6V DC reference design for AI datacentres, combining GaNFast power devices with digital signal controllers to enhance efficiency and power density.
GaNFast FETsDigital Signal ControllersCryptoAuthentication ICsMicrochip Technology, Navitas SemiconductorElectronics WeeklyProduct Launch
Altera Corporation and Rutronik have signed a strategic distribution agreement to expand access to Altera's FPGA portfolio across the European market. This partnership enhances technical support and system-level design capabilities for customers in industrial automation, smart mobility, and edge AI sectors. Neutral impact on immediate spot prices, but positive for long-term channel ecosystem.
A consortium led by Aerix launched the MOSAIC-5G project to integrate UK 5G components, securing £3.1 million in Innovate UK funding. The initiative aims to simplify the deployment of standalone private networks using AI and advanced signal processing. Neutral: This R&D milestone focuses on technical integration and efficiency gains rather than immediate supply chain disruptions.
5G CoreRANSignal ProcessingAerix, Antevia Networks and 11 totalElectronics WeeklyTechnical
Related manufacturers
Aerix, Antevia Networks, AttoCore, Noema Signal Labs, Spry Fox Networks, RANsemi, Liverpool 5G, Bath & North East Somerset Council, Extend Robotics, Digital Catapult, Innovate UK
JEDEC released JESD264, the first industry-wide reliability standard for silicon photonics, covering modulators and waveguides. This addresses the lack of optical-specific testing protocols compared to CMOS. TSMC is also advancing mass production of 200Gbps modulators, signaling industry progress.
Silicon PhotonicsModulatorsPhotodiodesJEDEC, TSMC and 4 totalTrendForceTechnical