​Boss Semiconductor, Mirise Technologies Partner on Automotive Chiplet Technology

What happened

On October 7, Boss Semiconductor said it will work with Japan's Mirise Technologies to develop chiplet interconnect technology for automotive applications. Boss Semiconductor will support Mirise Technologies' automotive research and development (R&D) project, providing expertise in automotive system-on-chip (SoC) and chiplet design. The companies did not disclose the duration or scale of the collaboration. Mirise Technologies is researching chiplet interconnect technology for automotive applications; chiplets divide functions traditionally integrated into a single semiconductor among multiple smaller chips connected into one system, an approach that can improve yield and cost efficiency while expanding performance and functionality. As background, chiplets have traditionally been used mainly in large, high-performance server chips such as GPUs, and more recently the technology has been adopted in automotive applications as vehicles incorporate functions requiring high-performance computing, including autonomous driving and advanced driver assistance systems (ADAS).

Impact and signal

Affected components and suppliers

Source and time

Source: The Elec · 10/7/2026 · View original source