Industrial PC (IPC) makers are adding US manufacturing capacity as supply chains regionalize, tariff policy tightens, and government buyers press for local sourcing. The source frames this as a broader reordering of electronics production, with more high-value, time-sensitive work moving closer to North American customers. No specific manufacturers, expansion scale, or timelines are stated in the source.
Novatek reported stronger September and third-quarter 2026 revenue, which the source says suggests seasonal smartphone demand and growth in edge AI chips are supporting the global display and chip supply chain. No specific revenue figures are given in the body; the title states quarterly revenue topped NT$30 billion. According to the source, the results reflect broader shifts in consumer electronics demand, inventory patterns, and AI-related hardware spending.
display driver chipsedge AI chipsNovatekDigiTimes Asia
Toshiba launched a 3300V SiC MOSFET module rated at 800A for demanding power conversion. Vishay introduced 650V superjunction MOSFET modules with a wide operating temperature range. Skyworks qualified the Si829x automotive isolated gate driver for SiC and IGBT applications.
SiC MOSFETPower ModuleSuperjunction MOSFETToshiba, Vishay and 3 totalPower Electronics NewsProduct Launch
Navitas Semiconductor and Microchip Technology have developed an 800V DC-to-6V DC reference design for AI data center rack power systems, based on the Open Compute Project (OCP) 800 V DC architecture. The platform combines Navitas GaNFast™ gallium nitride power devices with Microchip digital power control and hardware security technologies. The primary power stage uses 16 NV6034 devices, each rated at 650 V with 17 mΩ on-resistance, in a stacked half-bridge configuration, with the GaN FETs in a DFN 8×8 mm dual-side-cooled package. Control uses Microchip's dsPIC33AK256MPS306 family digital signal controller (200 MHz 32-bit processor, double-precision floating-point unit, 78 ps high-resolution PWM, and 12-bit ADCs operating at up to 40 MSPS). The platform targets peak efficiency of up to 96% at full load while switching at 1 MHz, with a stated power density of 2,100 W/in³; the architecture directly converts 800 V DC to 6 V DC, combining the conventional 800 V-to-50 V and 50 V-to-6 V stages into a single converter, in an implementation approximately 20% thinner than a mobile phone and intended for close integration with GPU boards. Security is integrated through Microchip's TA100 CryptoAuthentication™ device, and the dsPIC33AK platform also supports cryptographic functions associated with CNSA Suite 2.0 post-quantum cryptography algorithms. The reference platform will include evaluation hardware, software, and design documentation, and will be showcased at Microchip's OCP Event in San Jose, California, from October 12 to 15, 2026.
GaNFast gallium nitride power devicesdsPIC33AK digital signal controllerTA100 CryptoAuthentication deviceNavitas Semiconductor, Microchip TechnologyPower Electronics News
The title states that a Toray film capacitor enables inverter operation at 150°C. The body text reads "TT Electronics: Resistor and Sensing Trends at electronica 2026", which only mentions TT Electronics' resistor and sensing trends at electronica 2026 and provides no further details on the Toray film capacitor, nor any price, capacity, or supply-demand information.
film capacitorToray, TT ElectronicsPassive Components EU
GlobalFoundries announced a $2 billion manufacturing agreement with TSMC to produce AI chip components (silicon interposers) and add fabrication capacity at its Malta, New York facility; volume production is expected to begin ramping in the first half of 2028, the agreement has an initial term of five years and includes a framework for future capacity expansion.
Samsung Electronics' next-generation 12-layer HBM4E high-bandwidth memory (HBM) product has reportedly cleared customer quality validation from Nvidia and major hyperscale data center operators. The source frames this as a report and states that, if confirmed, the result would strengthen Samsung's bid to supply memory for next-generation AI accelerators; however, order timing and mass production plans remain unclear. The source does not state the cause.
AMD CEO Lisa Su visited Samsung on Oct 7 to discuss HBM supply and foundry orders. Samsung seeks foundry business in exchange, but AMD officials cited high risk in outsourcing to Samsung. Neither party has confirmed the deal.
Samsung is reportedly planning to exit the automotive application processor (AP) business it has pursued since 2018. According to the report citing industry sources, once Samsung completes production under existing supply commitments to Hyundai Motor (agreement secured in 2023) and Germany's BMW (secured last year), it plans to discontinue the development and mass production of successor Exynos Auto products; this is a reported plan, not a confirmed halt. Samsung will focus its System LSI operations on image sensors and next-generation mobile APs as it seeks to return the division to full-year profit next year. The stated causes are high development costs from stringent automotive safety and durability requirements and Qualcomm's effective dominance of the automotive AP market, which makes it difficult for Samsung to gain share. The System LSI and foundry businesses have together posted annual losses totaling trillions of won. In its latest detailed update released with second-quarter results in July, Samsung said expanded sales of mobile SoCs and image sensors helped System LSI post record first-half revenue in 2026. Samsung is developing the Exynos 2700 mobile AP, scheduled to enter mass production in the fourth quarter on Samsung Foundry's second-generation 2nm process, and seeks to expand its adoption in the Galaxy S27 series due in 2027; Samsung spent KRW 7.44 trillion on mobile APs from external suppliers in the first half of 2026. Samsung also plans to expand businesses including display driver ICs (DDIs), power management ICs (PMICs), and chip design for data centers.
automotive application processors (APs)image sensorsnext-generation mobile APsSamsung, Samsung Electronics System LSI division and 6 totalTrendForceEOL/Discontinuation
Related manufacturers
Samsung, Samsung Electronics System LSI division, Qualcomm, Hyundai Motor, BMW, Apple
According to an October 08, 2026 report, Delta Electronics has opened an Automation & Robotics Center in Stuttgart where customers, partners and system integrators can test the company's robots and automation solutions. The centre covers approximately 600 square metres and around seven engineers will be based at the site; it will be used for technology demonstrations, proof-of-concept development, customer workshops, technical training and application engineering. Applications displayed at the opening included Delta's D-Bot collaborative robots, among them a palletising solution, a material flow demonstration in which the D-Bot DC20 and DC30 work together, and a robotic dry welding application. As background, Delta joined the Stuttgart-based research campus ARENA2036 in 2025.
Keysight Technologies, Inc. (NYSE: KEYS) announced the Velocity 4900 Series, a new line of cost-effective Layer 1 automation switches designed to automate physical connectivity in network test labs through software-controlled testbed configuration, supporting testing for networks and infrastructure for AI, 6G, and next-generation services. The first two models: the Velocity 4902 is a high-speed Layer 1 automation switch supporting Ethernet speeds from 100 Mbps to 100 Gbps, with 72 QSFP28 ports supporting 288 connections with breakouts; the Velocity 4906 is a high-density Layer 1 automation switch with 288 SFP28 ports supporting Ethernet speeds from 100 Mbps to 25 Gbps. Both switches provide true Layer 1 forwarding through an ultra-low-latency, fully transparent switching matrix, support single-mode fiber, multimode fiber, direct-attach copper, and active optical cables, and include port tapping for diagnostics and one-to-many traffic replication. According to the source, the product addresses test-lab bottlenecks such as reliance on manual cabling and physical topology changes that leave equipment underutilized and slow testing. The Velocity 4902 and 4906 are available for order immediately, with initial deliveries planned for January 2027.
VONK has launched the NEYA 3.0 Hydrogen Power Conversion Platform, the latest generation of its power-conversion platform for large-scale hydrogen electrolysis. The platform features a standardized architecture to improve grid interaction, installation efficiency, system integration, and maintenance. VONK will publicly present NEYA 3.0 at the Hydrogen Technology World Expo Europe in Hamburg from 20 to 22 October 2026, showcasing it at stand 5F32.
According to a report by Chosun.biz (published 8 October 2026), AMD CEO Lisa Su is visiting South Korea to secure additional supply of HBM memory for AI accelerators, saying 'We are going to talk about our broader partnership' with Samsung executives; Samsung, meanwhile, reportedly 'hopes to turn its memory supply relationship with AMD into foundry' orders for logic chips. The visit comes a little less than seven months after the two companies signed a non-binding memorandum of understanding (MOU) this March, effective for three years and covering four areas: supply of next-generation memory products including HBM4 and advanced DDR5; co-development and optimization of memory solutions for AI and high-performance computing systems; exploration of foundry manufacturing opportunities for future AMD platforms; and co-optimization of advanced packaging and related semiconductor technologies. Samsung has become a principal supplier of HBM4 for AMD's Instinct MI400-series accelerators; expanding collaboration beyond memory supply is considerably more complicated, as it involves considerable efforts to design chips for Samsung Foundry's process technologies and risks associated with a product ramp at a new contract chipmaker — AMD's most recent Annual Report states that transitioning production of some products to new manufacturers may cause delayed product introductions, lower yields or poorer performance. AMD has already started shipments of its Instinct MI455 accelerators with 432GB of HBM4 onboard as well as rack-scale Helios AI systems to interested parties; Su said 'Samsung Electronics and SK hynix are key supply-chain partners for AMD,' that 'AI demand is extremely high' so AMD is planning its long-term supply chain with partners, and that 'It is important to plan three to five years ahead with our partners.' The article concludes that AMD is negotiating for more memory supply and whether it will take the risk of adopting Samsung Foundry beyond niche programmable chips 'only time will tell.'
HBM4DDR5HBM memoryAMD, Samsung and 5 totalTom's HardwarePartnership/M&A
A study led by Chalmers University of Technology suggests that batteries capable of bypassing weak cells could keep electric vehicles on the road longer and lower the total cost over the battery's lifetime; under optimal conditions, lifespan increases by more than 20%. In the researchers' models, the most advanced solution – where each cell can be controlled separately – can extend lifespan by over 20% in some high-voltage vehicles, such as electric trucks and long-range electric cars, though in practice groups of cells are more likely to be controlled together, making that figure a theoretical upper limit. The researchers also modelled a typical 80 kWh car battery with an annual mileage of 12,000 kilometres: a conventional pack is assumed to be replaced after 10 years, in line with current industry practice, while the reconfigurable pack reached the same point after about 11 years, roughly 14 months later, and had a higher residual value because it had aged less. The extra electronics make the technology more expensive up front, but the researchers state that the longer service life and higher residual value can outweigh that additional cost under many realistic conditions; the potential is greatest in high-voltage, long-range vehicles with many series-connected cells. The approach could also affect battery manufacturing by reducing the need for precise cell matching and allowing more packs to get a second life, for example as stationary energy storage.
EV battery packsreconfigurable battery packsEvertiq
Renesas is sampling what it says is the industry's first 650-V GaN FET with dual-side cooling for high-density power conversion in 800-V HVDC AI data centers, part number TP65H020G4PLSGBD, with a 20-mΩ on-resistance that Renesas says is among the lowest in its class. Unlike conventional top-side-cooled packages, the device dissipates heat from both the top and bottom, lowering top-side thermal impedance by 10%; its 8×8-mm PQFN package reduces footprint by 57% compared with the 10×15-mm TOLT package. The D-mode FET is built on the Gen IV Plus GaN architecture for systems operating at up to 700 V, targeting the 800-V DC/DC intermediate-bus converter stage, which steps down to 48 V, 12 V, or 6 V, as well as the battery-backup and capacitor-bank stages of the sidecar power rack. The device can be driven with a standard silicon gate driver and is pin-to-pin compatible with E-mode GaN devices, and its higher 4-V typical threshold voltage provides improved noise immunity. Mass production of the TP65H020G4PLSGBD is planned for mid-2027 and therefore remains a plan, not achieved volume production.
Samsung Electronics reported a record 783% YoY operating profit surge to 107.4 trillion KRW in Q3 2026, driven by HBM4 demand and memory price gains. HBM bit shipments jumped nearly 50% QoQ, while DRAM prices rose amid tight supply. Bullish: Supply constraints and price uptrends are confirmed.
Toshiba Electronics Europe launched the IX800FXF2YMS4, a 3300V/800A SiC MOSFET module featuring third-generation technology and silver sintering. This product targets high-power applications including railway traction and UPS. The launch indicates Toshiba's product expansion but does not currently affect supply or pricing.
SiC MOSFET ModuleSilicon Carbide MOSFETToshiba Electronics EuropePower Electronics NewsProduct Launch
On October 7, 2026, the Global Electronics Association announced the August 2026 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program: the 3-month book-to-bill ratio stands at 1.39 and the 1-month book-to-bill at 1.33. Total North American EMS shipments in August 2026 were up 1.0% year-over-year, up 5.5% from the preceding month, and August's year-to-date shipments increased by 1.0% YoY. EMS bookings in August increased 53.5% year-over-year and were down 29.2% from the previous month, with August's YTD bookings up 15.5% versus the same period last year. The Association's chief economist, Dr. Shawn DuBravac, said EMS manufacturers are working to fulfill strong order flow that continues to outpace shipments and build a pipeline of future production, but tight availability of certain components and extended supplier lead times may be limiting how quickly some manufacturers can convert orders into deliveries, and securing the materials needed to fulfill those orders remains a challenge. The statistics are based on a representative sample of companies selling in the USA and Canada.
TDK expands the MLJ1608-G series multilayer inductors for automotive power-over-coax (PoC) circuits, with mass production starting in October 2026; the component provides 1.7 to 2 times higher impedance than conventional parts in the 100–700 MHz range, achieves high impedance up to 2 GHz, and has a 1608 footprint.