Nexperia launches 1200V SiC MOSFETs in top-side-cooled X.PAK packages
Nexperia has launched a range of 1200V SiC MOSFETs in a new top-side-cooled X.PAK surface-mount package measuring 14mm x 18.5mm. This packaging technology aims to combine SMD assembly benefits with improved thermal performance for industrial applications. Neutral: This is a standard product launch that expands options in the competitive SiC market but does not indicate an immediate shift in supply, demand, or pricing for existing components.
- Related manufacturers
- Nexperia
- Impact score
- 25 / 100, low impact