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Nexperia launches 1200V SiC MOSFETs in top-side-cooled X.PAK packages

What happened

Nexperia has launched a range of 1200V SiC MOSFETs in a new top-side-cooled X.PAK surface-mount package measuring 14mm x 18.5mm. This packaging technology aims to combine SMD assembly benefits with improved thermal performance for industrial applications. Neutral: This is a standard product launch that expands options in the competitive SiC market but does not indicate an immediate shift in supply, demand, or pricing for existing components.

Impact and signal

Low impactImpact score: 25/100

Affected components and suppliers

SiC MOSFET

Nexperia

product-launchpackagingSiC

Source and time

Source: Semiconductor Today · 3/19/2025 · View original source

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Nexperia launches 1200V SiC MOSFETs in top-side-cooled X.PAK packages

What happened

Impact and signal

Affected components and suppliers

Source and time

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