Taiwan's National Science and Technology Council (NSTC), on November 11, 2026, proposed expanding the list of national core key technologies from 42 to 46 items, with four additions covering satellite communications, AI chip substrates, drones, and biotechnology. The draft is still under public consultation and must be reviewed by a committee before the Executive Yuan can promulgate it.
The Korea Display Industry Association (KDIA) issued a statement on Nov. 6 welcoming the approval of the Advanced Display National Research Platform Project. The project passed the preliminary feasibility review at a meeting of the National Research and Development Project Evaluation Steering Committee on Nov. 5. The project has a total budget of 368.87 billion won, including 278.9 billion won in government funding, and will invest from 2027 to 2033 to establish research infrastructure capable of validating the entire display development process, from panel design and manufacturing to module integration, supporting open R&D infrastructure for resolutions of up to 10,000 pixels per inch (ppi) along with core technologies for next-generation displays. The government plans to establish an Advanced Display Research Institute through the project, where companies, universities and research organizations can jointly use equipment and research infrastructure. The KDIA said South Korea maintained its global leadership in the OLED market with a 68.7% share in 2025, but Chinese manufacturers are rapidly catching up in OLED and next-generation technologies. The project has only passed the preliminary feasibility review and remains in the planning stage; implementation has not begun.
According to Cheng-Wen Wu, Minister of Taiwan's National Science and Technology Council (NSTC), Taiwan is aggressively pursuing a core strategy of "Team Taiwan to Team Global," with an aim to train 60,000 IC specialists by 2030 (a target stated in the title, in plan form). Wu noted that when AI chips are manufactured in Taiwan, local tech companies are the first to understand their application scenarios and strengths, giving domestic industries a head start in integrating advanced AI into their own manufacturing processes. The talent-training goal is a plan; the source does not state the cause or implementation details.
The US Department of Commerce is leveraging federal funding and policy initiatives to bolster America's global competitiveness in quantum technology. Its core strategy centers on consolidating fragmented industry demand by backing shared manufacturing platforms through public subsidies and government equity stakes. The Trump administration maintains that developing the domestic quantum sector requires more than just algorithms, chip design, and system-level R&D—it also demands dedicated manufacturing infrastructure capable of serving diverse market players. As stated in the title, the US backs Anderon and GF quantum foundries, while Intel targets QPUs with the 18A process. The source provides no specific funding amounts, timelines, or confirmed disbursements.
Fujian Province announced a 15th Five-Year Plan targeting a RMB 300 billion output value for IC and optoelectronics clusters by 2030. The plan focuses on expanding capabilities in chip design, specialty processes, and optoelectronic components to support AI and high-end display markets. This policy signals long-term regional capacity expansion and government support for the semiconductor ecosystem.
The U.S. FCC announced immediate bans on new Chinese humanoid robots and connected power inverters, directly impacting Unitree and Sungrow. The restrictions aim to prevent China from dominating AI infrastructure supply chains, with non-Chinese suppliers expected to be exempt. Bearish for Chinese manufacturers; bullish for non-Chinese competitors.
Apple is lobbying the U.S. government to purchase cheaper memory chips from Chinese manufacturer CXMT to alleviate rising costs, despite CXMT being on the 1260H list. This move challenges the dominance of Micron, Samsung, and SK Hynix and could introduce significant pricing pressure in the DRAM market. The trade signal is bearish for Micron and SK Hynix pricing due to potential supply diversification.
Nvidia CEO Jensen Huang reaffirmed at the annual meeting that national security takes precedence over commercial interests and pledged full compliance with US export controls, positioning the company as a core pillar of America's AI industrial base.
The Munich Regional Court ruled that Innoscience's current GaN power devices do not infringe Infineon's German patents, confirming the U.S. ITC's findings and removing a potential supply disruption risk for Innoscience's core portfolio.
China's Supreme Court upheld an injunction banning Infineon from selling GaN power chips in mainland China due to patent infringement, impacting Nvidia's 800V AI-rack supply chain. This victory for Innoscience creates a supply constraint in China, likely driving up prices for GaN components.
The European Commission proposed the European Technological Sovereignty Package, including Chips Act 2.0 and the Cloud and AI Development Act. The Cloud and AI Act targets tripling Europe's data center capacity over the next 5-7 years, while Chips Act 2.0 focuses on building capacity for cutting-edge and AI-related chips. Bullish for AI and data center chip demand.
The U.S. FTC is investigating Arm Holdings for potential monopolization and restricting architecture access to rivals following the launch of its own AGI CPU. This regulatory scrutiny follows a failed lawsuit against Qualcomm and raises concerns about Arm's dual role as designer and manufacturer.
The probe introduces regulatory uncertainty that could impact Arm's licensing revenue and market dominance.
Innoscience won a patent lawsuit against Infineon, upholding the validity of its GaN-on-silicon core patents. The Beijing Intellectual Property Court rejected Infineon's invalidation requests. Watch: This legal victory strengthens Innoscience's competitive position in the GaN market.
Sanan Optoelectronics' $239M acquisition of Lumileds collapsed after CFIUS cited unresolved national security risks. The deal aimed to secure overseas LED production capacity, particularly in automotive and smartphone flash segments.
This highlights heightened regulatory risk for cross-border M&A in strategic tech sectors, potentially constraining Chinese firms' supply chain expansion.
US lawmakers propose the MATCH Act to restrict DUV immersion lithography and cryogenic etching tools to China within 150 days. This policy shift is projected to reduce ASML's China market share from 33% to 20% by 2026. Bullish for global equipment suppliers facing supply constraints.
Taiwan's Ministry of Justice proposes amendments to the National Security Act following a case involving a former TSMC SVP allegedly taking sub-2nm process data to Intel. The revisions aim to close legal loopholes regarding core national technology protection. Watch: This signals heightened regulatory scrutiny on cross-border talent and technology flows, potentially impacting supply chain dynamics and strategic partnerships.
NVIDIA is preparing a China-compliant version of its Groq AI inference chips, targeting a launch as early as May, while also resuming H200 production for China under new export licenses. This move aims to recapture share in China's competitive inference market, where local players like Baidu and Huawei have developed their own chips.
Potential demand increase for NVIDIA's China-specific chips; 利空: Intensifying competition may pressure pricing and margins.
The US withdrew a draft rule that would have required approval for exporting US-made AI chips to any global destination. This marks a reversal of a Trump-era strategy and follows last year's rollback of a Biden administration regulation. Watch: This reduces immediate regulatory overhang for chipmakers but maintains uncertainty as core export controls to specific countries remain.
Former TSMC SVP Wei-Jen Lo is under investigation for allegedly leaking sub-2nm process technology to Intel. Prosecutors and the NSTC confirmed the leaked technology constitutes national core key technology.
National security risk and IP leakage impact on supply chain trust.
European industry associations are urging OEMs to diversify PCB procurement away from Asia, citing strategic risks and IP leakage. The EU is planning regulations to exclude Chinese components, which could lead to allocation priorities favoring local suppliers. Watch: Potential for future supply constraints and cost increases for European electronics assembly if procurement shifts.
Whose chips are really inside the hottest new products? We open them up and show you, one part at a time.
| Analog | $0.61 | n/a |
|---|---|---|
| Connector | $0.93 | n/a |
| CPU | $496.58 | n/a |
| DDR4 | $8.22 | n/a |
| DDR5 | $10.44 | n/a |
| MCU | $1.67 | n/a |
| MLCC | $0.01 | n/a |
| MOSFET | $0.94 | n/a |
| PMIC | $0.52 | n/a |
| SSD/HDD | $279.61 | n/a |